Temperature Monitoring Robot

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    Temperature Monitoring Robot

    Abstract

    A robot is a mechanical or virtual artificial agent. In practice, it is usually an electro-

    mechanical system which, by its appearance or movements, conveys a sense that it

    has intent or agency of its own. The word robot can refer to both physical robots

    and virtual software agents, but the latter are usually referred to as Robots There is no consensus

    on which machines qualify as robots, but there is general agreement among experts and the

    public that robots tend to do some or all of the following: move around, operate a mechanical

    arm, sense and manipulate their environment, and exhibit intelligent behavior, especially

    behavior which mimics humans or animals.

    Micro controller controls the robot in this project. This robot can measure the temperature

    at various locations. IR sensors are placed at the front for the obstacle detection. LCD is used for

    display. L293d is used as a driver IC for controlling the DC Motors.

    This prototype project is basically helpful in places like where there is a necessary of

    measuring high temperatures like industries, power generators (coal mine), etc.,

    The project is built around the AVR micro controller from Atmel. This micro controller providesall the functionality of the display and wireless control.

    http://en.wikipedia.org/wiki/Machinehttp://en.wikipedia.org/wiki/Virtualhttp://en.wikipedia.org/wiki/Artificialhttp://en.wikipedia.org/wiki/Electromechanicshttp://en.wikipedia.org/wiki/Electromechanicshttp://en.wikipedia.org/wiki/Intentionhttp://en.wiktionary.org/wiki/agencyhttp://en.wikipedia.org/wiki/Virtualhttp://en.wikipedia.org/wiki/Software_agenthttp://en.wikipedia.org/wiki/Internet_bothttp://en.wikipedia.org/wiki/Internet_bothttp://en.wikipedia.org/wiki/Software_agenthttp://en.wikipedia.org/wiki/Virtualhttp://en.wiktionary.org/wiki/agencyhttp://en.wikipedia.org/wiki/Intentionhttp://en.wikipedia.org/wiki/Electromechanicshttp://en.wikipedia.org/wiki/Electromechanicshttp://en.wikipedia.org/wiki/Artificialhttp://en.wikipedia.org/wiki/Virtualhttp://en.wikipedia.org/wiki/Machine
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    Block Diagram:

    AVR

    MICRO

    CONTROLLER

    LCD

    L293D

    Battery

    Temperature

    Sensor

    ADC

    MOTOR1

    MOTOR2

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    Schematic Diagram:

    PB0/ICP114

    PB1/OC1A15

    PB2/SS/OC1B16

    PB3/MOSI/OC217

    PB4/MISO18

    PB5/SCK19

    PB6/TOSC1/XTAL19

    PB7/TOSC2/XTAL210

    PC6/RESET1

    PD0/RXD2

    PD1/TXD3

    PD2/INT04

    PD3/INT15

    PD4/T0/XCK6

    PD5/T111

    PD6/AIN012

    PD7/AIN113

    PC0/ADC023

    PC1/ADC124

    PC2/ADC225

    PC3/ADC326

    PC4/ADC4/SDA27

    PC5/ADC5/SCL28

    AREF21

    AVCC20

    U1

    ATMEGA8

    D7

    14

    D6

    13

    D5

    12

    D4

    11

    D3

    10

    D2

    9

    D1

    8

    D0

    7

    E

    6

    RW

    5

    RS

    4

    VSS

    1

    VDD

    2

    VEE

    3

    LCD1LM016L

    27.0

    3

    1

    VOUT2

    U2

    LM35

    IN12

    OUT13

    OUT26

    OUT311

    OUT414

    IN27

    IN310

    IN415

    EN11

    EN29

    VS

    8

    VSS

    16

    GND GND

    U3

    L293D

    +88.8

    +88.8

    IR RX IR TX

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    Atmega 8:

    Features:

    High-performance, Low-power AtmelAVR 8-bit Microcontroller

    Advanced RISC Architecture

    130 Powerful InstructionsMost Single-clock Cycle Execution

    32 8 General Purpose Working Registers

    Fully Static Operation

    Up to 16MIPS Throughput at 16MHz

    On-chip 2-cycle Multiplier

    High Endurance Non-volatile Memory segments

    8Kbytes of In-System Self-programmable Flash program memory

    512Bytes EEPROM

    1Kbyte Internal SRAM

    Write/Erase Cycles: 10,000 Flash/100,000 EEPROM

    Data retention: 20 years at 85C/100 years at 25C(1)

    Optional Boot Code Section with Independent Lock Bits

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    In-System Programming by On-chip Boot Program True Read-While-Write Operation

    Programming Lock for Software Security

    Peripheral Features

    Two 8-bit Timer/Counters with Separate Prescaler, one Compare Mode

    One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode

    Real Time Counter with Separate Oscillator

    Three PWM Channels

    8-channel ADC in TQFP and QFN/MLF package Eight Channels 10-bit Accuracy

    6-channel ADC in PDIP package

    Six Channels 10-bit Accuracy

    Byte-oriented Two-wire Serial Interface

    Programmable Serial USART

    Master/Slave SPI Serial Interface

    Programmable Watchdog Timer with Separate On-chip Oscillator

    On-chip Analog Comparator

    Special Microcontroller Features

    Power-on Reset and Programmable Brown-out Detection

    Internal Calibrated RC Oscillator

    External and Internal Interrupt Sources

    Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby

    I/O and Packages

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    23 Programmable I/O Lines

    28-lead PDIP, 32-lead TQFP, and 32-pad QFN/MLF

    Operating Voltages

    2.7V - 5.5V (ATmega8L)

    4.5V - 5.5V (ATmega8)

    Speed Grades

    0 - 8MHz (ATmega8L)

    0 - 16MHz (ATmega8)

    Power Consumption at 4Mhz, 3V, 25C

    Active: 3.6mA

    Idle Mode: 1.0mA

    Power-down Mode: 0.5A

    Pin Diagram:

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    Block Diagram:

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    Pin Descriptions:

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    VCC Digital supply voltage.

    GND Ground.

    Port B (PB7..PB0):

    XTAL1/XTAL2/TOSC1/TOSC2

    Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each

    bit). ThePort B output buffers have symmetrical drive characteristics with both high sink and

    source capability. As inputs, Port B pins that are externally pulled low will source current if the

    pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes

    active, even if the clock is not running.

    Depending on the clock selection fuse settings, PB6 can be used as input to the inverting

    Oscillator amplifier and input to the internal clock operating circuit.

