TS-R-IN32M4-CL2-E User’s Manual · 2017. 1. 26. · FPU 1.3M-byte Large-capacity RAM Operating frequency 100MHz Ext. Memory Flash memory (Serial) 64M-bit (Quad), MX25L6433FM2I-08G

TS-R-IN32M4-CL2-E

User’s Manual

(R-IN32M4-CL2 Evaluation Board)

Down Load version

Issued: January 25, 2017 (Version 1.2)

TESSERA TECHNOLOGY INC.

TS-TUM04120

This board is for research and development.

・ The content of this document is subject to change without prior notice.

・ The evaluation board described in this document is made available for research and

development.

・ This information contained herein may not be reprinted or duplicated without written notice

from Tessera Technology, Inc. (Tessera).

・ Tessera does not guarantee or grant licenses to the intellectual property or other rights of

Tessera or any third party for use of this material or the products described in this document.

Tessera does not bear any responsibility if a problem occurs related to the ownership rights of

third parties arising from the use of the above-described products or information.

・ The information contained in this document is intended to illustrate the operation of

semiconductor products and application examples. Therefore, customers using this

information in the design of their own equipment must take full responsibility for product

design.

DECLARA丁IONOFCONFORMI丁Y

We,ProductComplian∞Division

TESSERATECHNOLOGYINC.

6干OakYt)kohamaBldg.,2-15-10Kitasaiwai,Nishi-ku,Ybkohamacity,

Kanagawa220-0004,JAPAN

Phone:十8145-595-9533　Fax:十8145-595-9534

deciareunde「ou「soieresponsibiftythattheproduct

Product:Boardtestsystems

ModeI:　TS-R-1N32M4-CL2EvaiuationBoa「d

towhichthisdeclar:ndonrelatesisinconfomitywiththefo=owingstandardsofothe「

normativedocuments

EN61326-1:2013(Basicimmunitytestrequi「ements)

lEC610OO4-2:2008(±4kV∞ntaCtdischarge/±8kVai「discharge)

iEC6100O-4-3:2006+Al:2007+A2:2010(80MHz-1.OGHz,ievei2(3V/m)/

1.4GHz-2.OGHz,IeveI2(3V/m)/2,OGHz-2.7GHz,leve11(1V/m))

IEC61000:4-5:2005(±0.5kVDCpowe「po巾Iinetoline/

±1.OkVDCpowerpo巾Iinetoea冊l/

±1.OkVSignalpo巾Iinetoearth)

lEC61000:44:2004+Al:2010(SignaIports:±1.OkV/ACpowerports:±1.OkV/

DCpowe「ports:±1.OkV)

IEC61000:4-6:20O8(ACpowe「POrts:leveI2(3V))

lEC61000:4-8:2009(3Nm50Hz,60Hz)

IEC61000:4-11:2004(ACpowe「po巾s:0%duringO.5cycIeIO%during「cycle/

70%during25cyc看esIO%during250cycIs)

CISPR=:20O9十A「:2010GroupIClassARadiatedemission(30MHz-1.OGHz)/

Conductedemission(0.15-30MHz)

fo=owIngtheprowisionsofECCouncilDirectwe

EMCDirective2004IlO8/EC

Autho zedRepresentative

HitoshiAkimoto

丁ESSERATECHNOLOGYINC.

Thepresident

DateofIssue:

丁S丁ERO4156

Revision history

Version Date Description

Ver. 1.0 Mar. 9, 2016 Initial version

Ver.1.1 Mar. 30, 2013 12.2 MAC Address Mod

Ver.1.2 Jan. 25, 2017 2. CC-Link / CC-Link IE Meet conformance requirements

Table of Contents

1. APPLICATION .......................................................................................................................................... 1

2. OVERVIEW ............................................................................................................................................... 1

3. SPECIFICATIONS ................................................................................................................................... 2

4. EXTERNAL VIEW ................................................................................................................................... 3

4.1. BOARD COMPONENT SIDE ......................................................................................................................... 3

4.2. BOARD SOLDERING SIDE ........................................................................................................................... 3

5. SECTION NAMES ................................................................................................................................... 4

5.1. BOARD COMPONENT SIDE ......................................................................................................................... 5

5.2. BOARD SOLDERING SIDE ........................................................................................................................... 5

6. BOARD BLOCK DIAGRAM ................................................................................................................... 6

7. BLOCK DESCRIPTIONS ........................................................................................................................ 7

7.1. R-IN32M4-CL2 .......................................................................................................................................... 7

7.2. OPERATION MODE SELECTION ................................................................................................................. 7

7.3. JTAG (ICE) INTERFACE ............................................................................................................................. 8

7.4. EXTERNAL MEMORY (SERIAL FLASH) ...................................................................................................... 9

7.5. EXTERNAL MEMORY/EXTERNAL HOST INTERFACE ............................................................................... 9

7.6. I2C INTERFACE ......................................................................................................................................... 10

7.7. CSI INTERFACE ........................................................................................................................................ 10

7.8. UART INTERFACE..................................................................................................................................... 11

7.9. ANALOG INPUT .......................................................................................................................................... 11

7.10. GIGAPHY ADDRESS SELECTION .......................................................................................................... 11

7.11. GENERAL-PURPOSE I/O ........................................................................................................................ 12

7.12. CC-LINK INTERFACE ............................................................................................................................. 14

7.13. CC-LINK STATION TYPE/TERMINAL SELECTIONS ............................................................................ 14

7.14. CC-LINK IE FIELD INTERFACE ............................................................................................................ 15

7.15. POWER SUPPLY ...................................................................................................................................... 16

7.16. RESET ...................................................................................................................................................... 17

7.17. CLOCKS ................................................................................................................................................... 18

8. DIP, ROTARY, AND PUSH SWITCH CONFIGURATIONS ............................................................ 19

8.1. SW1: MODE SETTING .............................................................................................................................. 19

8.2. SW8 CC-LINK STATION TYPE SWITCHING DIP SWITCH ................................................................. 20

8.3. SW7 CC-LINK TERMINAL SELECTION DIP SWITCH ........................................................................ 20

8.4. SW2 GIGAPHY ADDRESS SELECTION DIP SWITCH ........................................................................ 21

