ZXMP S325(V2.00) Product Descriptions

ZXMP S325SDH Based Multi-Service Node Equipment

Product Descriptions

Version 2.00

ZTE CORPORATION ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P. R. China 518057 Tel: (86) 755 26771900 800-9830-9830 Fax: (86) 755 26772236 URL: http://support.zte.com.cn E-mail: [email protected]

http://support.zte.com.cn/

mailto:[email protected]

LEGAL INFORMATION Copyright © 2006 ZTE CORPORATION. The contents of this document are protected by copyright laws and international treaties. Any reproduction or distribution of this document or any portion of this document, in any form by any means, without the prior written consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by contractual confidentiality obligations. All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE CORPORATION or of their respective owners. This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose, title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the use of or reliance on the information contained herein. ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications covering the subject matter of this document. Except as expressly provided in any written license between ZTE CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter herein. ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice. Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information. The ultimate right to interpret this product resides in ZTE CORPORATION.

Revision History

Date Revision No. Serial No. Reason for Issue

2008/05/13 R1.0 sjzl20081238 First edition

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Document Name Unitrans ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment Product Descriptions

Product Version V2.00 Document Revision Number R1.0

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Contents

About this Manual ................................................................. i

Purpose .................................................................................... i Intended Audience ..................................................................... i Prerequisite Skill and Knowledge .................................................. i What is in This Manual ................................................................ i Related Documentation .............................................................. ii Conventions ............................................................................. ii How to Get in Touch ................................................................. iii

Chapter 1.............................................................................. 1

System Functions................................................................. 1

Service Functions................................................................1 Optical Interface Functions .........................................................1 Electrical Interface Functions ......................................................4 Orderwire Phone Function...........................................................5 Multi-Service Function................................................................5

System Control and Communication Functions ........................6

Power Supply Function.........................................................7

Overhead Processing Function...............................................7

Timing and Synchronization Output Function...........................7

Alarm Input/Output Function ................................................8

Alarm Concatenation Function...............................................8

EMS Alarm Function ............................................................9

Tandem Connection Monitoring Function.................................9

Cross-Connect Function .......................................................9

Protection Function ........................................................... 13

Equipment Level Protections ..................................................... 13 Network Level Protections ........................................................ 15

Chapter 2............................................................................17

Technical Specifications.....................................................17

Physical Performance......................................................... 17 Dimensions and Weight............................................................ 17 Bearing Requirement for Equipment Room.................................. 18

Power Supply Requirements ............................................... 19 Power Range .......................................................................... 19 Power Consumption................................................................. 19

Environment Requirements ................................................ 26 Grounding Requirements .......................................................... 26 Temperature and Humidity Requirements ................................... 26 Cleanness Requirements .......................................................... 27

EMC Requirements ............................................................ 28

Overview ............................................................................... 28 EMS ...................................................................................... 28 EMI ....................................................................................... 31

Optical Interface Specifications ........................................... 32 Transmission Code Pattern ....................................................... 32 Optical Modules....................................................................... 32 Eye Diagram of Optical Transmit Signals..................................... 33 Mean Optical Launched Power ................................................... 34 Extinction Ratio....................................................................... 35 Receiver Sensitivity ................................................................. 35 Receiver Overload ................................................................... 36 Mean Optical Received Power .................................................... 36 Permitted Frequency Deviation of Optical Input Interfaces............. 37 AIS Rate of Optical Output Interfaces ......................................... 37

Electrical Interface Specifications ........................................ 38

Code Patterns of Electrical Interface........................................... 38 Permitted Attenuation of Input Interfaces ................................... 38 Frequency Deviation of Input Interfaces ..................................... 38 Bit Rate Tolerance of Output Interfaces ...................................... 39 Reflection Attenuation of Input/Output Interfaces ........................ 39 Anti-Interference Capability of Input Interfaces ........................... 40 Waveform of Output Interfaces ................................................. 41

Jitter Specifications of Interfaces......................................... 46 Jitter and Wander Tolerance of PDH Input Interface ..................... 46 Jitter and Wander Tolerance of SDH Input Interface ..................... 50 Inherent Output Jitter of STM-N Interface ................................... 52 Output Jitter of Network Interface.............................................. 53

Mapping Jitter of PDH Tributary ................................................. 53 Combined Jitter....................................................................... 54 Jitter Transfer Characteristic of Regenerator................................ 55

Clock Timing and Synchronization Characteristics .................. 56 Timing Principles ..................................................................... 56 Output Jitter........................................................................... 56 Allowable Input Attenuation ...................................................... 56 Allowable Input Frequency Deviation.......................................... 57 Bit Rate Tolerance of Output Interface Signal .............................. 57 Waveform of Output Interface................................................... 57 Timing Reference Source Switching............................................ 57 Long-Term Phase Variation in Locked Mode................................. 58 Clock Accuracy in Hold Mode..................................................... 58 Frequency Accuracy of Internal Oscillator in Free-oscillation Mode .. 59

OA Board Specifications ..................................................... 60

Ethernet Specifications ...................................................... 62 Ethernet Interface Specifications ............................................... 62 Transparent Transmission Performance Specifications................... 62 VLAN Specifications ................................................................. 63 L2 Switching Specifications ....................................................... 63

ATM Characteristics ........................................................... 65

VP/VC Exchange ..................................................................... 65 Range of VPI/VCI Value............................................................ 66 VP/VC Multicast....................................................................... 67 Transmission Priority of ATM Cells.............................................. 67 VP-Ring Protection................................................................... 67 Protection between Layers ........................................................ 68 ATM Transmission Performance ................................................. 68

RPR Performance Specifications .......................................... 70 Burst Interval ......................................................................... 70 RPR Loop Protection Switching Time........................................... 70 Address Buffering Capability ..................................................... 71 RPR Ring Network Bandwidth .................................................... 71 Service Characteristics ............................................................. 71 Protection between Layers ........................................................ 72

External Interface Recommendations ................................... 74 155520 kbit/s, 622080 kbit/s, 2488320 kbit/s Optical Interfaces.... 74 155520 kbit/s Electrical Interface .............................................. 74

1544 kbit/s, 2048 kbit/s, 34368kbit/s, 44736 kbit/s Electrical Interfaces .............................................................................. 74 2.048 MHz Network Clock Synchronous Interface......................... 75 Dual-line Interface of Orderwire Phone ....................................... 75 Ethernet Interfaces.................................................................. 75

Chapter 3............................................................................77

Recommendations/ Standards..........................................77

Appendix A.........................................................................79

Abbreviations.....................................................................79

Figures................................................................................83

Tables .................................................................................85

Confidential and Proprietary Information of ZTE CORPORATION i

About this Manual

Purpose

This manual describes ZXMP S325 system product features, technical specifications and standards.

Intended Audience

This document is intended for engineers and technicians who can perform activities on ZXMP S325 SDH Based Multi-Service Node Equipment.

Prerequisite Skill and Knowledge

Users must have basic SDH knowledge to use this document effectively. Familiarity with the following is helpful:

ZXMP S325 system and its various components

NCP operations

EMS operations

What is in This Manual

This manual contains the following chapters:

T AB L E 1 . C H AP T E R S U M M AR Y

Chapter Summary

Chapter 1

System Functions

Explains about the system functions.

Chapter 2

Technical Specifications

Discusses about the technical specifications.

Chapter 3

Recommendations/ Standards

Explains about different recommendations/standards.