    Depending on the clock selection fuse settings, PB7 can be used as output from the inverting

    Oscillator amplifier. If the Internal Calibrated RC Oscillator is used as chip clock source, PB7..6

    is used as TOSC2..1 input for the Asynchronous Timer/Counter2 if the AS2 bit in ASSR is set.

    The various special features of Port B are elaborated in Alternate Functions of Port B

    Port C (PC5..PC0)

    Port C is an 7-bit bi-directional I/O port with internal pull-up resistors (selected for each

    bit). The Port C output buffers have symmetrical drive characteristics with both high sink and

    source capability. As inputs, Port C pins that are externally pulled low will source current if the

    pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes

    active, even if the clock is not running.

    PC6/RESET

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    If the RSTDISBL Fuse is programmed, PC6 is used as an I/O pin. Note that the electrical

    characteristics of PC6 differ from those of the other pins of Port C. If the RSTDISBL Fuse is

    unprogrammed, PC6 is used as a Reset input. A low level on this pin

    for longer than the minimum pulse length will generate a Reset, even if the clock is not running.

    The minimum pulse length is given in Table 15 on page 38. Shorter pulses are not guaranteed to

    generate a Reset.

    Port D (PD7..PD0)

    Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each

    bit). The Port D output buffers have symmetrical drive characteristics with both high sink and

    source capability. As inputs, Port D pins that are externally pulled low will source current if the

    pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes

    active, even if the clock is not running.

    RESET

    Reset input. A low level on this pin for longer than the minimum pulse length will

    generate a reset, even if the clock is not running. Shorter pulses are not guaranteed to generate a

    reset.

    AVCC

    AVCC is the supply voltage pin for the A/D Converter, Port C (3..0), and ADC (7..6). It

    should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it

    should be connected to VCC through a low-pass filter. Note that Port C (5..4) use digital supply

    voltage, VCC.

    AREF AREF is the analog reference pin for the A/D Converter.

    ADC7..6 (TQFP and QFN/MLF Package Only)

    In the TQFP and QFN/MLF package, ADC7..6 serve as analog inputs to the A/D

    converter. These pins are powered from the analog supply and serve as 10-bit ADC channels.

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    AVR Atmega 8 Memories:

    In-System Reprogrammable Flash Program Memory

    The ATmega8 contains 8Kbytes On-chip In-System Reprogrammable Flash memory forprogram storage. Since all AVR instructions are 16-bits or 32-bits wide, the Flash is organized as

    4K 16 bits. For software security, the Flash Program memory space is divided into two

    sections, Boot Program section and Application Program section. The Flash memory has an

    endurance of at least 10,000 write/erase cycles. The ATmega8 Program Counter (PC) is 12 bits

    wide, thus addressing the 4K Program memory locations. Constant tables can be allocated within

    the entire Program memory address space.

    SRAM Data Memory

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    The lower 1120 Data memory locations address the Register File, the I/O Memory, and

    the internal data SRAM. The first 96 locations address the Register File and I/O Memory, and

    the next 1024 locations address the internal data SRAM. The five different addressing modes for

    the Data memory cover: Direct, Indirect with Displacement, Indirect, Indirect with Pre-

    decrement, and Indirect with Post-increment. In the Register File, registers R26 to R31 feature

    the indirect addressing pointer registers. The direct addressing reaches the entire data space. The

    Indirect with Displacement mode reaches 63 address locations from the base address given by

    the Y-register or Z-register. When using register indirect addressing modes with automatic pre-

    decrement and post-increment, the address registers X, Y and Z are decremented or incremented.

    The 32 general purpose working registers, 64 I/O Registers, and the 1024 bytes of internal data

    SRAM in the ATmega8 are all accessible through all these addressing modes.

    Data Memory Access Times

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    This section describes the general access timing concepts for internal memory access.

    EEPROM Data Memory

    The ATmega8 contains 512bytes of data EEPROM memory. It is organized as a separate

    data space, in which single bytes can be read and written. The EEPROM has an endurance of at

    least 100,000 write/erase cycles. The access between the EEPROM and the CPU is described

    below, specifying the EEPROM Address Registers, the EEPROM Data Register, and the

    EEPROM Control Register.

    EEPROM Read/Write Access

    The EEPROM Access Registers are accessible in the I/O space. A self-timing function,

    however, lets the user software detect when the next byte can be written. If the user code

    contains instructions that write the EEPROM, some precautions must be taken. In heavily

    filtered power supplies, VCC is likely to rise or fall slowly on Power-up/down. This causes the

    device for some period of time to run at a voltage lower than specified as minimum for the clock

    frequency used. In order to prevent unintentional EEPROM writes, a specific write procedure

    must be followed. When the EEPROM is read, the CPU is halted for four clock cycles before the

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    next instruction is executed. When the EEPROM is written, the CPU is halted for two clock

    cycles before the next instruction is executed.

    The EEPROM Address RegisterEEARH and EEARL

    Bits 15..9Res: Reserved Bits

    These bits are reserved bits in the ATmega8 and will always read as zero.

    Bits 8..0 EEAR8..0: EEPROM Address

    The EEPROM Address Registers EEARH and EEARLspecify the EEPROM address in the

    512bytes EEPROM space. The EEPROM data bytes are addressed linearly between 0 and 511.

    The initial value of EEAR is undefined. A proper value must be written before the EEPROM

    may be accessed.

    The EEPROM Data RegisterEEDR

    Bits 7..0EEDR7..0: EEPROM Data

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    For the EEPROM write operation, the EEDR Register contains the data to be written to

    the EEPROM in the address given by the EEAR Register. For the EEPROM read operation, the

    EEDR contains the data read out from the EEPROM at the address given by EEAR.

    The EEPROM Control RegisterEECR

    Bits 7..4 Res: Reserved Bits

    These bits are reserved bits in the AtmelAVR ATmega8 and will always read as zero.

    Bit 3 EERIE: EEPROM Ready Interrupt Enable

    Writing EERIE to one enables the EEPROM Ready Interrupt if the I bit in SREG is set. Writing

    EERIE to zero disables the interrupt. The EEPROM Ready interrupt generates a constant

    interrupt when EEWE is cleared.

    Bit 2 EEMWE: EEPROM Master Write Enable

    The EEMWE bit determines whether setting EEWE to one causes the EEPROM to be written.

    When EEMWE is set, setting EEWE within four clock cycles will write data to the EEPROM at

    the selected address If EEMWE is zero, setting EEWE will have no effect. When EEMWE has

    been written to one by software, hardware clears the bit to zero after four clock cycles.

