TCAD_C1

Ciprian Ionescu

Capitolele de curs:Capitolele de curs:

1.Introducere n packagingulelectronic

2.Realizarea schemelorelectrice

3.Proiectarea structurii de interconectare

1.Introducere n packagingulelectronic

2.Realizarea schemelorelectrice

3.Proiectarea structurii de interconectare

LaboratorulB302 6 lucrari/min. 5 prezene

Prezen LAB 2p

1 Test la laborator 3p

Verificare final sesiune 5p

Bibliografie1. INTERNET: www.cetti.ro(Centrul de Electronic Tehnologic i Tehnici de Interconectare)

2. Help /Documentaie program Orcad

1.Introducere n packagingul electronic

Electronics packaging has become recognized as a critical technology for the continued growth of the nations electronics industry. 1

Prof. James E. Morris Head of Department of Electrical Engineering, Portland State University, Oregon, USA______________1 A Multidisciplinary Sophomore Course in Electronics Packaging, Proceedings ECTC, May 1998

Electronic PackagingThe engineering discipline that combines the engineering and manufacturing technologies required to convert an electrical circuit into a manufactured assembly. These include at least electrical, mechanical and material design and many functions such as engineering, manufacturing and quality control.

Editura: McGraw-Hill, Inc. New York & all, 1993, ISBN 0-07-026688-3

Electronic PackageThe electromechanical assembly resulting fromelectronic packaging design and manufacture. The level of an electronic package may range from theintegrated circuit package assembly to a printed wiring board assembly toa subsystem or system package assembly.

Notiuni introductive in ingineria microsistemelor

electronice

Scurta prezentare privind evoluia componentelor electronice pasive

Locul i rolul componentelor pasive n actuala etapa dezvoltrii microelectronicii;

Etapa actual de dezvoltare a electronicii este caracterizat de integrarea pe scar larg a funciilor electronice alturi de altele noi din domenii ca optoelectronic, mecanic, microfluidic, biologie, chimie. Numrul de tranzistoare echivalente a depit legea lui Moore, se vorbete de more thanMoore i beyond Moore.

n domeniile circuitelor integrate se trece la capsule tridimensionale, la utilizarea TSV (Through Silicon Via). Evoluia n domeniul packaging-ului este caracterizat de conceptul SIP System in Package,

Un nou domeniu este pe cale s se impun: electronica pe baz de polimeri:

Organics Electronics; Printed Electronics !!!!!!!!

Firme implicate n cercetare i dezvoltare n domeniul SOP

n domeniul componentelor pasive evoluia este orientat ctre:

Reducerea dimensiunilor,Creterea frecvenelor de lucru,Mrirea capacitii de dispare a puterii i a gamei de temperatur (cerine speciale pentru industria auto),mbuntirea stabilitii (cu temperatura i ali factori de mediu); creterea fiabilitii,Diversificarea produselor pentru a oferi componenta specific fiecrei aplicaii,Reducerea preului,Utilizarea componentelor pasive integrate,Dezvoltarea de noi componente LEC (Light Emmiting Capacitor), Supercondensatoare.

Evoluii n domeniul electronicii (sursa: J. C. Eloy, EMPC 2009, Rimini)

Evoluii n domeniul capsulelor 3D (sursa: J. C. Eloy, EMPC 2009, Rimini)

ELECTRONIC PRODUCT:ConsumerCommunicationAutomobileComputersInfrastructureMedical

ELECTRONIC PRODUCT:ConsumerCommunicationAutomobileComputersInfrastructureMedical

Building block technology of the information age

Semilogaritmic Moores plots of the Roadmap dataPorti / Chip

SEMICONDUCTOR ROADMAPSemiconductor Industry Association (SIA)

International Technology Roadmap for Semiconductors (ITRS)

SEMICONDUCTOR ROADMAPSemiconductor Industry Association (SIA)

International Technology Roadmap for Semiconductors (ITRS)