ZXMP S325 (V2.00) Product Descriptions

ii Confidential and Proprietary Information of ZTE CORPORATION

Related Documentation

The following documentation is related to this manual:

Unitrans ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment System Descriptions

Unitrans ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment Hardware Manual

Unitrans ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment Installation Manual

Unitrans ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment Maintenance Manual

Unitrans ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment Operation Instructions

Conventions

ZTE documents employ the following typographical conventions.

T AB L E 2 . TY P O G R AP H I C AL C O N V E N T I O N S

Typeface Meaning

Italics References to other Manuals and documents.

“Quotes” Links on screens.

Bold Menus, menu options, function names, input fields, radio button names, check boxes, drop-down lists, dialog box names, window names.

CAPS Keys on the keyboard and buttons on screens and company name.

Constant width Text that you type, program code, files and directory names, and function names.

[ ] Optional parameters.

Mandatory parameters.

| Select one of the parameters that are delimited by it.

Note: Provides additional information about a certain topic.

Checkpoint: Indicates that a particular step needs to be checked before proceeding further.

Tip: Indicates a suggestion or hint to make things easier or more productive for the reader.

Typographical Conventions

About this Manual

Confidential and Proprietary Information of ZTE CORPORATION iii

T AB L E 3 . M O U S E OP E R AT I O N C O N V E N T I O N S

Typeface Meaning

Click Refers to clicking the primary mouse button (usually the left mouse button) once.

Double-click Refers to quickly clicking the primary mouse button (usually the left mouse button) twice.

Right-click Refers to clicking the secondary mouse button (usually the right mouse button) once.

Drag Refers to pressing and holding a mouse button and moving the mouse.

How to Get in Touch

The following sections provide information on how to obtain support for the documentation and the software.

If you have problems, questions, comments, or suggestions regarding your product, contact us by e-mail at [email protected]. You can also call our customer support center at (86) 755 26771900 and (86) 800-9830-9830.

ZTE welcomes your comments and suggestions on the quality and usefulness of this document. For further questions, comments, or suggestions on the documentation, you can contact us by e-mail at [email protected]; or you can fax your comments and suggestions to (86) 755 26772236. You can also browse our website at http://support.zte.com.cn, which contains various interesting subjects like documentation, knowledge base, forum and service request.

Mouse Operation

Conventions

Customer Support

Documentation Support


iv Confidential and Proprietary Information of ZTE CORPORATION


Confidential and Proprietary Information of ZTE CORPORATION 1

C h a p t e r 1

System Functions

In this chapter, you will learn about: Service functions of the ZXMP S325

Non-service functions of the ZXMP S325

Service Functions Optical Interface Functions

The ZXMP S325 provides two types of optical interfaces: STM-4 and STM-1, as shown in Table 4.

T AB L E 4 . OP T I C AL I N T E R F A C E S P R O V I D E D B Y T H E ZXMP S325

Interface Type

Rate (kbit/s)

Processing Board ID

Board Integration (channel per board)

Maximum Access Capacity per Subrack (channel)

STM-16 2488320 OCS16, OL16x1 1 5

STM-4 622080 OCS4, LP4x1, LP4x2, OL1/4x4 1, 2, 3, or 4 13

STM-1 155520 OCS4, LP1x1, LP1x2, OL1/4x4

1, 2, 3, or 4 24

Notes:

The STM-1/4 optical interfaces provided by OL1/4x4 board support the single-fiber bidirectional application.

Due to motherboard capacity limit, OL1/4x4 boards in different slots provide different optical services. Refer to the Board Configurations in Subrack section in the manual of Unitrans


2 Confidential and Proprietary Information of ZTE CORPORATION

ZXMP S325(V2.00) SDH Based Multi-Service Node Equipment System Descriptions.

STM-16 optical service is implemented by OCS16 board or OL16x1 board.

OCS16 board provides one pair of STM-16 optical interfaces.

OL16x1 board provides one pair of STM-16 optical interfaces.

Table 5 lists the STM-16 optical interfaces provided by ZXMP S325.

T AB L E 5 . STM-16 OP T I C AL I N T E R F AC E S P R O V I D E D B Y ZXMP S325

Optical Interface Type

Optical Source Nominal Wavelength (nm)

Transmission Distance (km)

Connector Type

Service Capacity (channel per board)

S-16.1 1310 ≤15 LC/PC 1

S-16.2 1550 ≤15 LC/PC 1

L-16.1 1310 ≤40 LC/PC 1

L-16.2 1550 ≤80 LC/PC 1

L-16.2U 1550 ≤150 LC/PC 1

If the aggregate interface is at STM-16 level, OCS16(L-16.2) board or OL16x1(L-16.2) can work with OA board to implement non-regenerator long-haul transmission.

STM-4 optical service is implemented by LP4x1 board, LP4x2 board, OCS4 board, or OL1/4x4 board.

OCS4 board provides one pair of optical interfaces.

LP4x1 board can process one channel of STM-4 optical service. OIS4x1 board provides one pair of optical interfaces for LP4x1 board.

LP4x2 board can process two channels of STM-4 optical service. OIS4x2 board provides two pairs of optical interfaces for LP4x2 board.

OL1/4x4 board can process at most four channels of STM-4 optical service.

With OCS16 board installed, OL1/4x4 board can process at most four channels of STM-4 optical service.

With OCS4 board installed, OL1/4x4 board can process one channel of STM-4 optical service.

Its front panel provides physical optical interfaces.


STM-16 Optical Interface


Chapter 1 - System Functions






Connector Type


S-4.1 1310 ≤15 SC/PC or LC/PC 1, 2, 3, or 4

L-4.1 1310 ≤40 SC/PC or LC/PC 1, 2, 3, or 4

L-4.2 1550 ≤80 SC/PC or LC/PC 1, 2, 3, or 4

Notes:

The optical interface connectors of OIS4x1 board and OIS4x2 board are of type SC/PC.

The optical interface connectors of OCS4 board and OL1/4x4 board are of type LC/PC.

If the aggregate interface is at STM-4 level, LP4x1 (L-4.2) board, LP4x2 (L-4.2) board, OCS4 (L-4.2) board, or OL1/4x4 (L-4.2) board can work with OA board to implement non-regenerator long-haul transmission.

STM-1 optical service is implemented by LP1x1 board, LP1x2 board, OCS4 board, or OL1/4x4 board.

OCS4 board provides one pair of optical interfaces.

LP1x1 board can process one channel of STM-1 optical service. OIS1x1 board provides one pair of optical interfaces for LP1x1 board.

LP1x2 board can process two channels of STM-1 optical service. OIS1x2 board provides two pairs of optical interfaces for LP1x2 board.

OL1/4x4 board can process at most four channels of STM-1 optical service. Its front panel provides physical interfaces.






Connector Type


S-1.1 1310 ≤15 SC/PC or LC/PC 1, 2, 3, or 4

L-1.1 1310 ≤40 SC/PC or LC/PC 1, 2, 3, or 4

L-1.2 1550 ≤80 SC/PC or LC/PC 1, 2, 3, or 4




Notes:

The optical interface connectors of OIS1x1 board and OIS1x2 board are of type SC/PC.

The optical interface connectors of OCS4 board and OL1/4x4 board are of type LC/PC.