8.5. SW15 CC-LINK IE FIELD FACTORY DEFAULT SETTING DIP SWITCH ........................................... 21

8.6. SW4/SW6 CC-LINK STATION NUMBER/IE FIELD NETWORK NUMBER SELECTION SWITCHES 22

8.7. SW3/SW5 CC-LINK IE FIELD STATION NUMBER SELECTION ROTARY SWITCHES .................... 23

8.8. SW10/SW11 CC-LINK BAUD RATE SELECTION ROTARY SWITCHES ............................................. 24

8.9. SW9 CC-LINK (IOTENSU/SENYU) SELECTION DIP SWITCH (FOR REMOTE DEVICE STATION)

............................................................................................................................................................................ 25

8.10. SW13 / SW14 RESET PUSH SWITCHES (2) ..................................................................................... 25

8.11. SW12 GENERAL-PURPOSE PORT DIP SWITCH............................................................................... 26

9. LED ........................................................................................................................................................... 27

9.1. POWER SUPPLY ......................................................................................................................................... 27

9.2. LEDS FOR MONITORING CC-LINK IE FIELD OPERATIONS ............................................................... 27

9.3. LEDS FOR MONITORING CC-LINK OPERATIONS ................................................................................ 27

9.4. GIGAPHY INDICATOR LED .................................................................................................................... 28

9.5. GENERAL-PURPOSE LED ........................................................................................................................ 28

10. CONNECTOR PIN DEFINITIONS ................................................................................................... 28

10.1. I2C CONNECTOR .................................................................................................................................... 28

10.2. CSI CONNECTOR.................................................................................................................................... 29

10.3. UART (USB) CONNECTOR................................................................................................................... 29

10.4. CC-LINK IE FIELD CONNECTOR ......................................................................................................... 30

10.5. JTAG (ICE) CONNECTOR ..................................................................................................................... 31

10.6. CC-LINK CONNECTOR .......................................................................................................................... 31

10.7. DC POWER JACK .................................................................................................................................... 32

10.8. POWER CONNECTOR ............................................................................................................................. 32

10.9. EXTERNAL MEMORY/MCU CONNECTOR ............................................................................................ 33

10.10. ANALOG INPUT PIN HEADER ............................................................................................................. 36

10.11. GPIO INPUT PIN HEADER ................................................................................................................. 36

11. TABLE OF UNUSED PINS AND PAD CONNECTION PINS ..................................................... 37

11.1. UNUSED PINS ......................................................................................................................................... 37

11.2. PAD CONNECTION PINS ....................................................................................................................... 38

12. DEFAULT FACTORY SETTINGS ..................................................................................................... 39

12.1. DIP-SW/ROTARY-SW ............................................................................................................................ 39

12.2. MAC ADDRESS ....................................................................................................................................... 39

13. BOARD EXTERNAL DIAGRAM ....................................................................................................... 40

13.1. BOARD COMPONENT SIDE .................................................................................................................... 40

13.2. BOARD SOLDERING SIDE ...................................................................................................................... 40

13.3. DIMENSIONAL DIAGRAM....................................................................................................................... 41

1

1. Application This user’s manual provides explanations for use of the TS-R-IN32M4-CL2 Evaluation Board.

Applicable board version: TS-R-IN32M4-CL_001

2. Overview The R-IN32M4-CL2 board was developed for evaluating the R-IN32M4-CL2 device and offers the

following interfaces:

・ CC-Link IE Field

・ CC-Link

・ UART (USB mini-B)

・ I2C

・ CSI

・ Analog Input

・ External memory (Serial Flash)

・ External memory/MCU interface

・ JTAG(ICE_I/F)

・ Others, such as switches and LEDs

This board specification does not support the following combinations:

・ CC-Link IE and CC-Link (Remote device station)

Note1: The CC-Link circuits on this board meet conformance requirements.

Note2: The CC-Link IE circuits on this board meet conformance requirements.

2

3. Specifications Item Specification

Main ASSP *1

Renesas Electronics System LSI R-IN32M4-CL2

ARM CortexTM-M4 32-bit RISC CPU with HW-RTOS （Hardware Real-Time OS） FPU 1.3M-byte Large-capacity RAM Operating frequency 100MHz

Ext. Memory Flash memory (Serial) 64M-bit (Quad), MX25L6433FM2I-08G equivalent

Interface

I2C 1Ch 4 × 1 Pin 2.54-mm header

CSI 2Ch 5 × 1 Pin 2.54-mm header

External Host MCU 1Ch 50 × 2 pin 0.6-mm connector

UART 1Ch (UART to USB) USB mini-B connector *2

USB-Ver2

CC-Link IE Field 2Ch RJ-45

CC-Link 1Ch (Remote device

station) 35605-5153-B00PE equivalent

JTAG(ICE) 1Ch 20-pin half-pitch connector

(Trace supported)

General-purpose interface 10 ports 10×1Pin 2.54-mm through hole

LED

Power Supply 1 green LED

CC-Link IE Field Monitor 7 red and yellow LEDs

CC-Link Monitor 8 red and green LEDs

Internal PHY 2 green LEDs per Ch

Ext. MCU interface selection 1 green LED

General-purpose interface 8 green LEDs

DIP-SW

Operation mode selection 8 bits (SW1)

CC-Link IE Field initial setting

selection 4 bits (SW15)

CC-Link IE Field station-type

switching 4 bits (SW8)

CC-Link terminal resistance

selection 2 bits (SW7)

GigaPHY address selection 4 bits (SW2)

General-purpose interface 8 bits (SW12)

Rotary SW

CC-Link station type selection

(shared with CC-Link IE Field

network number setting)

Two 16-way rotary switches (0 to F)

CC-Link IE Field

station selection Two 16-way rotary switches (0 to F)

CC-Link baud rate

(Intelligent device station)

selection

One 16-way rotary switch (0 to F)

CC-Link baud rate

(Remote Device Station) selection One 16-way rotary switch (0 to F)

Power Supply Power supply terminal block DC +24.0 V ±5%, 500m or more *3

AC Adapter +5.0 V +/- 5%, 2A or more (center plus)

Operation Temp. 0 to +70o

*1 ASSP means “Application Specific Standard Product,” a standard System LSI. Please refer to the

Renesas datasheet and user’s manual for details concerning R-IN32M4-CL2.