DRAMs, SRAMsMemory

Under-the-hood and other hostile environment productsHarsh Environment

>$3000: high-end workstations, servers, avionics, supercomputers

High Performance

Most Important IC Packaging ParametersMost Important IC Packaging Parameters

5000350020001500750500No. I/Os1.51.51.52.22.23.3Portable1.51.52.22.23.35Desktop

Power Supply Voltage (V)

444443Portable

40 -200

40 -120

40301510High Performance

Maximum Power (W/Die)1000700500320200132DRAM12501000800600400250Logic/Uniprocessor

Chip Size2.1B0.6B0.22B0.1B0.04B0.01BTransistors100M10M5M2M800k300kGates/chip0.070.120.180.250.350.5Feature Size (um)200720042001199819951992

Package lead pitch, frequency, power dissipation estimates and comparisonsPackage lead pitch, frequency, power dissipation estimates and comparisons

5 x 5 16 x 16 25 x 25 36 x 3620 64 100 14464 500 1600 3600

312 128 625 600 3.3 x 1.0 2.0 x 2.0 1.0 x 1.0 1.4 x 1.4

100 16 25 24

Chip Size (mm X mm)Chip Perimeter (mm)Number of I/OsChip Pad Pitch (um)Package Size (in. X in.)Package Lead Pitch(mils)

Top View Showing Chip To Package Connections

Plane View Showing package to Board Connections

DIP QFP CSP Flip ChipPackage


25 256 625 12962.0 0.5 0.25 0.12530k 300k 2M 10M

1.25k 200k 2M 16.4M5 80 320 1.28 GHz

0.5 7.5 30 120

Chip Area (mm X mm)Feature Size (um)Gates/ChipChip Area (70 x Feat. Size)Max. Frequency(MHz)Power Dissipation(W)





2.9 4.8 9.3 2.0

0.024 0.3 4.8 9.85 3.3 2.2 1.5

0.1 2.3 13.6 80 5.23 143 11.08 31.43

1.6 11.5 11.08 31.43

Chip Power Density (W / cm x cm)Package Power Density (W / cm x cm)Supply Voltage (V)Supply Current (A)Chip Supply Lead Current Density (A / mm x mm)Package Supply Lead Current Density (A / mm x mm)




Worldwide systems packaging market ($ billions)Printed Wiring Boards 30Flex Circuits 3.2Assembly Equipment 3.3Materials 9.9Connectors 23.4Optoelectronics Packaging 10RF Packaging 1.2Passive Components 25Thermal and Heat Skins 3TOTAL 109

Producia mondial de PCB pe regiuni n 2008 (milioane US dollars)

Sursa: World PCB Production & Laminate Market Report for the Year 2008, IPC, Association Connecting Electronics Industries

Sursa: World PCB Production & Laminate Market Report for the Year 2008, IPC, Association Connecting Electronics Industries

Producia mondial de PCB pe regiuni n 2008

Producia mondial de PCB n 2008

pe tipuri de substraturi

pentru diverse regiuni

Sursa: World PCB Production & Laminate Market

Report for the Year 2008,

IPC, Association Connecting Electronics Industries

Electronics in automotive

Vehicle environmental zone

Packaging hierarchy

Custom requirements

Economical Efficiency

Reliability

Mentenability

Technology

Testability

EcologyElectromagnetic

Compatibility

A summary analysis reveals that any electronic package must be approached by means of criteria shown in figure.

The presented image indicates a first set of criteria which aid at the realisation of an electronic package and highlights once again the multitude of aspects which must be taken into consideration during the product innovation.

ELECTRONIC PACKAGE

Universitatea Politehnica din Bucureti Centrul de Electronic Tehnologic i Tehnici de Interconectare

Entrepreneurial Skills

ELECTRONIC PACKAGE

Economical Efficiency

Mentenability

Testability

Custom requirements

Reliability

TechnologyA suggestive representation of the importance of these criteria in sustaining a product on the market is represented in figure.