If the aggregate interface is at STM-1 level, LP1x1 (L-1.2) board, LP1x2 (L-1.2) board, OCS4 (L-1.2) board, or OL1/4x4 (L-1.2) board can work with OA board to implement non-regenerator long-haul transmission.

Electrical Interface Functions

ZXMP S325 provides STM-1 electrical interfaces and PDH electrical interfaces as listed in Table 8.

T AB L E 8 . E L E C T R I C AL I N T E R F A C E S P R O V I D E D B Y T H E ZXMP S325

Interface Type

Rate (kbit/s)

Processing Board ID

Interface Board ID

Physical Interface Type

Matched Impedance (Ω)

Board Integration (channel/ board)

Subrack Maximum Access Capacity (channel)

STM-1(e) 155520 LP1x1 or LP1x2 ESS1x2

1.0/2.3 bended PCB welded (with screws installed) socket (female)

75 1 or 2 12

E3 34368 EP3x3 ESE3x3


75 3 18

T3 44736 EP3x3 ESE3x3


75 3 18



Interface Type

Rate (kbit/s)

Processing Board ID

Interface Board ID

Physical Interface Type

Matched Impedance (Ω)

Board Integration (channel/ board)

Subrack Maximum Access Capacity (channel)

E1 2048 EPE1x21 or EPE1B ESE1x21

50×2 overlapped 3-wall bended PCB welded flat cable socket (male)

75 or 120 21 126

T1 1544 EPT1x21 or EPE1B ESE1x21

50×2 folded 3-wall bended PCB welded flat cable socket (male)

100 21 126

Note: Refer to Table 11 for meanings of board Ids.

Orderwire Phone Function

The ZXMP S325 can access one channel of orderwire phone. The orderwire phone interface adopts type RJ11 socket and locates at the front panel of NCP board.

Orderwire phone is implemented by E1 or E2 overhead byte. E2, F1, R2C9 (the byte located at the second row and the ninth column in STM frame), or D12 byte can be selected as the orderwire protection byte.

Multi-Service Function

The ZXMP S325 can process Ethernet service and ATM service. It provides the following interfaces listed in Table 6 for multi-service function.

T AB L E 6 .M U L T I -S E R V I C E I N T E R F AC E S P R O V I D E D B Y T H E ZXMP S325

Interface Type

Processing Board ID

Interface Board ID

Connector Type



FE optical SFEx6 OIS1x4 LC/PC 4 24



Interface Type

Processing Board ID

Interface Board ID

Connector Type



interface

FE electrical interface SFEx6 EIFEx4 RJ45 4 24

ATM service optical interface

AP1x4 OIS1x4 LC/PC 4 24

GE optical interface (RPR)

RSEB EIFEx4, OIS1x4 RJ45, LC/PC 2 12

Note: Refer to Table 11 for meanings of board Ids.

System Control and Communication Functions The system control and communication functions are carried out by the NCP board. The functions include:

Sending configuration commands to MCUs and collecting their performance and alarm information.

Exchanging network management information between NEs through the embedded control channel (ECC), and supporting the selection of DCCr, DCCm, and DCCr+m.

Note: The ECC provides the function of transmitting network maintenance information through the data communication channel (DCC) which is the physical layer of ECC. The DCC carries communication data between NEs, including DCC bytes in the regenerator section (DCCr) and DCC bytes in the multiplex section (DCCm).

Implementing the connection of orderwire phones between NEs through the section overhead bytes E1 and E2 in the SDH frame.

Through the Qx interface, it reports to SMCC (Subnet Management Control Center) the alarm and performance information of this NE and of the subnet which the NE belongs to, and receives commands and configurations sent from the SMCC to the NE and subnet. The Qx interface works for communication between NE and SMCC.



Detecting fan status of the NE. Fan speed can be set to “half” or “full” in the EMS. If the fan stops running when equipment is working, the EMS will report alarm.

Monitoring the board-in-position status and over/under-voltage of the power supply board.

Power Supply Function Power supply for the subracks of the ZXMP S325 is supplied by the power boards.

Distributed power supply mode is employed in the ZXMP S325 to supply power to each subrack separately. Each subrack is equipped with two power supply boards (PWR) for 1+1 protection.

Overhead Processing Function The overhead processing function of ZXMP S325 is performed by NCP board and optical line boards.

Optical line boards separate section overheads from payload in SDH data frame and integrate these overheads into an overhead bus. All the boards (including OCS4 board, optical line board, and NCP board) read or insert corresponding overhead bytes from or to the overhead bus.

The ZXMP S325 supports the overhead cross-connect function. The overhead can be configured to any port as required by the EMS.

Timing and Synchronization Output Function The master-slave synchronization mode is adopted between ZXMP S325 equipments. The OCS16 board or OCS4 board performs timing and synchronization functions, including: clock source selection, clock source switching, and clock exporting

There are multiple ways to get the clock source, including:

Tracing external timing reference

Locking onto a line clock in a certain direction

Locking onto the internal clock

Clock Source Selection



The system allows configuring ten line clock sources and two external clock sources at the same time.

The clock source switching occurs under any of the following three cases:

The current clock source is lost

A clock source of higher quality level recovers

The current clock source deteriorates

The system clock supports the synchronous priority switching and SSM algorithm-based automatic switching.

In complex networks, the application of SSM algorithm-based automatic switching can optimize the timing and synchronization distribution of the network, reduce the difficulty of synchronization planning, and avoid timing loops, thus ensuring the optimal network synchronization.

ZXMP S325 supports the export of two channels of 2 Mbit/s or 2 MHz external reference clock signals. The output interface of external reference clock is supplied by SAI board (system auxiliary interface board).

Alarm Input/Output Function The ZXMP S325 supports the function of external alarm Boolean value input, and the corresponding physical interface is provided by the SAI board. The equipment can access at most four channels of external alarms to detect the alarms of fans, access control, and ambient temperature.

The ZXMP S325 supports two channels of alarm output, and the corresponding physical interface is provided by the SAI board. The equipment outputs the alarm signal via the touch point switch, and outputs the alarm ringing signals, critical alarm, major alarm, and minor alarm signals to the column head cabinet in the equipment room.

Alarm Concatenation Function The ZXMP S325 supports the function of alarm concatenation, and the corresponding physical interface is provided by the SAI board. The subrack alarm concatenation output interface (i.e. the alarm output interface) can directly connect to that of another ZXMP S325 subrack to implement alarm concatenation of multiple ZXMP S325 equipments.

Clock Source Switching

Clock Exporting

External Alarm Input Interface

Alarm Output Interface



EMS Alarm Function ZXMP S325 supports the following EMS alarms besides the common SDH equipment alarms in EMS.

ZXMP S325 can detect time-division cross-connect alarm at AU level and TU level, such as AU-AIS, AU-LOP, HP-UNEQ, TU-AIS, and TU-LOP.

ZXMP S325 supports verification of optical module. The EMS will report alarm for unverified optical module.

Tandem Connection Monitoring Function The OCS16 or OCS4 board of ZXMP S325 supports the newly added HP-TCM (Higher-order Path Tandem Connection Monitoring) function.

As specified in ITU-T G.707 Recommendation, the tandem connection layer locates between the multiplex section and the path section. Tandem connection mainly applies to inter-office communication, especially at the border between different network carriers.

This function is implemented by N1 higher-order path overhead byte. It can detect the number of B3 block errors received in a carrier’s networks and the number of B3 block errors transferred to next carrier’s network.