3

*2 The USB cable must be inserted and detached while the board is powered.

*3 Take precautions to avoid reverse insertion.

4. External View The following are photos outlining the board’s exterior.

4.1. Board Component Side

4.2. Board Soldering Side

4

5. Section Names The following photos provide coordinates and labels to help locate specific positions on the

board referred to later in this document.

5



6

6. Board Block Diagram

R-IN32M4-CL2+-

DC Jack

AC Adapter

(+5V)

Digital System 3.3V

FB

OSC

25MHz

OSC

80MHz

XT2

CLK80M

RESETZ-SW

Reset IC

(PowerON)Reset IC RESETZ

Serial Flash

ROM

(64 Mbits)

Serial Flash

ROM I/F

RS485Driver

CC-Link

Connector

EtherPHY0 I/FRJ45

Connector

Operation Mode

Selection Pins

HOTRESETZ

Pulse Trans

OSC

2.097MHzCLK2_097M

For PHY 2.5V

Isolator

DC/DC

3.3V⇒5.0V

CC-Link 5.0V

Wired_or

LED x 7bits

JTAG(ICE)

20-pin ConnectorJTAG(ICE)

0

⇒

Rotary SW(0～F) x 2

Fuse

EMI

Filter

Power IC

RAA230152

24V⇒5V

Power IC

RAA230131

For PHY Analog 2.5VFB

EtherPHY1 I/FRJ45

ConnectorPulse Trans

CC-Link IE Field Moniter

Digital

IsolatedFilter

CC-Link

LED x 8bits

CC-Link Monitor

CC-Link IE Field

Station Number Setting

0

⇒


CC-Link Baud rate setting

CC-Link Setting

(Remote device station)DIP-SW (4-bit)

FTDI

(FT232RQ)UART1

USB

Mini-B

Ext. Port

DIP-SW (8-bit)

LED x 8bits

Power CN

(+24V)

DIP-SW(8bit)

0

⇒


CC-Link Station Setting

(CC-Link IE Field

Network Number Setting)

4 × 1 pin 2.54mm

Header (1ch)I2C I/F

5 × 1 pin 2.54mm

Header (2ch)CSI I/F

50 × 2 Pin 0.6mm

Connector Ext. MCU I/F

GigaPHY_Address SettingDIP-SW (4-bit)

DIP-SW (6+2bit)

0

PONRZ

(IOTENSU/SENYU)

JTAGSEL

OSCTH

+3.3V

GND (pull-down)

HOTRESETZ-SW

Reset IC

Analog System 3.3V

10 × 1 pin 2.54mm

Through-holeExt. Port

(EXTPn)

Power IC

RAA230233

Digital System 1.0V

Analog System 1.0V

7

7. Block Descriptions

7.1. R-IN32M4-CL2

Refer to the corresponding Renesas Electronics Corp. datasheet and user ’s manual

for more details.

7.2. Operation Mode Selection

An 8-bit DIP switch (SW1) is provided for operation mode selection.

HIFSYNC

FRU2(MEMCSEL)

BOOT1

BOOT0

MEMIFSEL

BUS32EN

Pull_Down Register

(1KΩ)

+3.3V

FRU1(ADMUXMODE)

HWRZSEL

R-IN32M4-CL2

1

2

3

4

5

6

7

8

330

Ω

8

7.3. JTAG (ICE) Interface

The JTAG (ICE) connector is available for the on-board CPU (R-IN32M4-CL2).

The connector is a 10 x 2 pin header with1.27 mm pitch.

*To prevent incorrect insertion, the 7th pin is pulled out.

*Signal TRSTZ is wired-OR connected to signal RESETZ pin.

1

3

5

7

9

11

13

15

17

19

2

4

6

8

10

12

14

16

18

20

+3.3V

R-IN32M4-CL2

TMS

TCK

TDO

TDI

TRSTZ

TRACECLK

TRACEDATA0

TRACEDATA1

TRACEDATA2

TRACEDATA3

To Reset Circuitry

33Ω

33Ω

51KΩ

0.1uF 0.1uF

Pull_Down Register

1KΩ

9

7.4. External Memory (Serial Flash)

A serial flash memory (MX25L6433FM2I-08G equivalent) is used to boot the

internal CPU.

MX25L6433FM2I-08G

P14

P17

P16

P15

SCLK

CS#

SI/SIO0

SO/SIO1

R-IN32M4-CL2SMSCK

SMCSZ

SMIO0

SMIO1

WP#/SIO2

RESET#/SIO3P11

P10 SMIO2

SMIO3

33Ω

7.5. External Memory/External Host Interface

A 100-pin header (CN2) is provided for interface with the external memory/external

host.

The 74HC244 driver is used for the chip select signal connection. When using an

external memory, the signal is output from CSZ0 to CSZ3; when using an external

host, the signal is input to HCSZ/HPGCSZ. DIP-SW (SW1) bit 4 selects either

external memory or external host exclusively.

CSZ0

SW1MEMIFSEL

74HC244

Pull-up

Ext. Connector

A[20:2]

D[15:0]

A[1]/HA[1]

RDZ

P40

RP2[7:1]

Pull-up

CSZ1

CSZ2

CSZ3

HCSZ

HPGCSZ

CSZ0

P4[4]

P5[1]

P5[0]

R-IN32M4-CL2

RP2[0]

RP3[7:0]

RP1[7:0]

A[20:2]/HA[20:2]

A[27:21]/HA[27:21]

BCYSTZ/HBCYSTZ

D[15:0]/HD[15:0]

D[23:16]/HD[23:16]

D[31:24]/HD[31:24]

WRSTBZ

WRZ0

WRZ1

RDZ/HRDZ

WRSTBZ/HWRSTBZ

WRZ0/HWRZ0

WRZ1/HWRZ1

RP0[6]

RP0[7]

WRZ2/HWRZ2

WRZ3/HWRZ3

P4[1]

P4[5]

P4[6]

P4[7]

WAITZ/HWAITZ

WAITZ1

WAITZ2

WAITZ3

BUSCLKBUSCLK

P4[3]HBUSCLK

10

7.6. I2C Interface

R-IN32M4-CL2 is connected to the header, enabling I2C synchronized

communications (2 channels). A 4 x 1 pin header (2.54 mm pitch) is available for I2C interface.