    Bit 1 EEWE: EEPROM Write Enable

    The EEPROM Write Enable Signal EEWE is the write strobe to the EEPROM. When address and data

    are correctly set up, the EEWE bit must be written to one to write the value into the EEPROM. The

    EEMWE bit must be written to one before a logical one is written to EEWE, oth- erwise no EEPROM

    write takes place. The following procedure should be followed when writing the EEPROM

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    1. Wait until EEWE becomes zero

    2. Wait until SPMEN in SPMCR becomes zero

    3. Write new EEPROM address to EEAR (optional)

    4. Write new EEPROM data to EEDR (optional)

    5. Write a logical one to the EEMWE bit while writing a zero to EEWE in EECR

    6. Within four clock cycles after setting EEMWE, write a logical one to EEWE

    The EEPROM can not be programmed during a CPU write to the Flash memory. The

    software must check that the Flash programming is completed before initiating a new EEPROM

    write.

    Step 2 is only relevant if the software contains a boot loader allowing the CPU to

    program the Flash. If the Flash is never being updated by the CPU, step 2 can be omitted. See

    Boot Loader Support Read-While-Write Self-Programming on page 202 for details about

    boot programming.

    Caution: An interrupt between step 5 and step 6 will make the write cycle fail, since the

    EEPROM Master Write Enable will time-out. If an interrupt routine accessing the EEPROM is

    interrupting another EEPROM access, the EEAR or EEDR Register will be modified, causing

    the interrupted EEPROM access to fail. It is recommended to have the Global Interrupt Flag

    cleared during all the steps to avoid these problems.

    When the write access time has elapsed, the EEWE bit is cleared by hardware. The user

    software can poll this bit and wait for a zero before writing the next byte. When EEWE has been

    set, the CPU is halted for two cycles before the next instruction is executed.

    Bit 0 EERE: EEPROM Read Enable

    The EEPROM Read Enable Signal EERE is the read strobe to the EEPROM. When the

    correct address is set up in the EEAR Register, the EERE bit must be written to a logic one to

    trigger the EEPROM read. The EEPROM read access takes one instruction, and the requested

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    data is available immediately. When the EEPROM is read, the CPU is halted for four cycles

    before the next instruction is executed.

    The user should poll the EEWE bit before starting the read operation. If a write operation

    is in progress, it is neither possible to read the EEPROM, nor to change the EEAR Register.

    Crystal Oscillator

    XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which

    can be configured for use as an On-chip Oscillator. Either a quartz crystal or a ceramic resonator

    may be used. The CKOPT Fuse selects between two different Oscillator amplifier modes. When

    CKOPT is programmed, the Oscillator output will oscillate a full rail-torail swing on the output.

    This mode is suitable when operating in a very noisy environment or when the output from

    XTAL2 drives a second clock buffer. This mode has a wide frequency range. When CKOPT is

    unprogrammed, the Oscillator has a smaller output swing. This reduces power consumption

    considerably. This mode has a limited frequency range and it cannot be used to drive other clock

    buffers.

    For resonators, the maximum frequency is 8MHz with CKOPT unprogrammed and

    16MHz with CKOPT programmed. C1 and C2 should always be equal for both crystals and

    resonators. The optimal value of the capacitors depends on the crystal or resonator in use, theamount of stray capacitance, and the electromagnetic noise of the environment. Some initial

    guidelines for choosing capacitors for use with crystals are given in Table 4. For ceramic

    resonators, the capacitor values given by the manufacturer should be used.

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    Timer/Counter Oscillator

    For AVR microcontrollers with Timer/Counter Oscillator pins (TOSC1 and TOSC2), the

    crystal is connected directly between the pins. By programming the CKOPT Fuse, the user can

    enable internal capacitors on XTAL1 and XTAL2, thereby removing the need for external

    capacitors. The Oscillator is optimized for use with a 32.768kHz watch crystal. Applying an

    external clock source to TOSC1 is not recommended.

    System Control and Reset

    Resetting the AVR During Reset, all I/O Registers are set to their initial values, and the program

    starts execution from the Reset Vector. If the program never enables an interrupt source, the

    Interrupt Vectors are not used, and regular program code can be placed at these locations. This isalso the case if the Reset Vector is in the Application section while the Interrupt Vectors are in

    the boot section or vice versa.

    The I/O ports of the AVR are immediately reset to their initial state when a reset source

    goes active. This does not require any clock source to be running. After all reset sources have

    gone inactive, a delay counter is invoked, stretching the internal reset. This allows the power to

    reach a stable level before normal operation starts. The time-out period of the delay counter is

    defined by the user through the CKSEL Fuses.

    Reset Sources

    The ATmega8 has four sources of Reset:

    Power-on Reset. The MCU is reset when the supply voltage is below the Power-on Reset

    threshold (VPOT)

    External Reset. The MCU is reset when a low level is present on the RESET pin for longer than

    the minimum pulse length

    Watchdog Reset. The MCU is reset when the Watchdog Timer period expires and the

    Watchdog is enabled

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    Brown-out Reset. The MCU is reset when the supply voltage VCC is below the Brown-out

    Reset threshold (VBOT) and the Brown-out Detector is enabled

    Watchdog Timer

    The Watchdog Timer is clocked from a separate On-chip Oscillator which runs at 1MHz.

    This isthe typical value at VCC = 5V. See characterization data for typical values at other VCC

    levels. By controlling the Watchdog Timer prescaler, the Watchdog Reset interval can be

    adjusted as shown in Table 17 on page 44. The WDR Watchdog Resetinstruction resets the

    Watchdog Timer. The Watchdog Timer is also reset when it is disabled and when a Chip Reset

    occurs.

    Eight different clock cycle periods can be selected to determine the reset period. If the reset

    period expires without another Watchdog Reset, the ATmega8 resets and executes from the

    Reset Vector. To prevent unintentional disabling of the Watchdog, a special turn-off sequence

    must be followed when the Watchdog is disabled.

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    Interrupt Vectors in ATmega8

    VOLTAGE REGULATOR 7805:

    Features:

    Output Current up to 1A.

    Output Voltages of 5, 6, 8, 9, 10, 12, 15, 18, 24V.

    Thermal Overload Protection.

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    Short Circuit Protection.

    Output Transistor Safe Operating Area Protection.