Cross-Connect Function Optical line boards and/or electrical tributary boards of ZXMP S325 can cross-connect signals at AU-4, TU-3, TU-12, and TU-11 levels. In addition, they implement protection switching via cross-connect matrix.

Configured with OCS16 board, ZXMP S325 can implement higher-order cross-connect of 92×92 AU-4s, and lower-order cross-connect of 2016×2016 TU12s.

OCS16 or OCS4 board of ZXMP S325 can perform the functions of a DXC (Digital Cross Connect) equipment to implement the pass-through, broadcast, add/drop, and cross-connect of services.

The pass-through, broadcast, and add/drop modes are subsets of the cross-connect function. In the equipment, both the tributary electrical interfaces and optical line interfaces are connected to the

Overview



cross-connect network and their connections are equivalent. Therefore, the inter-interface services can be cross-connected in any form, as illustrated in Figure 1.

F I G U R E 1 . I N T E R F AC E S O F T H E ZXMP S325 DXC E Q U I P M E N T

STM-1/STM-4/STM-16 STM-1/STM-4/STM-16

STM-1/STM-4/STM-16 T1/E1/T3/E3/STM-1 (electrical)

DXC

.

.

.

.

.

.

. . .

The line service is imported into the cross-connect matrix through the interface at one side and is exported in the same time slot at the other side. The equipment acts as a regenerator.

The signal cross-connect in the pass-through mode is illustrated in Figure 2.

F I G U R E 2 . P AS S -T H R O U G H M O D E

West East

The service signals received from the line are dropped to a tributary according to the predefined timeslot, or the tributary service signals are added to the line according to the configured timeslot.

The add/drop service signals in the tributary of the ZXMP S325 can be allocated to any available timeslot in the line. The add service timeslots can be the same as or different from the drop service timeslots.

The signal cross-connect in the add/drop mode is shown in Figure 3.

F I G U R E 3 . AD D /D R O P M O D E

Pass-through

Add/Drop



The ZXMP S325 supports three broadcast modes, as illustrated in Figure 4.

(a) Broadcast between lines

(b) Broadcast of internal timeslots in line

(c) Broadcast between lines and tributaries: dropping a service signal from a line to more than two tributary timeslots at the same time, or adding the tributary service signal to more than two line timeslots

These three broadcast modes can be carried out simultaneously.

F I G U R E 4 . BR O A D C AS T M O D E S

The service cross-connect mode is illustrated in Figure 5.

F I G U R E 5 . CR O S S -C O N N E C T M O D E

The cross-connect between lines is used for protection switching, path selection, and service mediation, which is helpful for improving network viability and band utilization ratio.

The cross-connect between lines and tributaries provides the flexible service add/drop function.

The cross-connect between tributaries is helpful for saving investments in network constructions and saving timeslot resources in the backbone network.

Broadcast

Cross-connect



As shown in Figure 6, the service interworking between the NE T1 and NE T2 can be achieved on the backbone network through NE A. It can also be implemented through forming a direct service route through NE A without establishing another line between T1 and T2 or adding equipment.

F I G U R E 6 . AP P L I C AT I O N O F C R O S S -C O N N E C T B E T W E E N TR I B U T AR I E S

NE A

NE T1 NE T2

Line Line

Tributary

The cross-connect function of ZXMP S325 also supports network maintenance and test during networking and operation.



Protection Function The ZXMP S325 provides protections at two levels:

Equipment level protections

Network level protections

Equipment Level Protections

The equipment level protections include the power protection, cross-connect protection, clock protection, and the 1:N protection for electrical service processor boards.

Out-of-cabinet power protection

Two groups of -48 V power supplies in the equipment room are connected to the ZXMP S325 equipment. The external power supply 1+1 protection ensures that the equipment operates normally when either power group fails.

The power distribution box can provide up to 12 channels of power supply to the subrack, each two channels as a group. Each group can provide power supply in the active/standby mode. At most six groups of active/standby power supply can be provided.

Inside-cabinet power protection

Each subrack of the ZXMP S325 can be configured with two power supply boards, connected to the active power supply and the standby power supply respectively for 1+1 protection. When the active or standby power supply fails, the power alarm will be reported to the EMS.

Configured with one active OCS16 or OCS4 board and one standby OCS16 or OCS4 board, ZXMP S325 can implement the 1+1 protection for cross-connect and clock.

In case of fault, the system can control the switching between the two OCS16 or OCS4 boards automatically.

The two OCS16 or OCS4 boards can work in 1+1 hot backup mode. The ZXMP S325 can also be equipped with one OCS16 or OCS4 board.

When configured with one active and one standby OCS16 or OCS4 boards, and they are both in position and work normally, only the clock of the active OCS16 or OCS4 board is exported to the motherboard. If one OCS16 or OCS4 board fails, the clock is switched to the other OCS16 or OCS4 board.

Power Protection

Cross-Connect Protection

Clock Protection



ZXMP S325 can implement the 1:N (N≤6) protection for E1/T1 service processor board, 1:N (N≤5) protection for FE service processor board, and 1:N (N≤5) protection for E3/T3/STM-1 electrical service processor board. The system can support at most two groups of 1:N protections.

1:N protection for E1/T1 service processor board

The ZXMP S325 can support at most 1:6 protection for E1/T1 service processor board. The active board can choose any slot among the six tributary board slots, while the standby board slot has two choices:

The standby board can choose any slot among the six tributary slots

Using this method, the system can implement at most 1:5 tributary protection; meanwhile, the interface board slot corresponding to the standby board slot need to be configured with the BIE1x21 board (E1/T1 electrical interface bridge board).

The standby board can choose the dedicated slot for E1/T1 standby board

Using this method, the system can implement at most 1:6 tributary protection; meanwhile, there is no need to install the BIE1x21 board.

1:N protection for FE service processor board

The ZXMP S325 can support at most 1:5 protection for FE service processor board. The standby board can choose any slot among the six tributary board slots.

1:N protection for E3/T3/STM-1 (electrical) service processor board

The ZXMP S325 can support at most 1:5 protection for E3/T3/STM-1 (electrical) service processor board. The standby board can only occupy slot 1, i.e. the first slot of the six tributary board slots.

1:N Protection for Electrical

Service Processor

Boards



Note: The protection for E1/T1/FE service processor board belongs to the same protection type, while the protection for E3/T3/STM-1 (electrical) service processor board belongs to another protection type. One ZXMP S325 subrack can simultaneously support two groups of protections with different protection types, but cannot simultaneously support multiple groups of service protections with the same protection type. For example, one subrack does not simultaneously support two groups of 1:N protections for E1 service processor board; however, it supports 1:N protection for E1 service processor board and for E3 service processor board simultaneously.

Network Level Protections

ZXMP S325 supports the following network protection modes recommended by ITU-T:

MS chain 1+1 protection

MS chain 1:1 protection

2-fiber unidirectional path protection ring

2-fiber bidirectional path protection ring

2-fiber bidirectional MS protection ring with extra service

2-fiber bidirectional MS protection ring without extra service

STM-4/STM-16 4-fiber bidirectional MS protection ring

DNI (Dual Node Interconnection) protection

Subnet Connection Protection (SNCP), including SNC (I) which is subnet connection protection with inherent monitoring, and SNC (N) which is subnet connection protection with no interfered monitoring.