P60

4×1Pin 2.54mm Header

SCL0

+3.3V

GND

P61 SDA0

R-IN32M4-CL2

+3.3V

I2C_ch0

4.7KΩ

7.7. CSI Interface

R-IN32M4-CL2 is connected to the header, enabling synchronous serial

communication.

Two 5 x 1 pin headers with 2.54 mm pitch are available for CSI interface.

P45


+3.3V

GND

P46

R-IN32M4-CL2

CSI_ch0

P47

CSISCK0

CSISI0

CSISO0


+3.3V

GND

CSI_ch1

CSISCK1

CSISI1

CSISO1

P35

P36

P37

11

7.8. UART Interface

The board offers a UART-to-USB chip for the UART0 function (FT232RQ) and a

USB connector, supporting PC communication in asynchronous mode.

A USB mini-B connector is mounted for UART interface.

FT232RQ

equivalent

P31

P30 TXD

RXD

USBDM

USBDP

USB mini-B

R-IN32M4-CL2

27Ω

27Ω

7.9. Analog Input

Analog input is connected to R-IN32M4-CL2 via a low-pass filter (LPF) from the

header mounted on the board.

An 8 x 1 pin header with 2.54 pitch is provided for analog input.

R-IN32M4-CL2

AIN0100Ω

0.1uF

100Ω

0.1uF

AIN7

～～

7.10. GigaPHY Address Selection

A DIP-SW (SW2) is provided to select the GigaPHY address.

PHYADD1

PHYADD2

PHYADD3

PHYADD4

+3.3VON

+3.3V +3.3V

2.4KΩ

10KΩ

12

7.11. General-Purpose I/O

The following shows the DIP-SW (input), LED (output), and through-hole (output)

connections to the R-IN32M4-CL2 general-purpose ports.

General-purpose DIP-SW input (8 bits)

RP31

RP30

RP37

RP36

RP35

RP34

RP33

RP32

Pull_Down Register

+3.3V

1KΩ

General-purpose LED output (8 bits)

RP27

RP26

RP25

RP24

330Ω

RP23

RP22

RP21

RP20

13

General-purpose through-hole output (10 bits)

R-IN32M4-CL2

EXTP0

EXTP1

EXTP2

EXTP3

EXTP4

EXTP5

EXTP6

EXTP7

EXTP8

EXTP9

14

7.12. CC-Link Interface

The board offers isolators, RS485 transceivers, and filters, supporting a CC-Link

remote device station or a CC-Link intelligent device station.

Connector 35610-5153-B00-PE is also mounted on the board.

*Use a jumper to set communication to an intelligent device station or remote

device station.

CC-Link Connector

DA

DB

DG

SLD

FGGND

GND

+5.0V

Isolator

ISO7241CDWR

R-IN32M4-CL2

CCM_RD/CCS_RD

CCM_SD/CCS_SD

CC_DE

P56

P54

P57

CCS_SDGATEON

P51

CC-Link Connector

35605-5153-B00 PE

+5.0V

CCS_CONT

CCM_CONT

MCT7050-A401

PESD5V0U1UA,115

SN75ALS181NS

P53

680Ω

680Ω

3300pF/50V

10KΩ

1KΩ47KΩ

47KΩ

CC_RE

CCM_SDGCZ

P20

P25

330Ω

+3.3V

CC_LED

DIP-SW switch

DIP-SW switch

7.13. CC-Link Station Type/Terminal Selections

DIP-SW (SW8) is provided for switching the CC-Link station type and setting the terminal

resistor to ON/OFF.

DB

DA

CC_RE

CC_DE

CC_LED

110Ω

GND

P42

P20

P35

P52(Inversion)

P25

15

7.14. CC-Link IE Field Interface

The board is mounted with a pulse transformer for CC-Link IE communications.

Two RJ4 channels are also mounted as external connectors.

R-IN32M4-CL2

P0_D0P

P0_D0N

P0_D1P

P0_D1N

P0_D2P

P0_D2N

P0_D3P

P0_D3N

RJ45

75Ω

1000pF/2KV

P1_D0P

P1_D0N

P1_D1P

P1_D1N

P1_D2P

P1_D2N

P1_D3P

P1_D3N

RJ45

75Ω

1000pF/2KV

0.1uF/25V

MGF101

0.1uF/25V

16

7.15. Power Supply

DC24V input is provided by the power supply terminal block to generate power for

each device.

Power IC RAA230152 generates 5V from the 24V, and secondary power ICs

generate 3.3V (analog/digital) and 1.0V/2.5V from the DC24V-generated 5V or the

DC jack (5V), respectively.

*Reverse input of DC24 to the power supply terminal block is prohibited.

The LED (green indicates power supply) lights up when 5V are applied.

The CC-Link 5V is DC/DC converted by the isolator from the 3.3V output.

+-DC Jack

AC Adapter

(+5V)

Digital System 3.3V

FB

PHY 2.5V

Isolator

DC/DC

3.3V⇒5.0V

CC-Link 5.0V

Fuse

EMI

Filter

Power IC

RAA230152

24V⇒5V

Power IC

RAA230131

PHY Analog 2.5VFB

Power CN

(+24V)

Analog System 3.3V

Power IC

RAA230233

Digital System 1.0V

Analog System 1.0V

17

7.16. Reset

When the board is powered, push the reset button (SW13/SW14) or apply a reset

signal via the ICE connector, to reset all board resources.

SW13 Reset

IC

Reset

IC

+3.3V

TRSTZ

RESETZ

PONRZ

ICE Connector

Wired or Connection

SW14 Reset

ICHOTRESETZ

+3.3V

+3.3V

+3.3V

EXT_RSTINZ

From Ext. MCU Connector

* During Power ON, PONRZ must be 12ms LOW, and RESETZ and HOTRESETZ

must be 18ms LOW.