    Description:

    The LM78XX/LM78XXA series of three-terminal positive regulators are available in the

    TO-220/D-PAK package and with several fixed output voltages, making them useful in a Wide

    range of applications. Each type employs internal current limiting, thermal shutdown and safe

    operating area protection, making it essentially indestructible. If adequate heat sinking is

    provided, they can deliver over 1A output Current. Although designed primarily as fixed voltage

    regulators, these devices can be used with external components to obtain adjustable voltages and

    currents.

    Internal Block Diagram

    FIG: BLOCK DIAGRAM OF VOLTAGE REGULATOR

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    Absolute Maximum Ratings:

    TABLE: RATINGS OF THE VOLTAGE REGULATOR

    Typical Performance Characteristics:

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    FIG: PERFORMANCE CHARACTERISTICS OF REGULATOR

    CAPACITORS:

    A capacitor or condenser is a passive electronic component consisting of a pair of

    conductors separated by a dielectric. When a voltage potential difference exists between the

    conductors, an electric field is present in the dielectric. This field stores energy and produces a

    mechanical force between the plates. The effect is greatest between wide, flat, parallel, narrowly

    separated conductors.

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    An ideal capacitor is characterized by a single constant value, capacitance, which is

    measured in farads. This is the ratio of the electric charge on each conductor to the potential

    difference between them. In practice, the dielectric between the plates passes a small amount of

    leakage current. The conductors and leads introduce an equivalent series resistance and the

    dielectric has an electric field strength limit resulting in a breakdown voltage.

    The properties of capacitors in a circuit may determine the resonant frequency and

    quality factor of a resonant circuit, power dissipation and operating frequency in a digital logic

    circuit, energy capacity in a high-power system, and many other important aspects.

    A capacitor (formerly known as condenser) is a device for storing electric charge. The forms of

    practical capacitors vary widely, but all contain at least two conductors separated by a non-

    conductor. Capacitors used as parts of electrical systems, for example, consist of metal foils

    separated by a layer of insulating film.

    Capacitors are widely used in electronic circuits for blocking direct current while

    allowing alternating current to pass, in filter networks, for smoothing the output of power

    supplies, in the resonant circuits that tune radios to particular frequencies and for many other

    purposes.

    http://en.wikipedia.org/wiki/Direct_currenthttp://en.wikipedia.org/wiki/Alternating_currenthttp://en.wikipedia.org/wiki/Power_supplyhttp://en.wikipedia.org/wiki/Power_supplyhttp://en.wikipedia.org/wiki/LC_circuithttp://en.wikipedia.org/wiki/Frequencyhttp://en.wikipedia.org/wiki/Frequencyhttp://en.wikipedia.org/wiki/LC_circuithttp://en.wikipedia.org/wiki/Power_supplyhttp://en.wikipedia.org/wiki/Power_supplyhttp://en.wikipedia.org/wiki/Alternating_currenthttp://en.wikipedia.org/wiki/Direct_current
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    A capacitor is a passive electronic component consisting of a pair ofconductors separated

    by a dielectric (insulator). When there is a potential difference (voltage) across the conductors, a

    static electric field develops in the dielectric that stores energy and produces a mechanical force

    between the conductors. An ideal capacitor is characterized by a single constant value,

    capacitance, measured in farads. This is the ratio of the electric charge on each conductor to the

    potential difference between them.

    The capacitance is greatest when there is a narrow separation between large areas of

    conductor, hence capacitor conductors are often called "plates", referring to an early means of

    construction. In practice the dielectric between the plates passes a small amount of leakage

    current and also has an electric field strength limit, resulting in a breakdown voltage, while the

    conductors and leads introduce an undesired inductance and resistance.

    History:

    Battery of four Leyden jars in Museum Boerhaave, Leiden, the Netherlands

    In October 1745, Ewald Georg von Kleist ofPomerania in Germany found that charge

    could be stored by connecting a high voltage electrostatic generator by a wire to a volume of

    water in a hand-held glass jar. Von Kleist's hand and the water acted as conductors and the jar as

    a dielectric (although details of the mechanism were incorrectly identified at the time). Von

    Kleist found, after removing the generator, that touching the wire resulted in a painful spark. In a

    letter describing the experiment, he said "I would not take a second shock for the kingdom of

    http://en.wikipedia.org/wiki/Passivity_%28engineering%29http://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Dielectrichttp://en.wikipedia.org/wiki/Potential_differencehttp://en.wikipedia.org/wiki/Electric_fieldhttp://en.wikipedia.org/wiki/Energyhttp://en.wikipedia.org/wiki/Capacitancehttp://en.wikipedia.org/wiki/Faradhttp://en.wikipedia.org/wiki/Electric_chargehttp://en.wikipedia.org/wiki/Leakage_%28electronics%29http://en.wikipedia.org/wiki/Leakage_%28electronics%29http://en.wikipedia.org/wiki/Breakdown_voltagehttp://en.wikipedia.org/wiki/Lead_%28electronics%29http://en.wikipedia.org/wiki/Equivalent_series_inductancehttp://en.wikipedia.org/wiki/Equivalent_series_resistancehttp://en.wikipedia.org/wiki/Leyden_jarhttp://en.wikipedia.org/wiki/Museum_Boerhaavehttp://en.wikipedia.org/wiki/Leidenhttp://en.wikipedia.org/wiki/Netherlandshttp://en.wikipedia.org/wiki/Ewald_Georg_von_Kleisthttp://en.wikipedia.org/wiki/Pomeraniahttp://en.wikipedia.org/wiki/Electrostatic_generatorhttp://en.wikipedia.org/wiki/File:Leidse_flessen_Museum_Boerhave_december_2003_2.jpghttp://en.wikipedia.org/wiki/Electrostatic_generatorhttp://en.wikipedia.org/wiki/Pomeraniahttp://en.wikipedia.org/wiki/Ewald_Georg_von_Kleisthttp://en.wikipedia.org/wiki/Netherlandshttp://en.wikipedia.org/wiki/Leidenhttp://en.wikipedia.org/wiki/Museum_Boerhaavehttp://en.wikipedia.org/wiki/Leyden_jarhttp://en.wikipedia.org/wiki/Equivalent_series_resistancehttp://en.wikipedia.org/wiki/Equivalent_series_inductancehttp://en.wikipedia.org/wiki/Lead_%28electronics%29http://en.wikipedia.org/wiki/Breakdown_voltagehttp://en.wikipedia.org/wiki/Leakage_%28electronics%29http://en.wikipedia.org/wiki/Leakage_%28electronics%29http://en.wikipedia.org/wiki/Electric_chargehttp://en.wikipedia.org/wiki/Faradhttp://en.wikipedia.org/wiki/Capacitancehttp://en.wikipedia.org/wiki/Energyhttp://en.wikipedia.org/wiki/Electric_fieldhttp://en.wikipedia.org/wiki/Potential_differencehttp://en.wikipedia.org/wiki/Dielectrichttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Passivity_%28engineering%29
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    France." The following year, the Dutch physicist Pieter van Musschenbroek invented a similar

    capacitor, which was named the Leyden jar, after the University of Leiden where he worked.