C h a p t e r 2

Technical Specifications

In this chapter, you will learn about technical specifications of the ZXMP S325, including:

Physical performance

Requirements for power supply, environment, and electromagnetic compatibility

Technical specifications of optical and electrical interfaces, as well as optical amplifier board

Jitter specifications of ZXMP S325 interfaces

Clock timing and synchronization characteristics

Specifications of Ethernet interfaces, ATM characteristics

ITU-T recommendations or standards complied by the ZXMP S325 external interfaces

Physical Performance Dimensions and Weight

The dimensions and weights of the ZXMP S325 components are listed in Table 7.

T AB L E 7 . D I M E N S I O N S AN D W E I G H T S O F ZXMP S325 CO M P O N E N T S

Component Dimensions (Height × Width × Depth) (Unit: mm)

Weight

(Unit: kg) Remarks

2000 × 600 × 300 59 Weight of an empty cabinet

ZXMP unified 300 mm deep cabinet

2200× 600 × 300 65 Weight of an empty cabinet



Component Dimensions (Height × Width × Depth) (Unit: mm)

Weight

(Unit: kg) Remarks

2600 × 600 × 300 77 Weight of an empty cabinet

ZXMP S325 subrack 221. 5 × 482.6 × 270 9

Includes motherboard, fan plug-in box, dustproof unit)

Power distribution box

132.5 (3U) × 482.6 × 269.5

7 With electronic components

Motherboard 214.6 × 438.4 × 4.5 1.500 -

Fan box

PCB: 90 ×1.6 × 70

Size after assembly:

21.5 × 139.6 × 244.8

0.520

Includes structural parts and hardware circuits

Dustproof unit 13.1 × 279.6 × 253 Accounted in subrack weight

Power supply board

PCB: 2 × 72 × 170

Front panel: 25 (Height) × 74 (Width)

Refer to Table 11

-

Functional/ service board

PCB: 160 × 2 × 210

Front panel: 181.5 (Height) × 25.4 (Width)

Refer to Table 11

-

Functional/ service interface board

PCB: 160 × 2 × 80

Front panel: None Refer to Table 11

-

Bearing Requirement for Equipment Room

The bearing capability of the equipment room should be over 450 kg/m2 to hold the ZXMP S325 equipment only.

Chapter 2 - Technical Specifications


Power Supply Requirements Power Range

Rated working current: Max. 5 A

Nominal voltage: -48 VDC

Fluctuation range: -57 VDC to -40 VDC

Power Consumption

The power consumption of the whole system depends on system configuration. It is less than 250 W with full configuration.

Power Consumptions of Boards

Table 11 lists power consumptions and weights of boards in the ZXMP S325.

T AB L E 11 . P O W E R C O N S U M P T I O N S O F BO A R D S I N ZXMP S325

Board ID Board Name

Max Power Consumption (25 Cº) (W)

Min Power Consumption (45 Cº) (W)

Weight (kg) Remarks

NCP NE control processor 4.37 4.50 0.430 -

SAI System auxiliary interface board

2.16 2.22 0.160

The impedance of clock input/output interface is 75 Ω.

PWR -48 V power supply board 3 3.09 0.160 -

FAN Fan board 8.04 8.28 0.520 -

- SFP optical module 0.80 0.82 0.020 -

16.17 16.66 STM-1 application

OCS4

STM-4 optical line, cross-connect, and synchronous clock board

16.95 17.46

0.550 STM-4 application



Board ID Board Name



Weight (kg) Remarks

OCS16

STM-16 optical line, cross-connect, and synchronous clock board

20.88 21.51 0.460 -

OL1/4x4(4x STM-1) 9.60 9.89 0.485

OL1/4x4(3x STM-1) 7.71 7.94 0.465

OL1/4x4(2x STM-1) 6.74 6.94 0.445

OL1/4x4(1x STM-1) 5.78 5.95 0.425

OL1/4x4(4x STM-4) 11.76 12.11 0.485

OL1/4x4(3x STM-4) 10.04 10.34 0.465

OL1/4x4(2x STM-4) 8.32 8.57 0.445

OL1/4x4

OL1/4x4(1x STM-4) 6.56 6.76 0.425

-

OL16x1 1-channel STM-16 optical line board

14.11 14.39 0.410 -

LP1x1 1-channel STM-1 line processor

0.355 -

OIS1x1 1-channel STM-1 optical interface board

5.75 (LP1x1 and OIS1x1)


0.125 -


0.375 -




0.145 -


0.360 -




0.125 -



13.45 (LP4x2 and OIS4x2) 0.380 -



Board ID Board Name



Weight (kg) Remarks


0.145 -


2.16 2.22 0.185

Provides optical interface for SFEx6, RSEB, AP1x4 boards

OBA12 Optical booster amplifier OBA12

3.98 8.98 0.490 Use EDFA module with no cooling

OBA14 Optical booster amplifier OBA14

4.94 9.94 0.490 Use EDFA module with no cooling

BIS1 STM-1 interface bridge board

2.59 2.67 0.105 -

ESS1x2

2-channel STM-1 electrical interface switching board

2.20 (4.62) 2.26 (4.76) 0.140

The numbers in parentheses are consumptions after switching.

EPE1x21 (75)

21-channel E1 electrical processor

4.42 4.55 0.420 The interface impedance is 75 Ω

EPE1x21 (120)

21-channel E1 electrical processor


EPT1x21

21-channel T1 electrical processor


EP1EB

21-channel E1/T1 electrical processor

7.39 7.61 0.420 -

BIE1x21

21-channel E1/T1 interface bridge board

0 0 0.090

Has no active devices and consumption can be ignored



Board ID Board Name



Weight (kg) Remarks

ESE1x21 (75)

21-channel E1 electrical interface switching board

0.50 (6.29) 0.51 (6.48) 0.160

The interface impedance is 75 Ω. The numbers in parentheses are consumptions after switching

ESE1x21 (120)

21-channel E1/T1 electrical interface switching board

0.50 (6.29) 0.51 (6.48) 0.160

The interface impedance is 120 Ω or 100 Ω. The numbers in parentheses are consumptions after switching

EP3x3

3-channel E3/T3 electrical processor

6.96 7.17 0.400 -

BIE3x3

3-channel E3/T3 electrical interface bridge board

3.00 3.09 0.115 -

ESE3x3

3-channel E3/T3 electrical interface switching board

2.13 (4.13) 2.19 (4.25) 0.145

The numbers in parentheses are consumptions after switching

SFEx6 (PPP)

Smart fast Ethernet board 19.54 20.13 0.430 -

SFEx6 (GFP)

Smart fast Ethernet board 21.27 21.91 0.430 -

EIFEx4

4-channel Ethernet electrical interface board

0.43 (2.28) 0.443 (2.35) 0.150

The numbers in parentheses are consumptions after switching

BIFE Ethernet interface bridge board

0 0 0.090

Has no active devices and consumption can be ignored



Board ID Board Name



Weight (kg) Remarks

AP1x4 4-channel ATM processor 16.52 17.02 0.430 -

RSEB Ethernet Processor with RPR Function

26.83 27.63 0.735 -

Notes: 1. The weights of OCS4, OCS16, optical line boards, and optical interface boards

include the weights of SFP modules. 2. Power consumptions of boards shall be higher during equipment startup and in low

temperature environment. Therefore, the power capacity provided by the equipment should be 1.5 to 1.8 times the power consumptions listed in the table.

Power Consumptions of Typical System Configurations

Table 9 to Table 11 list the power consumptions of three typical ZXMP S325 configurations.