* Push Switch must apply at least 6ms LOW.

18

7.17. Clocks

This evaluation board provides the following clocks: R-IN32M3-CL system clock (25

MHz), CC-Link clock (80 MHz), and CC-Link IE clock (2.097152 MHz).

*Oscillation stabilization period for each oscillator: 10ms.

R-IN32M4-CL2

25MHz

Oscillator

80MHz

Oscillator

XT2

CCM_CLK80M

2.097152MHz

OscillatorCCI_CLK2_097M

33Ω

33Ω

33Ω

19

8. DIP, Rotary, and Push Switch Configurations

8.1. SW1: Mode Setting

Location: D-4

Board Silk: SW1

Part #: COPAL CHS-08TB (or equivalent part)

8-bit DIP-SW connected to R-IN32M4-CL2 for operation mode selection.

*Default factory setting: External serial flash ROM boot

Note 1: Valid when external memory/MCU are connected

* Default factory setting: All OFF

8

ONSW1

7654321

2 1 2 1

ON ON H H Instruction RAM Boot (Debug only)

ON OFF L H Ext. Serial Flash ROM Boot

OFF ON H L Ext. MCU Boot *1

OFF OFF L L Ext. Memory Boot *1

SW1 LevelPin Name Boot Mode Selection

BOOT0(SW1-2)

BOOT1(SW1-1)

SW1

3

OFF L Slave Memory I/F

ON H Ext. MCU I/F

SW1

4

OFF L Asynchronous SRAM MEMC

ON H Synchronous burst access MEMC

SW1

5

OFF L 16-bit Bus

ON H 32-bit Bus

SW1

6

OFF L Asynchronous SRAM Interface

ON H Synchronous SRAM Interface

SW1

7

OFF L Connect in parallel

ON H Address bus is MUXed on data bus

SW1

8

OFF L HBENZ is selected

ON H HWEZ is selected

ADMUXMODE

Level Pin Name Ext. MCU I/F HWRZ / HBENZ Selection

HWRZSEL

BUS32EN

Level Pin Name Ext. Memory I/F Operation Mode Selection

HIFSYNC

Level Pin Name Ext. Memory I/F Address MUX Selection

MEMCSEL

Level Pin Name Ext. Memory I/F Bus Width Selection

MEMIFSEL

Level Pin Name Ext. Memory Controller Setting

Level Pin Name Ext. Memory I/F Type Selection

20

8.2. SW8 CC-Link Station Type Switching DIP Switch

Location: H-5

Board Silk: SW8

Part #: COPAL CHS-06TB (or equivalent part）

6-bit DIP-SW connected to CC-Link peripheral circuits for selecting station type.

ONSW8

654321

* Default factory setting: Remote device station

8.3. SW7 CC-Link Terminal Selection DIP Switch

Location: I-8

Board Silk: SW7

Part #: COPAL CHS-02TB (or equivalent part）

2-bit DIP-SW connected to CC-Link peripheral circuits for selecting CC-Link

terminal resistance ON/OFF.

* Default factory setting: all ON positions

ONSW7

21

１・２・３４・５・６

OFF OFF -

ON OFF Intelligent device station

OFF ON Remote device station

ON ON -

SW8Station Selection

1 2

OFF OFF OFF

ON OFF Prohibited

OFF ON Prohibited

ON ON ON(110Ω)

SW7Terminal resistance

21

8.4. SW2 GigaPHY Address Selection DIP Switch

Location: B-7

Board Silk: SW2


4-bit DIP-SW connected to R-IN32M4-CL2 for selecting internal GigaPHY

address. * Default factory setting: all OFF positions

ON

4321

SW2

8.5. SW15 CC-Link IE Field Factory Default Setting DIP Switch

Location: H-5

Board Silk: SW15


4-bit DIP-SW connected to R-IN32M4-CL2 for selecting default setting of internal

CC-Link IE Field.

* Default factory setting: all OFF positions

ON

4321

SW15

Pin # Signal Name

1 PHYADD1

2 PHYADD2

3 PHYADD3

4 PHYADD4

Pin # Signal Name

1 CCI_PWRPT

2 CCI_TRSPEED

3 CCI_WAITEDGEH

4 CCI_WRLENH

22

8.6. SW4/SW6 CC-Link Station Number/IE Field Network Number Selection Switches

Location: A-3

Board Silk: SW4, SW6

Part #: COPAL SC-1110 (or equivalent part)

16-position, real-code rotary SW connected to R-IN32M4-CL2 for selecting

CC-Link station number and IE Field network number.

* Setting range for CC-Link station number: “1 to 64”

Setting range for CC-Link IE Field network number: “1 to 159”

* Default factory setting: Both SW4 and SW6 are set to "0"

SW4 SW6

⇒

0

4

8

C⇒

04

8

C

* Default factory setting: Both set to position “0”

The side of the knob with the slit indicates the direction of the arrow.

0 1 2 3 4 5 6 7 8 9 A B C D E F

1 ● ● ● ● ● ● ● ● P74

2 ● ● ● ● ● ● ● ● P75

4 ● ● ● ● ● ● ● ● P76

8 ● ● ● ● ● ● ● ● P77

1 ● ● ● ● ● ● ● ● P70

2 ● ● ● ● ● ● ● ● P71

4 ● ● ● ● ● ● ● ● P72

8 ● ● ● ● ● ● ● ● P73

SW6

First place

SW CodePosition R-IN32M4-CL2

Pin Name

SW4

Tenth place

23

8.7. SW3/SW5 CC-Link IE Field Station Number Selection Rotary Switches

Location: A-2

Board Silk: SW3, SW5

Part #: COPAL SC-1110 (or equivalent part）


CC-Link IE Field station number.

* Setting range: “1 to 120”


SW3 SW5

⇒

0

4

8

C⇒

04

8

C

* The side of the knob with the slit indicates the direction of the arrow.