    Daniel Gralath was the first to combine several jars in parallel into a "battery" to increase the

    charge storage capacity. Benjamin Franklin investigated the Leyden jar and "proved" that the

    charge was stored on the glass, not in the water as others had assumed. He also adopted the term

    "battery", (denoting the increasing of power with a row of similar units as in a battery of

    cannon), subsequently applied to clusters of electrochemical cells. Leyden jars were later made

    by coating the inside and outside of jars with metal foil, leaving a space at the mouth to prevent

    arcing between the foils. The earliest unit of capacitance was the 'jar', equivalent to about 1

    nanofarad.

    Leyden jars or more powerful devices employing flat glass plates alternating with foil conductors

    were used exclusively up until about 1900, when the invention of wireless (radio) created a

    demand for standard capacitors, and the steady move to higher frequencies required capacitors

    with lower inductance. A more compact construction began to be used of a flexible dielectric

    sheet such as oiled paper sandwiched between sheets of metal foil, rolled or folded into a small

    package.

    Early capacitors were also known as condensers, a term that is still occasionally used today. The

    term was first used for this purpose by Alessandro Volta in 1782, with reference to the device's

    ability to store a higher density of electric charge than a normal isolated conductor.

    Theory of operation:

    Main article: Capacitance

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    Charge separation in a parallel-plate capacitor causes an internal electric field. A dielectric

    (orange) reduces the field and increases the capacitance.

    A simple demonstration of a parallel-plate capacitor

    A capacitor consists of two conductors separated by a non-conductive region The non-

    conductive region is called the dielectric or sometimes the dielectric medium. In simpler terms,

    the dielectric is just an electrical insulator. Examples of dielectric mediums are glass, air, paper,

    vacuum, and even a semiconductor depletion region chemically identical to the conductors. A

    capacitor is assumed to be self-contained and isolated, with no net electric charge and no

    influence from any external electric field. The conductors thus hold equal and opposite charges

    on their facing surfaces, and the dielectric develops an electric field. In SI units, a capacitance of

    one farad means that one coulomb of charge on each conductor causes a voltage of one voltacross the device. The capacitor is a reasonably general model for electric fields within electric

    circuits. An ideal capacitor is wholly characterized by a constant capacitance C, defined as the

    ratio of charge Q on each conductor to the voltage V between them:

    Sometimes charge build-up affects the capacitor mechanically, causing its capacitance to vary. In

    this case, capacitance is defined in terms of incremental changes:

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    Energy storage:

    Work must be done by an external influence to "move" charge between the conductors in a

    capacitor. When the external influence is removed the charge separation persists in the electric

    field and energy is stored to be released when the charge is allowed to return to its equilibrium

    position. The work done in establishing the electric field, and hence the amount of energy stored,

    is given by:[11]

    Current-voltage relation

    The current i(t) through any component in an electric circuit is defined as the rate of flow of a

    charge q(t) passing through it, but actual charges, electrons, cannot pass through the dielectric

    layer of a capacitor, rather an electron accumulates on the negative plate for each one that leaves

    the positive plate, resulting in an electron depletion and consequent positive charge on one

    electrode that is equal and opposite to the accumulated negative charge on the other. Thus the

    charge on the electrodes is equal to the integral of the current as well as proportional to the

    voltage as discussed above. As with any antiderivative, a constant of integration is added to

    represent the initial voltage v (t0). This is the integral form of the capacitor equation,

    .

    Taking the derivative of this, and multiplying by C, yields the derivative form,

    .

    The dual of the capacitor is the inductor, which stores energy in the magnetic field rather than the

    electric field. Its current-voltage relation is obtained by exchanging current and voltage in the

    capacitor equations and replacing C with the inductance L.

    DC circuits

    See also: RC circuit

    http://en.wikipedia.org/wiki/Work_%28thermodynamics%29http://en.wikipedia.org/wiki/Equilibriumhttp://en.wikipedia.org/wiki/Capacitor#cite_note-10http://en.wikipedia.org/wiki/Capacitor#cite_note-10http://en.wikipedia.org/wiki/Capacitor#cite_note-10http://en.wikipedia.org/wiki/Integralhttp://en.wikipedia.org/wiki/Antiderivativehttp://en.wikipedia.org/wiki/Constant_of_integrationhttp://en.wikipedia.org/wiki/Duality_%28electrical_circuits%29http://en.wikipedia.org/wiki/Inductorhttp://en.wikipedia.org/wiki/Magnetic_fieldhttp://en.wikipedia.org/wiki/RC_circuithttp://en.wikipedia.org/wiki/RC_circuithttp://en.wikipedia.org/wiki/Magnetic_fieldhttp://en.wikipedia.org/wiki/Inductorhttp://en.wikipedia.org/wiki/Duality_%28electrical_circuits%29http://en.wikipedia.org/wiki/Constant_of_integrationhttp://en.wikipedia.org/wiki/Antiderivativehttp://en.wikipedia.org/wiki/Integralhttp://en.wikipedia.org/wiki/Capacitor#cite_note-10http://en.wikipedia.org/wiki/Equilibriumhttp://en.wikipedia.org/wiki/Work_%28thermodynamics%29
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    A simple resistor-capacitor circuit demonstrates charging of a capacitor.

    A series circuit containing only a resistor, a capacitor, a switch and a constant DC source of

    voltage V0 is known as a charging circuit. If the capacitor is initially uncharged while the switch

    is open, and the switch is closed at t = 0, it follows from Kirchhoff's voltage law that

    Taking the derivative and multiplying by C, gives a first-order differential equation,

    At t = 0, the voltage across the capacitor is zero and the voltage across the resistor is V 0. The

    initial current is then i (0) =V0 /R. With this assumption, the differential equation yields

    where 0 = RC is the time constant of the system.

    As the capacitor reaches equilibrium with the source voltage, the voltage across the resistor and

    the current through the entire circuit decay exponentially. The case of discharging a charged

    capacitor likewise demonstrates exponential decay, but with the initial capacitor voltage

    replacing V0 and the final voltage being zero.