T AB L E 9 . ZXMP S325 P O W E R C O N S U M P T I O N S (TY P I C A L C O N F I G U R AT I O N 1 )

S.N. Board/Part Unit Quantity

1 NCP Piece 1

2 SAI Piece 1

3 PWRA Piece 1

4 OCS4(S-4.1) Piece 2

5 LP4x1 Piece 2

6 OIS4x1(S-4.1) Piece 2

7 EPE1x21(75) Piece 2

8 ESE1x21(75) Piece 2

9 SFEx6(GFP) Piece 1

10 EIFEx4 Piece 1

11 FAN Piece 2

12 3U power distribution box Set 1

13 ZJ-Front (Front fixed subrack including MB and fan)

Set 1

14 Tested Power Consumption: 109.38 W





1 NCP Piece 1

2 SAI Piece 1

3 PWRA Piece 2

4 OCS16 Piece 2

5 OL1/4x4(4xS-1.1,LC) Piece 2





10 EIFEx4 Piece 2

11 FAN Piece 2



Set 1

14 Tested Power Consumption: 124.23 W



1 NCP Piece 1

2 SAI Piece 1

3 PWRA Piece 2

4 OCS16 Piece 2

5 OL16(L-16.2,LC) Piece 3






11 EIFEx4 Piece 1

12 FAN Piece 2






Set 1

15 Tested Power Consumption:160.26 W



Environment Requirements Grounding Requirements

If separate grounding is employed in the equipment room, the grounding impedance should meet the following requirements:

The grounding impedance of -48 V GND ≤ 4 Ω.

The grounding impedance of system working ground ≤ 1 Ω.

The grounding impedance of lightning protection ground ≤ 3 Ω.

If joint grounding is employed in the equipment room,

The grounding impedance should be ≤ 1 Ω;

The voltage difference among the lightning protection ground, the system working ground, and the -48 V GND should be less than 1 V.

The requirements for the junction of various grounds are as follows:

The -48 V ground of the board is isolated from the -48 V GND.

The lightening protection GND connects only to the protected components, and converges with the system working GND at the grounding terminal on the busbar of the cabinet.

The -48 V GND can converge with the PGND or the joint GND on the busbar of the cabinet, or be grounded outside.

Temperature and Humidity Requirements

The requirements regarding the working temperature and relative humidity of the ZXMP S325 are given in Table 15.

T AB L E 15 . TE M P E R AT U R E /H U M I D I T Y R E Q U I R E M E N T S

Index Specification

Working Temperature -5 °C ~ +45 °C

Relative Humidity 5% ~ 95%



Note: In normal conditions, the temperature and humidity are measured at 1.5 m above the floor and 0.4 m near the equipment.

Cleanness Requirements

Cleanness requirements involve requirements for dust and harmful gases in the air. The equipment should work in an equipment room that meets the following cleanness requirements:

No explosive, conductive, magnetic or corrosive dust in the transmission equipment room.

The concentration of dust particles with the diameter greater than 5 µm should be no more than 3×104 particles/m3.

No corrosive metal or gas that is detrimental to the insulation in the equipment room. Table 16 lists the requirements for harmful gases in the equipment room.

T AB L E 16 . R E Q U I R E M E N T S F O R H AR M F U L G A S E S I N T H E E Q U I P M E N T RO O M

Harmful Gas Average Density (mg/m3)

Maximum Density (mg/m3)

SO2 <0.2 <1.5

H2S <0.006 <0.03

NO2 <0.04 <0.15

NH3 <0.05 <0.15

Cl2 <0.01 <0.3

The equipment room should always be kept clean, with doors and windows sealed.



EMC Requirements Overview

The requirements for EMC (electromagnetic compatibility) include two aspects: requirements for electromagnetic susceptibility (EMS) and for electromagnetic interference (EMI).

The following three criteria should be followed to judge the test result:

Performance criterion A: Continuous phenomenon

Neither error nor alarm is allowed.

After electromagnetic interference, the number of error bits does not exceed the maximum of the normal requirement.

Performance criterion B: Transient phenomenon

Loss of frame alignment or loss of synchronization is not allowed during each individual exposure. No alarms shall be generated as a result of the electromagnetic stress.

The above does not apply to surge testing where some loss of frame alignment may be expected. For this test, the EUT shall operate as intended following the cessation of the exposure.

Performance criterion R: Resistivity

The equipment can pass the test without damage or producing other interference (e.g. software damage, or improper protection for faulty equipment), and can work properly within the specified limit after the transient phenomenon. It is unnecessary for the equipment to work properly during the test.

The interference imposed on the equipment during the test can cause action of the fuse or other specified device which need to be replaced or reset so that the equipment can work properly.

EMS

This section introduces the following EMS (electromagnetic susceptibility) indexes: ESD resistivity, RF electromagnetic field radiation resistivity, electrical transient burst resistivity, surge resistivity, and RF field conductivity resistivity.

The ESD resistivity indexes of the ZXMP S325 are listed in Table 17.

ESD Resistivity



T AB L E 17 . ESD R E S I S T I V I T Y

Contact Discharge Air Discharge Criterion

6 kV 8 kV Performance criterion B

Note: Be sure to wear an antistatic wrist strap during operating in interface areas.

The indexes of the RF electromagnetic field radiation resistivity of the ZXMP S325 are listed in Table 18.

T AB L E 18 . RF E L E C T R O M AG N E T I C F I E L D R AD I AT I O N R E S I S T I V I T Y

Test Frequency: 80 MHz - 1000 MHz, 1400 MHz - 2000 MHz

Electric Field Intensity Amplitude Modulation Criterion

10 V/m 80% AM (1 kHz) Performance criterion A

The indexes of the electrical transient burst resistivity at different ports of ZXMP S325 are listed in Table 19, Table 20, and Table 21.

T AB L E 19 . E L E C T R I C AL TR A N S I E N T B U R S T R E S I S T I V I T Y A T DC P O W E R P O R T

Generator Waveform: 5 ns/50 ns

Test Voltage Repetition Frequency Criterion

±1 kV 5 kHz Performance criterion B

T AB L E 20 . E L E C T R I C AL TR A N S I E N T B U R S T R E S I S T I V I T Y A T AC P O W E R P O R T



± 2 kV 5 kHz Performance criterion B

T AB L E 21 . E L E C T R I C AL TR A N S I E N T B U R S T R E S I S T I V I T Y A T S I G N AL C A B L E AN D C O N T R O L C AB L E P O R T S



±1 kV 5 kHz Performance criterion B

The surge resistivity indexes of ZXMP S325 are listed in Table 22 to Table 25.

RF Electromagnetic

Field Radiation Resistivity

Electrical Transient

Burst Resistivity

Surge Resistivity



T AB L E 22 . S U R G E R E S I S T I V I T Y O F DC P O W E R S U P P L Y

Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs) Internal Impedance: 12 Ω

Test Mode Test Voltage Criterion

Line to line ±0.5 kV Performance criterion B

Line to ground ±1 kV Performance criterion B

T AB L E 23 . S U R G E R E S I S T I V I T Y O F AC P O W E R S U P P L Y




Line to ground ±2 kV Performance criterion R

T AB L E 24 . S U R G E R E S I S T I V I T Y O F OU T D O O R S I G N AL C A B L E

Generator Waveform: 10 μs/700 µs; Internal Impedance: 40 Ω


Line to line


T AB L E 25 . S U R G E R E S I S T I V I T Y O F I N D O O R S I G N AL C AB L E (10 M )



Line to line


The indexes of the RF field conductivity resistivity of ZXMP S325 are listed in Table 26.