0 1 2 3 4 5 6 7 8 9 A B C D E F

1 ● ● ● ● ● ● ● ● RP14

2 ● ● ● ● ● ● ● ● RP15

4 ● ● ● ● ● ● ● ● RP16

8 ● ● ● ● ● ● ● ● RP17

1 ● ● ● ● ● ● ● ● RP10

2 ● ● ● ● ● ● ● ● RP11

4 ● ● ● ● ● ● ● ● RP12

8 ● ● ● ● ● ● ● ● RP13

SW3

Tenth place

SW5

First place

SW CodePosition R-IN32M4-CL2

Pin Name

24

8.8. SW10/SW11 CC-Link Baud Rate Selection Rotary Switches

Location: C-3

Board Silk: SW10、SW11

Part #: COPAL SC-1110 (or equivalent part）


CC-Link baud rate.

SW10: Remote device station

SW11: Intelligent device station

* Setting range: “1 to 4”


SW10 SW11

⇒0

4

8

C⇒

0

4

8

C

* The side of the knob with the slit indicates the direction of the arrow.

0 1 2 3 4 5 6 7 8 9 A B C D E F

1 ● ● ● ● ● ● ● ● RP02

2 ● ● ● ● ● ● ● ● RP03

4 ● ● ● ● ● ● ● ● RP04

8 ● ● ● ● ● ● ● ● RP05

1 ● ● ● ● ● ● ● ● P62

2 ● ● ● ● ● ● ● ● P63

4 ● ● ● ● ● ● ● ● P64

8 ● ● ● ● ● ● ● ● P65

SW11

CodePosition R-IN32M4-CL2

Pin Name

SW10

SW

25

8.9. SW9 CC-Link (IOTENSU/SENYU) Selection DIP Switch (for remote device

station)

Location: E-3

Board Silk: SW9


4-bit DIP-SW connected to R-IN32M4-CL2 for selecting number of CC-Link

(when remote device station is selected) I/O devices and occupied stations

*Switch 4 cannot be used.


ON

4321

SW9

8.10. SW13 / SW14 Reset Push Switches (2)

Location: G-4 / F-4

Board Silk: SW13 / SW14

Part #: COPAL SKQMBBE010（or equivalent part）

SW13 and SW14 are tact switches (PUSH-SW) connected to the I/O ports of the

R-IN32M3-CL chip.

These switches are used to input resets (RESETZ/HOTRESETZ).

*SW13 is for RESETZ, SW14 is for HOTRESETZ.

Pin #R-IN32M4-CL2

Signal NamePort Signal Name

1 P22 CCS_IOTENSU

2 P23 CCS_SENYU0

3 P24 CCS_SENYU1

4 Don't use

（

（

26

8.11. SW12 General-Purpose Port DIP Switch

Location: C-4

Board Silk: SW12

Part #: COPAL CHS-08TB（or equivalent）

8-bit DIP-SW connected to R-IN32M4-CL2 for general-purpose input.


8

ONSW12

7654321

BitR-IN32M4-CL2

Signal Name

1 RP30

2 RP31

3 RP32

4 RP33

5 RP34

6 RP35

7 RP36

8 RP37

27

9. LED

9.1. Power Supply

Location: I-1

Board Silk: D49 (POWER)

Part #: ROHM SML-D12P8W (or equivalent part）

This is a green LED (1 bit) for monitoring the power supply.

9.2. LEDs for Monitoring CC-Link IE Field Operations

Location: F-7

Board Silk: See list below

Part #: ROHM SML-D12P8W、SML-D12U8W（or equivalent part）

These are green LEDs (7 bits) for monitoring CC-Link IE Field operations.

*The LED turns on when port is set to Low.

D20: RUN （Green）

D21: D.LNK （Green）

D22: ERR （Red）

D23: L.ERR （Red）

D24: L.ERR2 （Red）

D25: IE_SD （Green）

D26: IE_RD （Green）

9.3. LEDs for Monitoring CC-Link Operations

Location: F-4

Board Silk: See list below

Part #: ROHM SML-D12P8W, SML-D12U8W（or equivalent part）

These are red/green LEDs (8 bits) for monitoring CC-Link operations.

*The LED turns on port is set to Low.

D29: CC_LEER （Red）

D30: CC_ERR （Red）

D31: CC_RUN （Green）

D32: CC_MST （Green）

D33: CC_LRUN （Green）

D34: CC_RD （Green）

D35: CC_SD （Green）

D36: CC_SMST （Green）

28

9.4. GigaPHY Indicator LED

Location: B-8 / D-8

Board Silk: D2 / D11

Part #: ROHM SML-D12P8W（or equivalent part）

Green LED (1 bit/ch) for confirmation of R-IN32M4-CL2 internal GigaPHY

operations.

9.5. General-purpose LED

Location: B-4

Board Silk: D39 / D40 / D42 / D43 / D44 / D45 / D46 / D48

Part #: ROHM SML-D12P8W（or equivalent part）

Green LED (8 bits) connected to R-IN32M4-CL2 for general-purpose output.

10. Connector Pin Definitions

10.1. I2C Connector

Location: I-4

Board Silk: CN7

Type: 4 x1 pin header, 2.54mm pitch

Part #: HTK FFC-4AMEP1

1 4

Pin # IO Dir. Signal NameR-IN32M4-CL2

Signal Name

1 - GND -

2 I/O SCL0 P60

3 I/O SDA0 P61

4 - +3.3V -

29

10.2. CSI Connector

Location: A-6 / A-7

Board Silk: CN6 / CN9

Type: 5 × 1 pin, 2.54mm pitch, 2 units

Part #: HTK FFC-5AMEP1

1 5

CN6 CN9

10.3. UART (USB) Connector

Location: I-4

Board Silk: CN8

Type: USB mini-B

Part #: molex 54819-0519 (or equivalent part)

1 5

UART(CN8)


Signal NamePin # IO Dir. Signal Name

R-IN32M4-CL2

Signal Name

1 I/O CSISCK0 P45 1 I/O CSISCK1 P35

2 - GND - 2 - GND -

3 I CSISI0 P46 3 I CSISI1 P36

4 O CSISO0 P47 4 O CSISO1 P37

7 - +3.3V - 7 - +3.3V -

Pin # IO Dir. Signal Name

1 - (VBUS)

2 - (ID)

3 I/O D+

4 I/O D-

5 - GND

30

10.4. CC-Link IE Field Connector

Location: B-9 / D-9

Board Silk: CN3 / CN4

Type: RJ-45, 2 units

Part #: HIROSE TM21R-5C-88(50)

1 8 1 8

CH0(CN3) CH1(CN4)

Pin # IO Dir. Signal NamePHY

Pin #

1 I/O MX1+ MDI[0]+

2 I/O MX1- MDI[0]-

3 I/O MX2+ MDI[1]+

4 I/O MX3+ MDI[2]+

5 I/O MX3- MDI[2]-

6 I/O MX2- MDI[1]-

7 I/O MX4+ MDI[3]+

8 I/O MX4- MDI[3]-

31

10.5. JTAG (ICE) Connector

Location: I-5

Board Silk: CN1

Type: 10 x 2 pin header, 1.27mm pitch

Part #: SAMTEC ASP-185676-01(SHF-110-01-L-D-SM)

*To prevent incorrect insertion, the 7th pin has been removed.

