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Wolfspeed RF GaN HEMT CGHV40100F

Title: WolfspeedCGHV40100F GaN HEMT

Pages: 66

Date: October 2016

Format: PDF & Excel file

Price: Full report: EUR 3,290

Wolfspeed (Infineon)offers a broad rangeof GaN RF productst h a t a r e i n h i g hdemand throughoutt h e e n e r g y, e l e -ctronics, industrial,

The 50V RF GaN HEMT from Wolfspeed is designed and manufactured with specific technical choices, making it

a unique product.

transportation, and military telecommunications sectors. Thecompany’s new CGHV40100 is a unique gallium-nitride (GaN) high-electron-mobility transistor operating from a 50-volt rail and up to3-GHz.

The CGHV40100 includes a single GaN-on-SiC HEMT die with an areaof 4.17mm2. To make the source connection, the device ismanufactured on ultra-thin wafer with gold vias. The HEMT shows thetypical GaN epitaxy structure for lateral device and a source-connected field plate.

The device is assembled in a SOT467C package with ceramic substratematerials that possess0an excellent combination of electrical,mechanical, and thermal properties. The flange material is CuMoCuheatsink, which has good mechanical properties but is quiteexpensive. Very specific and optimized choices went into the device’sdesign and manufacturing, resulting in a competitive, stunningproduct.

This report also includes complete chip and module fabricationprocess overviews, and an estimated cost.

Véronique is in charge ofstructure analysis of semi-conductors. She has a deepknowledge in chemical &physical technical analyses. Shepreviously worked for 20 yearsin Atmel Nantes Laboratory.

Author (Lab):VéroniqueLe Troadec

analyses for MEMS, IC andPower Semiconductors. Shehas a deep knowledge ofElectronics R&D andManufacturing environment.Elena holds a Master inNanotechnologies and a PhDin Power Electronics.

Elena Barbarini

Elena is in chargeo f c o s t i n g

AUTHORS:

sical analysis. He has a deepknowledge in chemical andphysical analyses. Hepreviously worked inmicroelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.

NicolasRadufe (Lab)

N i c o l a s i s i ncharge of phy-

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TABLE OF CONTENTS

Overview/Introduction• Executive Summary• Reverse Costing Methodology

Company ProfilePhysical Analysis• Synthesis of the Physical

Analysis• Package Package view and dimensions Package opening Package cross-section

• HEMT Die Die view & dimensions Die marking Die process Die cross-section Process characteristics

Manufacturing Process Flow • Overview• Wafer Fabrication Unit• Packaging Fabrication Unit

Cost Analysis• Synthesis of the Cost

Analysis• Main Steps of

Economic Analysis• Yields Synthesis• Die Cost Analysis Front-end cost Back-end 0: probe test

& dicing cost Wafer cost Die cost

• Packaging Cost Analysis Packaging cost Packaging step cost

• Components Cost

Selling Price Estimation• Financial Results and

Correction Factors• Manufacturer Price

POWER toolsCost simulation tool to evaluatethe cost of any POWER processor device: from single chip tocomplex structures.

POWER CoSim+ is a process-based costing tool used toevaluate the manufacturing costper wafer using your own inputsor using the pre-definedparameters included in the tool.

POWER Price+ is a parametriccosting tool used to evaluatethe manufacturing cost ofdevices using few processrelated inputs.

All these tools are on sale undercorporate licence.

ANALYSIS PERFORMED WITH OUR COSTING TOOLS POWER COSIM+ AND POWER PRICE+

Power CoSim+ Power Price+

Wolfspeed C3M™ Platform

SiC 900V MOSFET

Avago AFEM-9040Avago’s New Generation

Front-End Module

GaN Systems 650V GaN on Silicon

HEMT

Wolfspeed has proposed the first900V SiC MOSFET device, a planarMOSFET with lower Rdson, smallersize, and higher current density.

Avago has introduced a newgeneration of film bulk acousticresonator (FBAR-BAW) technologyin the Samsung Galaxy S7.

AT&S ECP® embedded power diepackage. 650V 52mΩenhancement mode GaNtransistor in the new AT&SEmbedded Power Die Package.

Pages: 81Date: August 2016Full report: EUR 3,490*

Pages: 112Date: June 2016Full report: EUR 3,290*

Pages: 110Date: January 2015Full report: EUR 2,990*

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