T AB L E 26 . RF F I E L D C O N D U C T I V I T Y R E S I S T I V I T Y

Test Frequency: 0.15 MHz ~ 80 MHz

Test Intensity Amplitude Modulation Criterion

3 V 80% AM (1 kHz) Performance criterion A

RF Field Conductivity

Resistivity



EMI

This section introduces two EMI (electromagnetic interference) indexes: conductive emission electromagnetic interference and radiated emission electromagnetic interference.

The indexes of conductive emission electromagnetic interference of the ZXMP S325 are listed in Table 27.

T AB L E 27 . C O N D U C T I V E EM I S S I O N E L E C T R O M AG N E T I C I N T E R F E R E N C E

Threshold (dBμV) Test Frequency (MHz) Quasi-Peak Value Mean Value

0.15 - 0.5 79 66

0.5 - 30 73 60

Note: These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASS A.

The indexes of radiated emission electromagnetic interference of the ZXMP S325 are listed in Table 28.

T AB L E 28 . R AD I AT E D E M I S S I O N E L E C T R O M AG N E T I C I N T E R F E R E N C E

Quasi-Peak Wave Detection Limit (dBµV/m) Test Frequency (MHz) Test Distance:10 m Test Distance: 3 m

30 - 230 40 50

230 - 1000 47 57

Note: These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASS A.

Conductive Emission

Electromagnetic Interference

Radiated Emission

Electromagnetic Interference



Optical Interface Specifications Transmission Code Pattern

ZXMP S325 employs the NRZ scramble code. Specification for the scramble complies with the 7-class synchronous scrambler specified in the ITU-T Recommendation G.707.

Optical Modules

Table 29 lists the STM-16 optical modules supported by ZXMP S325.

T AB L E 29 . STM-16 OP T I C AL M O D U L E S SU P P O R T E D B Y ZXMP S325

Optical Module Type

Light Nominal Wavelength (nm)


Connector Type

Service Capacity (Channel per board)

S-16.1 1310 ≤15 LC/PC 1

S-16.2 1550 ≤15 LC/PC 1

L-16.1 1310 ≤40 LC/PC 1

L-16.2 1550 ≤80 LC/PC 1

L-16.2U 1550 ≤150 LC/PC 1

CWDM nS1-2XX

Compliant with the ITU-T Recommendation G.695

≤40 LC/PC 1

CWDM nL1-2XX

Compliant with the ITU-T Recommendation G.695

≤80 LC/PC 1


T AB L E 30 . STM-4 OP T I C AL M O D U L E S S U P P O R T E D B Y ZXMP S325

Optical Module Type



Connector Type


S-4.1 1310 ≤15 LC/PC or SC/PC 1, 2, 3, or 4

STM-16 Optical Modules




Optical Module Type



Connector Type


L-4.1 1310 ≤40 LC/PC or SC/PC 1, 2, 3, or 4

L-4.2 1550 ≤80 LC/PC or SC/PC 1, 2, 3, or 4

Single-fiber bidirectional optical module S-4.1

1310/1550 ≤15 LC/PC or SC/PC 1, 2, 3, or 4

Single-fiber bidirectional optical module L-4.1

1310/1550 ≤40 LC/PC or SC/PC 1, 2, 3, or 4


T AB L E 31 . STM-1 OP T I C AL M O D U L E S S U P P O R T E D B Y ZXMP S325

Optical Module Type



Connector Type


S-1.1 1310 ≤15 LC/PC or SC/PC 1, 2, 3, or 4

L-1.1 1310 ≤40 LC/PC or SC/PC 1, 2, 3, or 4

L-1.2 1550 ≤80 LC/PC or SC/PC 1, 2, 3, or 4

Single-fiber bidirectional optical module S-1.1

1310/1550 ≤15 LC/PC or SC/PC 1, 2, 3, or 4

Single-fiber bidirectional optical module L-1.1

1310/1550 ≤40 LC/PC or SC/PC 1, 2, 3, or 4

Eye Diagram of Optical Transmit Signals

The ZXMP S325 eye diagram conforms to the eye diagram mask of optical transmit signal as shown in Figure 7.




F I G U R E 7 . M AS K O F E Y E D I A G R AM F O R OP T I C AL TR AN S M I T S I G N AL

Time

1

1＋y1

UIx3 x4x2x1

y1

-y1

0

0.5

y2

1 Mean level oflogical "1"

Mean level oflogical "0"

Am

plit

ude

General transmitter pulse shape characteristics include rise time, fall time, pulse overshoot, pulse undershoot, and ringing. All these may deteriorate the sensitivity of the receiver and therefore should be restricted.

To prevent excessive deterioration of the receiver’s sensitivity, the waveform of transmit signal should be limited. Therefore, the eye diagram mask sent at the transmit point S is specified to regulate the pulse shape of optical transmit signal.

Systems at different STM levels should meet corresponding requirements for different eye diagram mask shapes. The eye diagram mask parameters are listed in Table 32.

T AB L E 32 . P A R AM E T E R S O F E Y E D I AG R AM M AS K F O R O P T I C AL TR AN S M I T S I G N AL

Coordinate Relations of Eye Diagram Mask STM-1 STM-4 STM16

x1/x4 0.15/0.85 0.25/0.75 -

x2/x3 0.35/0.65 0.40/0.60 -

y1/y2 0.20/0.80 0.20/0.80 0.25/0.75

X3-x2 - - 0.2

Mean Optical Launched Power

The mean optical launched power at reference point S (the transmit interface of the optical line board) is the mean power of a pseudo-random data sequence coupled into the optical fiber by the transmitter.



The power of the optical transmitter is related to the percentage of “1”s in the transmit signal. The more the “1”s are, the greater the optical launched power is.

When the transmit signals are pseudo-random sequence, “1”s and “0”s are approximately 50% each. In this case, the optical power is defined as the mean optical launched power.

The mean optical launched power parameters of the ZXMP S325 STM-N (N=1, 4, 16) are listed in Table 33.

T AB L E 33 . STM-N M E AN OP T I C AL L AU N C H E D P O W E R (DB M )

STM-1 STM-4 STM-16

Index S-1.1/S-1.2

L-1.1/L1.2

S-4.1/S-4.2

L-4.1/L4.2

S-16.1/ S-16.2

L-16.1/ L16.2/ L16.2U

nS1-2XX/nL1-2XX

Mean optical launched power (dBm)

-15~-8 -5~0 -15~-8 -3~+2 -5~0 -2~+3 0~+5

Extinction Ratio

The extinction ratio refers to the ratio of the average optical power of optical transmit signal to the average optical power of optical non-transmit signal in the worst reflection and fully modulated conditions.

The extinction ratios of the ZXMP S325 are listed in Table 34.

T AB L E 34 . E X T I N C T I O N R AT I O O F STM-N OP T I C AL I N T E R F AC E S

STM-1 STM-4 Index

S-1.1 S-1.2 L-1.1 L-1.2 S-4.1 S-4.2 L-4.1 L-4.2 STM-16

Extinction ratio (dB) 8.2 10 8.2 10 8.2

Receiver Sensitivity

Receiver sensitivity is defined as the minimum acceptable value of average received power at point R to achieve the bit error rate (BER) of 1×10-10.