10.6. CC-Link Connector

Location: G-9

Board Silk: CN5

Type: 5-pin power clamp, board mount header

Part #: 3M 35605-5153-B00 PE

5 1

CC-Link(CN9)

1

3

5

7

9

11

13

15

17

19

2

4

6

8

10

12

14

16

18

20

ICE(CN1)


Signal NamePin # IO Dir. Signal Name

R-IN32M4-CL2

Signal Name

1 - (Vtref) - 11 - TgrPwr -

2 O TMS TMS 12 I TRACECLK TRACECLK

3 - GND - 13 - TgrPwr -

4 O TCK TCK 14 I TRACEDATA0 TRACEDATA0

5 - GND - 15 - GND -

6 O TDO TDO 16 I TRACEDATA1 TRACEDATA1

7 - - - 17 - GND -

8 O TDI TDI 18 I TRACEDATA2 TRACEDATA2

9 - GND - 19 - GND -

10 O nRESET TRSTZ 20 I TRACEDATA3 TRACEDATA3


1 I/O DA

2 I/O DB

3 - DG

4 - -

5 - SLD

32

10.7. DC Power Jack

Location: H-1

Board Silk: CN11

Type: DC power jack

Part #: HOSIDEN HEC0470-01-630 (or equivalent part)

D = φ2.0

10.8. Power Connector

Location: I-1

Board Silk: CN10

Type: Power supply terminal block

Part #: OMURON XW4E-02B1-S1（or equivalent part）

1 2

CN10

- +


1 － +24.0V

2 － GND

33

10.9. External memory/MCU Connector

Location: D-1

Board Silk: CN2


Part #: HRS FX8C-100P-SV1(92) (or equivalent part）

1 99・・・・・・・・・

・・・・・・・・・2 100

CN2

34

●When using connector as external memory interface

*1: The signal is output through 74S244.

*2: The signal is not used.

Pin # IO Dir. Signal Name Pin # IO Dir. Signal Name

1 - +3.3V 2 - +3.3V

3 O P40(A1) 4 O A2

5 O A3 6 O A4

7 O A5 8 O A6

9 O A7 10 O A8

11 O A9 12 O A10

13 O A11 14 O A12

15 O A13 16 O A14

17 O A15 18 O A16

19 O A17 20 O A18

21 O A19 22 O A20

23 - GND 24 - GND

25 I/O D0 26 I/O D1

27 I/O D2 28 I/O D3

29 I/O D4 30 I/O D5

31 I/O D6 32 I/O D7

33 I/O D8 34 I/O D9

35 I/O D10 36 I/O D11

37 I/O D12 38 I/O D13

39 I/O D14 40 I/O D15

41 - GND 42 - GND

43 O WRSTBZ 44 I P43(HBUSCLK) *2

45 I P45(WAITZ1) *2 46 O RSTOUTZ *2

47 I P46(WAITZ2) *2 48 I NMIZ *2

49 O P42(HERROUTZ) *2 50 O WRZ0/BENZ0

51 I P47(WAITZ3) *2 52 I P41(WAITZ)

53 O RDZ 54 O WRZ1/BENZ1

55 O RP21(A21) 56 I/O RP34(D20)

57 O RP23(A23) 58 I/O RP36(D22)

59 - GND 60 - GND

61 O RP24(A24) 62 I/O RP35(D21)

63 O RP22(A22) 64 I/O RP37(D23)

65 O RP25(A25) 66 I/O RP10(D24)

67 O RP27(A27) 68 I/O RP11(D25)

69 O RP26(A26) 70 I/O RP12(D26)

71 O RP20(BCYSTZ) 72 I/O RP13(D27)

73 I/O RP30(D16) 74 I/O RP14(D28)

75 I/O RP32(D18) 76 I/O RP15(D29)

77 I/O RP33(D19) 78 I/O RP16(D30)

79 I/O RP31(D17) 80 I/O RP17(D31)

81 O P13(CSZ2) 82 I/O RP01 *2

83 - GND 84 - GND

85 O P12(CSZ3) 86 I/O RP00 *2

87 O RP07(WRZ3/BENZ3) 88 O CSZ0 *2

89 O RP06(WRZ2/BENZ2) 90 O P44(CSZ1) *2

91 I/O RP05 *2 92 O CSZ1(244) *1

93 I/O RP04 *2 94 I/O RP02 *2

95 O CSZ0(244) *1 96 O HWRZSEL *2

97 I/O RP03 *2 98 O BUSCLK

99 - +3.3V 100 I EXT_RSTINZ *2

35

●When using connector as external MCU interface

*1: The signal is output through 74S244.

*2: The signal is not used.