The robustivity chain which hang an

electronic package


Ecological impactEntrepreneurial Skills

Signals, Circuits and Systems

Analog Integrated Circuits

Microprocessors Architecture

Digital IntegratedCircuits

Information Transmission Theory

SPICE

Fundamentals of Economical Theory Digital Signal Processing

Electronic Devices and Circuits

Mathematics

Electrotechnics

Passive Components and Circuits

Engineering Graphics

Physics

Programming

Materials Science

Foreign Language

CAD Design

Mechanic

Chemistry

Microwave

Interconnection Techniques in

ElectronicsNumerical MethodsElectric & Electronic

MeasurementsData Acquisition

Systems

Technology

Legislation

Electronic packaging oriented knowledge curriculum

ELECTRONIC PACKAGE

Reliability

CriteriiCriterii de de proiectareproiectare a a cablajelorcablajelorimprimateimprimate

Geometrice

Mecanice

Tehnolo

gice

Electric

e (IS) Testabilitate

Termice

46 / 37

Economice

The global electronic industry acts as the engine for science, technology, advanced manufacturing, and the overall economy of the countries that participate in it. 1

Prof. Rao Tumala, Packaging Research Center, Georgia Institute of Technology, Atlanta, Georgia, Past President of IEEE-CPMT Society____________________1 Fundamentals of Microsystems Packaging, McGraw-Hill, 2001

Componentepasive

Componentepasive

Diverse tipuri de componente pasive

Componente THTComponente SMDComponente SMD

Diverse componente pasiveDiverse componente pasive

Rezonatoare

Dispozitive opto-electronice

Rezistoareneliniare

Inductoare

Diverse tipuri de componente pasiveIntegrate

Rezistoare

Thick Film ChipThick Film Chip

Metal Film FixedMetal Film Fixed

Carbon Film FixedCarbon Film Fixed

Standard Miniature

Metal Oxide

Standard Miniature

Metal Oxide

Wire Woundsmall size

Wire Woundsmall size

Wire Woundminiature

Wire Woundminiature

Wire WoundNon Inductive

Wire WoundNon Inductive

Cement Wire WoundCement Wire Wound

Rezistor SMD

Reea rezistiv

Minimelf

THT

Condensator SMD

MCM

CADDOCK

2000

Rezistoarede precizie

pentrutensiune

nalt

( Precision High Voltage

Resistors )

Condensatoare

Film Capacitors

2001

Inductoare

Inductoare planare

Finite element modeling for Ansys simulation

Inductoareplanare

FR4

Inductoare planare

Inductoare planare

LTCC

Modalitati de livrare a

componentelorSMD

BOTTOM SIDE

TOP SIDE

=9mm

Conector

Poteniometre

Circuiteintegrate

Gaur deprindere

ButoaneComponente optoelectroniceComutator ON/OFF

Componentediscrete

Transformator

Structur de interconectare

Gaur deprindere

Gaur deprindere

STRUCTURA GENERAL A UNUI MODUL ELECTRONIC

Marcaje pentru tiere (frezare)

Trasee

Masc de inscripionare

(Silk mask)

Pastile

Mitre corner

Gaur de prindere

Nume PCB

Text cu cupru

Masc de lipire (Solder mask)

Gaur de trecere

Element mecanic de fixare pentru o component electronic

Plan de mas (alimentare) intern

Contururi de componente

STRUCTURA DE INTERCONECTARE ATAAT MODULULUI ELECTRONIC

Fluxul de proiectare automatizatProiectare schem

electric

Simulare schem electric

Plasare componente

Proiectare structur deinterconectare

Analiz EMC i aintegritii semnalelor

Analiz termic Postprocesri

Fabricaie

Testare

CAE

CAD

CAM

PSPICE SIMULATION

Analiza termicAnaliza termic

Analiza integritii semnalelor

CITS25

TXLINE

EMC ANALYSIS

CMOSTTL

EMC ANALYSIS

Simulare electromagnetic a structurilor PCB Simulare electromagnetic a structurilor PCB

Documents

TCAD_C1