    AC circuits:

    Impedance, the vector sum of reactance and resistance, describes the phase difference and the

    ratio of amplitudes between sinusoidally varying voltage and sinusoidally varying current at a

    given frequency. Fourier analysis allows any signal to be constructed from a spectrum of

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    frequencies, whence the circuit's reaction to the various frequencies may be found. The reactance

    and impedance of a capacitor are respectively

    where j is the imaginary unit and is the angular velocity of the sinusoidal signal. The - j phase

    indicates that the AC voltage V = Z I lags the AC current by 90: the positive current phase

    corresponds to increasing voltage as the capacitor charges; zero current corresponds to

    instantaneous constant voltage, etc.

    Note that impedance decreases with increasing capacitance and increasing frequency. This

    implies that a higher-frequency signal or a larger capacitor results in a lower voltage amplitude

    per current amplitudean AC "short circuit" or AC coupling. Conversely, for very low

    frequencies, the reactance will be high, so that a capacitor is nearly an open circuit in AC

    analysisthose frequencies have been "filtered out".

    Capacitors are different from resistors and inductors in that the impedance is inversely

    proportional to the defining characteristic, i.e. capacitance.

    Parallel plate model:

    Dielectric is placed between two conducting plates, each of area A and with a separation of d.

    The simplest capacitor consists of two parallel conductive plates separated by a dielectric with

    permittivity (such as air). The model may also be used to make qualitative predictions for other

    device geometries. The plates are considered to extend uniformly over an area A and a charge

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    density = Q/A exists on their surface. Assuming that the width of the plates is much greater

    than their separation d, the electric field near the centre of the device will be uniform with the

    magnitude E = /. The voltage is defined as the line integral of the electric field between the

    plates

    Solving this for C = Q/V reveals that capacitance increases with area and decreases with

    separation

    .

    The capacitance is therefore greatest in devices made from materials with a high permittivity.

    Several capacitors in parallel.

    Networks:See also: Series and parallel circuits

    For capacitors in parallel

    Capacitors in a parallel configuration each have the same applied voltage. Their

    capacitances add up. Charge is apportioned among them by size. Using the schematic

    diagram to visualize parallel plates, it is apparent that each capacitor contributes to the

    total surface area.

    For capacitors in series

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    Several capacitors in series.

    Connected in series, the schematic diagram reveals that the separation distance, not the plate

    area, adds up. The capacitors each store instantaneous charge build-up equal to that of every

    other capacitor in the series. The total voltage difference from end to end is apportioned to each

    capacitor according to the inverse of its capacitance. The entire series acts as a capacitor smaller

    than any of its components.

    Capacitors are combined in series to achieve a higher working voltage, for example for

    smoothing a high voltage power supply. The voltage ratings, which are based on plate

    separation, add up. In such an application, several series connections may in turn be connected in

    parallel, forming a matrix. The goal is to maximize the energy storage utility of each capacitor

    without overloading it.

    Series connection is also used to adapt electrolytic capacitors for AC use.

    Non-ideal behaviour:

    Capacitors deviate from the ideal capacitor equation in a number of ways. Some of these, such as

    leakage current and parasitic effects are linear, or can be assumed to be linear, and can be dealt

    with by adding virtual components to the equivalent circuit of the capacitor. The usual methods

    ofnetwork analysis can then be applied. In other cases, such as with breakdown voltage, theeffect is non-linear and normal (i.e., linear) network analysis cannot be used, the effect must be

    dealt with separately. There is yet another group, which may be linear but invalidate the

    assumption in the analysis that capacitance is a constant. Such an example is temperature

    dependence.

    Breakdown voltage:

    Above a particular electric field, known as the dielectric strength Eds, the dielectric in a capacitor

    becomes conductive. The voltage at which this occurs is called the breakdown voltage of the

    device, and is given by the product of the dielectric strength and the separation between the

    conductors,

    Vbd = Edsd

    The maximum energy that can be stored safely in a capacitor is limited by the breakdown

    voltage. Due to the scaling of capacitance and breakdown voltage with dielectric thickness, all

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    capacitors made with a particular dielectric have approximately equal maximum energy density,

    to the extent that the dielectric dominates their volume.

    For air dielectric capacitors the breakdown field strength is of the order 2 to 5 MV/m; for mica

    the breakdown is 100 to 300 MV/m, for oil 15 to 25 MV/m, and can be much less when other

    materials are used for the dielectric. The dielectric is used in very thin layers and so absolute

    breakdown voltage of capacitors is limited. Typical ratings for capacitors used for general

    electronics applications range from a few volts to 100V or so. As the voltage increases, the

    dielectric must be thicker, making high-voltage capacitors larger than those rated for lower

    voltages. The breakdown voltage is critically affected by factors such as the geometry of the

    capacitor conductive parts; sharp edges or points increase the electric field strength at that point

    and can lead to a local breakdown. Once this starts to happen, the breakdown will quickly "track"

    through the dielectric till it reaches the opposite plate and cause a short circuit.

    The usual breakdown route is that the field strength becomes large enough to pull electrons in the

    dielectric from their atoms thus causing conduction. Other scenarios are possible, such as

    impurities in the dielectric, and, if the dielectric is of a crystalline nature, imperfections in the

    crystal structure can result in an avalanche breakdown as seen in semi-conductor devices.

    Breakdown voltage is also affected by pressure, humidity and temperature.

    Equivalent circuit

    Two different circuit models of a real capacitor

    An ideal capacitor only stores and releases electrical energy, without dissipating any. In reality,

    all capacitors have imperfections within the capacitor's material that create resistance. This is

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    specified as the equivalent series resistance or ESR of a component. This adds a real component

    to the impedance:

    As frequency approaches infinity, the capacitive impedance (or reactance) approaches zero and

    the ESR becomes significant. As the reactance becomes negligible, power dissipation approaches

    PRMS = VRMS /RESR.

    Similarly to ESR, the capacitor's leads add equivalent series inductance or ESL to the

    component. This is usually significant only at relatively high frequencies. As inductive reactance

    is positive and increases with frequency, above a certain frequency capacitance will be canceled

    by inductance. High-frequency engineering involves accounting for the inductance of all

    connections and components.

    If the conductors are separated by a material with a small conductivity rather than a perfect

    dielectric, then a small leakage current flows directly between them. The capacitor therefore has

    a finite parallel resistance, and slowly discharges over time (time may vary greatly depending on

    the capacitor material and quality).