Pin # IO Dir. Signal Name Pin # IO Dir. Signal Name

1 - +3.3V 2 - +3.3V

3 I P40(HA1) 4 I A2

5 I A3 6 I A4

7 I A5 8 I A6

9 I A7 10 I A8

11 I A9 12 I A10

13 I A11 14 I A12

15 I A13 16 I A14

17 I A15 18 I A16

19 I A17 20 I A18

21 I A19 22 I A20

23 - GND 24 - GND

25 I/O HD0 26 I/O HD1

27 I/O HD2 28 I/O HD3

29 I/O HD4 30 I/O HD5

31 I/O HD6 32 I/O HD7

33 I/O HD8 34 I/O HD9

35 I/O HD10 36 I/O HD11

37 I/O HD12 38 I/O HD13

39 I/O HD14 40 I/O HD15

41 - GND 42 - GND

43 I WRSTBZ(HWRSTBZ) 44 I P43(HBUSCLK)

45 O P45(WAITZ1) *2 46 O RSTOUTZ *2

47 O P46(WAITZ2) *2 48 O NMIZ *2

49 O P42(HERROUTZ) 50 O WRZ0(HWRZ0/HBENZ0)

51 O P47(WAITZ3) *2 52 O P41(HWAITZ)

53 I RDZ(HRDZ) 54 I WRZ1(HWRZ1/HBENZ1)

55 I RP21(A21)5 *2 56 I/O RP34(HD20)

57 I RP23(A23)5 *2 58 I/O RP36(HD22)

59 - GND 60 - GND

61 I RP24(A24)5 *2 62 I/O RP35(HD21)

63 I RP22(A22)5 *2 64 I/O RP37(HD23)

65 I RP25(A25)5 *2 66 I/O RP10(HD24)

67 I RP27(A27)5 *2 68 I/O RP11(HD25)

69 I RP26(A26)5 *2 70 I/O RP12(HD26)

71 I RP20(HBCYSTZ) 72 I/O RP13(HD27)

73 I/O RP30(HD16) 74 I/O RP14(HD28)

75 I/O RP32(HD18) 76 I/O RP15(HD29)

77 I/O RP33(HD19) 78 I/O RP16(HD30)

79 I/O RP31(HD17) 80 I/O RP17(HD31)

81 I P13(CSZ2) *2 82 O RP01 *2

83 - GND 84 - GND

85 I P12(CSZ3) *2 86 I/O RP00 *2

87 I RP07(HWRZ3/HBENZ3) 88 I CSZ0(HCSZ)

89 I RP06(HWRZ2/HBENZ2) 90 I P44(HPGCSZ)

91 I/O RP05 *2 92 I CSZ1(244) *1 *2

93 I/O RP04 *2 94 I/O RP02 *2

95 I CSZ0(244) *1 *2 96 O HWRZSEL *2

97 I/O RP03 *2 98 O BUSCLK *2

99 - +3.3V 100 I EXT_RSTINZ *2

36

10.10. Analog Input Pin Header

Location: A-5

Board Silk: J2


Part #: HTK FFC-8AMEP1（or equivalent part）

* Only print patterns, no components mounted

1 8

10.11. GPIO Input Pin Header

Location: I-2

Board Silk: J1


Part #: HTK FFC-10AMEP1（or equivalent part）

* Only print patterns, no components mounted

1 10

Pin # IO Dir.R-IN32M4-CL2

Signal Name

1 I AIN0

2 I AIN1

3 I AIN2

4 I AIN3

5 I AIN4

6 I AIN5

7 I AIN6

8 I AIN7

Pin # IO Dir.R-IN32M4-CL2

Signal Name

1 I/O EXTP0

2 I/O EXTP1

3 I/O EXTP2

4 I/O EXTP3

5 I/O EXTP4

6 I/O EXTP5

7 I/O EXTP6

8 I/O EXTP7

9 I/O EXTP6

10 I/O EXTP7

37

11. Table of Unused Pins and Pad Connection Pins

11.1. Unused Pins

The following table shows the pins on the board that are not used by the

R-IN32M4-CL2 chips.

Pin Name Unused Pin State

TMC1Connect to GND via pull-down

resistance

TMC2Connect to GND via pull-down

resistance

TMODE0 Connect to GND



TEST1Connect to GND via pull-down

resistance

TEST2 Open

TEST3Connect to +3.3 V via pull-up

resistance

TEST4 Open

TEST5 Open

TEST6Connect to GND via pull-down

resistance

XT1Connect to GND via pull-down

resistance

OSCTHConnect to +3.3 V via pull-up

resistance

JTAGSELConnect to GND via pull-down

resistance

RSTOUTZ Open

HOTRESETZConnect to +3.3 V via pull-up

resistance

TRSTZ Open

NMIZConnect to +3.3 V via pull-up

resistance

38

11.2. PAD Connection Pins

The following pins are connected from R-IN32M4-CL2 and other chips to probing

pads.

PAD: 0.8mm pad (DIP)

Pin NamePAD Connection

Pin Number

Processing of PAD Connection

Pin

XT1 XT1Connect to GND via pull-down

resistance

RESETZ1 RESETZ1 -

PONRZ1 PONRZ1 -

HOTRESETZ1 HOTRESETZ1 -

NMIZ NMIZ1Connect to +3.3 V via pull-up

resistance

INPZ1 INPZ1 -

CLK25 CLK25 -

CLK80 CLK80 -

CLK209 CLK209 -

HBUSCLK1 HBUSCLK1 -

BUSCLK1 BUSCLK1 -

V24 V24 -

V5P0 V5P0 -

V3V3 V3V3 -

AV3V3 AV3V3 -

V2V5 V2V5 -

V1V0 V1V0 -

CLV5 CLV5 -

TEST4 TEST4 -

TEST5 TEST5 -

39

12. Default Factory Settings

The following section provides the default settings of the DIP-SW, Rotary-SW, and

jumpers.

12.1. DIP-SW/Rotary-SW

SW Value

SW1 Bit 1: ON

Other bits: OFF

SW2 ALL OFF

SW3 0

SW5 0

SW7 ALL ON

SW8 Bits 1 to 3: OFF

Bits 4 to 6: ON

SW9 ALL OFF

SW10 0

SW11 0

SW12 ALL OFF

SW21 0

SW22 0

SW23 ALL OFF

SW24 ALL OFF

12.2. MAC Address

The MAC address is provided on a seal attached to the board’s soldering side.

40

13. Board External Diagram



41

13.3. Dimensional Diagram

Documents

TS-R-IN32M4-CL2-E User’s Manual · 2017. 1. 26. · FPU 1.3M-byte Large-capacity RAM Operating frequency 100MHz Ext. Memory Flash memory (Serial) 64M-bit (Quad), MX25L6433FM2I-08G