    L293D:

    Features:

    Featuring Unitrode L293 and L293D Products Now From Texas Instruments Wide Supply-Voltage Range: 4.5 V to 36 V Separate Input-Logic Supply Internal ESD Protection Thermal Shutdown High-Noise-Immunity Inputs Functional Replacements for SGS L293 and SGS L293D Output Current 1 A Per Channel (600 mA for L293D) Peak Output Current 2 A Per Channel

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    (1.2 A for L293D) Output Clamp Diodes for Inductive Transient Suppression (L293D)

    Pin Diagram:

    Description:

    The L293 and L293D are quadruple high-current half-H drivers. The L293 is designed to

    provide bidirectional drive currents of up to 1 A at voltage from 4.5 V to 36 V. The L293D is

    designed to provide bidirectional drive currents of up to 600-mA at voltages from 4.5 V to 36 V.

    Both devices are designed to drive inductive loads such as relays, solenoids, dc and bipolar

    stepping motors, as well as other high-current/high-voltage loads in positive-supply applications.

    All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a

    Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with

    drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is

    high, the associated drivers are enabled and their outputs are active and in phase with their

    inputs. When the enable input is low, those drivers are disabled and their outputs are off and in

    the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or

    bridge) reversible drive suitable for solenoid or motor applications. On the L293, external high-

    speed output clamp diodes should be used for inductive transient suppression. A VCC1 terminal,

    separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The

    L293and L293D are characterized for operation from 0C to 70C.

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    Block diagram:

    Logic Diagram:

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    DC Motors

    A direct current (DC) motor is a fairly simple electric motor that uses electricity and a magneticfield to produce torque, which turns the motor. At its most simple, a DC motor requires two

    magnets of opposite polarity and an electric coil, which acts as an electromagnet. The repellent

    and attractive electromagnetic forces of the magnets provide the torque that causes the DC motor

    to turn.

    Whenever a robotics hobbyist talk about making a robot, the first thing comes to his mind is

    making the robot move on the ground. And there are always two options in front of the designer

    whether to use a DC motor or a stepper motor. When it comes to speed, weight, size, cost... DC

    motors are always preferred over stepper motors. There are many things which you can do with

    your DC motor when interfaced with a microcontroller. For example you can control the speed

    of motor, you can control the direction of rotation, you can also do encoding of the rotation made

    by DC motor i.e. keeping track of how many turns are made by your motors etc. So you can see

    DC motors are no less than a stepper motor.

    How to interface a DC motor with a microcontroller? Usually H-bridge is preferred way of

    interfacing a DC motor. These days many IC manufacturers have H-bridge motor drivers

    available in the market like L293D is most used H-Bridge driver IC. H-bridge can also be made

    with the help of transistors and MOSFETs etc. rather of being cheap, they only increase the size

    of the design board, which is sometimes not required so using a small 16 pin IC is preferred for

    this purpose.

    Working Theory of H-Bridge:

    The name "H-Bridge" is derived from the actual shape of the switching circuit which control the

    motion of the motor. It is also known as "Full Bridge". Basically there are four switching

    elements in the H-Bridge as shown in the figure below.

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    As you can see in the figure above there are four switching elements named as "High side left",

    "High side right", "Low side right", "Low side left". When these switches are turned on in pairs

    motor changes its direction accordingly. Like, if we switch on High side left and Low side right

    then motor rotate in forward direction, as current flows from Power supply through the motor

    coil goes to ground via switch low side right. This is shown in the figure below.

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    Similarly, when you switch on low side left and high side right, the current flows in opposite

    direction and motor rotates in backward direction. This is the basic working of H-Bridge. We can

    also make a small truth table according to the switching of H-Bridge explained above.

    Truth Table

    High Left High Right Low Left Low Right Description

    On Off Off On Motor runs clockwise

    Off On On Off Motor runs anti-clockwise

    On On Off Off Motor stops

    Off Off On On Motor stops

    As already said, H-bridge can be made with the help of transistors as well as MOSFETs, the only

    thing is the power handling capacity of the circuit. If motors are needed to run with high current

    then lot of dissipation is there. So head sinks are needed to cool the circuit.

    Now you might be thinking why we did not discuss the cases like High side left on and Low side

    left on or high side right on and low side right on. Clearly seen in the diagram, we don't want to

    burn our power supply by shorting them. So that is why those combinations are not discussed in

    the truth table.

    So we have seen that using simple switching elements we can make our own H-Bridge, or other

    option we have is using an IC based H-bridge driver.

    LM35 Temperature Sensor:

    The LM35 is a popular and low cost temperature sensor. It has three pins. The Vcc can be from

    4V to 20V as specified by the datasheet. To use the sensor simply connect the Vcc to +5V ,GND

    to ground and the OUT to one of the ADC (analog to digital converter) channel. The output

    linearly varies with temperature. The output is

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    10 mV per degree centigrade

    So if the output is 310 mV then temperature is 31 degree C.

    IR Sensors:

    Object Detection using IR light

    It is the same principle in ALL Infra-Red proximity sensors. The basic idea is to send infra red

    light through IR-LEDs, which is then reflected by any object in front of the sensor.

    For detecting the reflected IR light, we are

    going to use a very original technique: we

    are going to use another IR-LED, to detect

    the IR light that was emitted from another led

    of the exact same type!

    This is an electrical property of Light Emitting

    Diodes (LEDs) which is the fact that a led

    Produce a voltage difference across its leads

    when it is subjected to light. As if it was a

    photo-cell, but with much lower output current.

    In other words, the voltage generated by the

    leds can't be - in any way - used to generate

    electrical power from light, It can barely be

    detected.

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    LCD:

    Liquid Crystal Display also called as LCD is very helpful in providing user interface as

    well as for debugging purpose. The most commonly used Character based LCDs are based on

    Hitachi's HD44780 controller or other which are compatible with HD44580. The most

    commonly used LCDs found in the market today are 1 Line, 2 Line or 4 Line LCDs which have

    only 1 controller and support at most of 80 characters, whereas LCDs supporting more than 80

    characters make use of 2 HD44780 controllers.

    Pin Description

    Pin No. Name Description

    1 VSS Power supply (GND)

    2 VCC Power supply (+5V)

    3 VEE Contrast adjust

    4 RS0 = Instruction input

    1 = Data input

    5 R/W

    0 = Write to LCD module

    1 = Read from LCD module

    6 EN Enable signal

    7 D0 Data bus line 0 (LSB)

    8 D1 Data bus line 1

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    9 D2 Data bus line 2

    10 D3 Data bus line 3

    11 D4 Data bus line 4

    12 D5 Data bus line 5

    13 D6 Data bus line 6

    14 D7 Data bus line 7 (MSB)

    15 LED+ Back Light VCC

    16 LED- Back Light GND

    DDRAM - Display Data RAM

    Display data RAM (DDRAM) stores display data represented in 8-bit character codes. Itsextended capacity is 80 X 8 bits, or 80 characters. The area in display data RAM (DDRAM) that

    is not used for display can be used as general data RAM. So whatever you send on the DDRAM

    is actually displayed on the LCD. For LCDs like 1x16, only 16 characters are visible, so

    whatever you write after 16 chars is written in DDRAM but is not visible to the user.

    CGROM - Character Generator ROM

    Now you might be thinking that when you send an ASCII value to DDRAM, how the character

    is displayed on LCD? So the answer is CGROM. The character generator ROM generates 5 x 8

    dot or 5 x 10 dot character patterns from 8-bit character codes. It can generate 208 5 x 8 dot

    character patterns and 32 5 x 10 dot character patterns.

    CGRAM - Character Generator RAM

    As clear from the name, CGRAM area is used to create custom characters in LCD. In the

    character generator RAM, the user can rewrite character patterns by program. For 5 x 8 dots,

    eight character patterns can be written, and for 5 x 10 dots, four character patterns can be written.

    BF - Busy Flag

    Busy Flag is a status indicator flag for LCD. When we send a command or data to the LCD for

    processing, this flag is set (i.e. BF =1) and as soon as the instruction is executed successfully this

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    flag is cleared (BF = 0). This is helpful in producing and exact amount of delay for the LCD

    processing.

    To read Busy Flag, the condition RS = 0 and R/W = 1 must be met and The MSB of the LCD

    data bus (D7) act as busy flag. When BF = 1 means LCD is busy and will not accept next

    command or data and BF = 0 means LCD is ready for the next command or data to process.

    Instruction Register (IR) and Data Register (DR)

    There are two 8-bit registers in HD44780 controller Instruction and Data register. Instruction

    register corresponds to the register where you send commands to LCD e.g. LCD shift command,

    LCD clear, LCD address etc. and Data register is used for storing data which is to be displayed

    on LCD. When send the enable signal of the LCD is asserted, the data on the pins is latched in tothe data register and data is then moved automatically to the DDRAM and hence is displayed on

    the LCD. Data Register is not only used for sending data to DDRAM but also for CGRAM, the

    address where you want to send the data, is decided by the instruction you send to LCD.

    Commands and Instruction set

    Only the instruction register (IR) and the data register (DR) of the LCD can be controlled by the

    MCU. Before starting the internal operation of the LCD, control information is temporarily

    stored into these registers to allow interfacing with various MCUs, which operate at different

    speeds, or various peripheral control devices. The internal operation of the LCD is determined by

    signals sent from the MCU. These signals, which include register selection signal (RS),

    read/write signal (R/W), and the data bus (DB0 to DB7), make up the LCD instructions (Table

    3). There are four categories of instructions that:

    Designate LCD functions, such as display format, data length, etc. Set internal RAM addresses Perform data transfer with internal RAM

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    Perform miscellaneous functions

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    Although looking at the table you can make your own commands and test them. Below is a brief

    list of useful commands which are used frequently while working on the LCD.

    No. Instruction Hex Decimal

    1 Function Set: 8-bit, 1 Line, 5x7 Dots 0x30 48

    2 Function Set: 8-bit, 2 Line, 5x7 Dots 0x38 56

    3 Function Set: 4-bit, 1 Line, 5x7 Dots 0x20 32

    4 Function Set: 4-bit, 2 Line, 5x7 Dots 0x28 40

    5 Entry Mode 0x06 6

    6

    Display off Cursor off

    (clearing display without clearing DDRAM

    content)

    0x08 8

    7 Display on Cursor on 0x0E 14

    8 Display on Cursor off 0x0C 12

    9 Display on Cursor blinking 0x0F 15

    10 Shift entire display left 0x18 24

    12 Shift entire display right 0x1C 30

    13 Move cursor left by one character 0x10 16

    14 Move cursor right by one character 0x14 20

    15 Clear Display (also clear DDRAM content) 0x01 1

    16Set DDRAM address or cursor position on

    display0x80+add 128+add

    17Set CGRAM address or set pointer to CGRAM

    location

    0x40+add 64+add

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    Sending Commands to LCD

    To send commands we simply need to select the command register. Everything is same as we

    have done in the initialization routine. But we will summarize the common steps and put them in

    a single subroutine. Following are the steps:

    move data to LCD port select command register select write operation send enable signal wait for LCD to process the command

    Sending Data to LCD

    To send data we simply need to select the data register. Everything is same as the command

    routine. Following are the steps:

    move data to LCD port select data register select write operation send enable signal wait for LCD to process the data

    Working with AVR Studio:

    AVR studio is an Integrated Development Environment (IDE) by ATMEL for developing

    applications based on 8-bit AVR microcontroller. Prior to installation of AVR Studio you have

    to install the compiler WinAVR. This will allow AVR Studio to detect the compiler.

    http://www.engineersgarage.com/articles/avr-microcontrollerhttp://www.engineersgarage.com/articles/avr-microcontroller
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    Step 1:

    Step 2:

    Click on new project

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    Step 3:

    Click on AVR GCC

    Write the project name

    Select your project location.

    Click on Next>>

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    Step 4:

    Click on AVR Simulator in left block and then select your controller (e.g.: ATmega16).

    Click on finish button

    http://www.engineersgarage.com/atmega16-avr-microcontrollerhttp://www.engineersgarage.com/atmega16-avr-microcontroller
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    Step5:

    Write the code in main body area.

    Save the project file.

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    Step6:

    Go to PROJECT -> Configuration Options

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    Step 7:

    Write the crystal frequency if you are using external crystal.

    Check the checkbox corresponding to Create Hex File and then click on OK.

    Save the project again.

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    Step 8:

    Go to BUILD -> Compile.

    This will compile your code and generate error if any.

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    For the first time it will generate two errors, ignore them.

    Step 9:

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    Again go to BUILD and click on Build.

    This will generate hex file of the code.

    Use that Hex file to burn your microcontroller.

    Where you will find Hex file?

    Just go to the location which you selected at the starting. Open that folder you will find one more

    folder named Default. This is the default location of where the hex file is generated.

    While working in real time if you want to change the code, make changes and build the file

    again. This will automatically update the previous hex file.

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