The STM-N receiver sensitivities of ZXMP S325 are listed in Table 35.



T AB L E 35 . STM-N R E C E I V E R S E N S I T I V I T Y (U N I T : D BM )

STM-1 STM-16

Index S-1.1

S-1.2

L-1.1

L-1.2

L-1.3

STM-4 S16.1/ S16.2/ nS1-2XX

L-16.1

L-16.2/ L-16.2U/nL1-2XX

Receiver sensitivity (dBm)

-28 -34 -28 -18 -27 -28

Receiver Overload

Receiver overload is the maximum acceptable value of the received average power at point R for a 1×10-10 BER.

The receiver overloads of ZXMP S325 are described in Table 36.

T AB L E 36 . STM-N R E C E I V E R OV E R L O AD

STM-1 STM-16

Index S-1.1

S-1.2

L-1.1

L-1.2

L-1.3

STM-4 S-16.1/ S-16.2/ nS1-2XX

L16.1/L-16.2/ L-16.2U/nL1-2XX

Overload (dBm) -8 -10 -8 0 -9

Mean Optical Received Power

Mean optical received power is the average power (tested at the current station) of a pseudo-random data sequence that is coupled into the optical fiber and sent to the local station by a transmitter of an upstream/downstream station.

The purpose of measuring the mean optical received power is to examine whether there is any break or loss in the optical cable, and whether the interfaces are well connected.

The mean optical received power should be greater than the worst sensitivity and less than the overload of relevant optical boards.

ZXMP S325 conforms to the above specifications.



Permitted Frequency Deviation of Optical Input Interfaces

The input interface can still work properly (which is generally judged by no bit error in the equipment) when it receives signals within the permitted frequency deviation range.

The permissible frequency deviation of the ZXMP S325 optical input interface is within ± 20 ppm (1 ppm=1×10-6).

AIS Rate of Optical Output Interfaces

The AIS rate of optical output interfaces refers to the rate of AIS signals sent downstream from the output interface in the case that the optical signals of the SDH equipment input interface are lost. The AIS rate deviation should be within a certain tolerance range.

The AIS rate deviation of the ZXMP S325 optical output interface is within ± 20 ppm (1 ppm=1×10-6)



Electrical Interface Specifications Code Patterns of Electrical Interface

Table 37 lists the code patterns of electrical interface supported by the ZXMP S325.

T AB L E 37 . C O D E P AT T E R N S O F E L E C T R I C AL S I G N AL

Electrical Signal Type

Bit Rate (kbit/s)

Code Pattern Abbreviation Code Pattern Full Name

E0 64 AMI Alternate Mark Inversion

T1 1544 B8ZS Bipolar with 8-Zero Substitution

T3 44736 B3ZS Bipolar with 3-Zero Substitution

E1 2048

E3 34368 HDB3 High Density Bipolar of order 3

STM-1 (E) 155520 CMI Code Mark Inversion

Permitted Attenuation of Input Interfaces

The permissible attenuation of the input interface: The input interface can still work properly (which is generally judged by no bit error occur in the equipment) when it receives the signals attenuated through the standard connection cable.

The permissible attenuation of the ZXMP S325 input interface satisfies the requirements listed in Table 38.

Frequency Deviation of Input Interfaces

The permissible frequency deviation: The input interface can still work properly (which is generally judged by no bit error in the equipment) when it receives signals within the permissible frequency deviation range.



The permissible frequency deviation of the ZXMP S325 input interface satisfies the requirements listed in Table 38.

Bit Rate Tolerance of Output Interfaces

The bit rate tolerance of the output interface signal: The difference between the bit rate of actual digital signals and the specified nominal bit rate should not exceed the permissible difference range of each interface level, that is, the tolerance.

The permissible bit rate tolerances of the ZXMP S325 output interface signals are listed in Table 38.

T AB L E 38 . P E R M I T T E D AT T E N U AT I O N /FR E Q U E N C Y D E V I A T I O N O F I N P U T I N T E R F AC E , A N D S I G N AL B I T R AT E TO L E R AN C E O F OU T P U T I N T E R F AC E

Interface Rate (kbit/s)

Permitted Attenuation of Input Interface (dB ) (regular square root attenuation)

Permitted Frequency Deviation of Input Interface (ppm)

Permitted Bit Error Tolerance of Output Interface (ppm)

1544 0 ~ 6, 772 kHz Within ±32 Within ±32



44736 0 ~ 20, 22368 kHz. Within ±20 Within ±20

155520 0 ~ 12.7, 78 MHz Within ±20 Within ±20

Note: 1 ppm=1×10-6

Reflection Attenuation of Input/Output Interfaces

The difference between the actual impedance and the nominal impedance of an input or output interface can cause signal reflection, which must be controlled in a specified range. This index is defined as the reflection attenuation. The requirements on the reflection attenuation index of an input/output interface of the ZXMP S325 are described in Table 39.

T AB L E 39 . R E Q U I R E M E N T S O N T H E R E F L E C T I O N AT T E N U AT I O N I N D E X O F AN I N P U T /OU T P U T I N T E R F AC E

Interface bit rate (kbit/s)

Test Frequency Range (kHz)

Reflection Attenuation (dB)

51.2 ~ 102.4 ≥12 2048 Input interface

102.4 ~ 2048 ≥18



Interface bit rate (kbit/s)

Test Frequency Range (kHz)

Reflection Attenuation (dB)

2048 ~ 3072 ≥14

51 ~ 102 ≥6 Output interface

102 ~ 3072 ≥8

860 ~ 1720 ≥12

1720 ~ 34368 ≥18

Input interface

34368 ~ 51550 ≥14

1720 ~ 51550 ≥6

34368

Output interface

102 ~ 3072 ≥8

860 ~ 1720 ≥12

1720 ~ 34368 ≥18

Input interface

34368 ~ 51550 ≥14

1720 ~ 51550 ≥6

44736

Output interface

102 ~ 3072 ≥8

155520 Input/output interface 8000 ~ 240000 ≥15

Anti-Interference Capability of Input Interfaces

The impedance mismatching between the digital distribution frame and digital output interface can cause signal reflection on the interface. The input interface must meet the following requirements to ensure that the system can endure this signal reflection:

When an interference signal described below is inserted, the input interface should not generate any bit error.

Interference signal: The interference signal has the same nominal frequency, tolerance, waveform, and code pattern as the main signal; but they come from different sources.

Table 40 lists the anti-interference capability of ZXMP S325.

T AB L E 40 . AN T I - I N T E R F E R E N C E C AP AB I L I T Y O F ZXMP S325

Interface bit rate (Unit: kbit/s) Signal-to-noise Ratio (S/N) (Unit: dB)

2048 18

34368 20



Waveform of Output Interfaces

The waveform of output interface refers to the signal waveform parameters tested under the test load impedance specified for the output interface. It should comply with the template specified in ITU-T G.703 Recommendation. The waveforms of various electrical output interfaces of ZXMP S325 satisfy the template requirement.

The output pulse mask of the 1544 kbit/s electrical interface is shown in Figure 8.

F I G U R E 8 . OU T P U T P U L S E M AS K AT T H E 1544 K B I T / S E L E C T R I C AL I N T E R F AC E

1.5

1.0

0.5

0

-1.01.51.00.50-0.5

Time, in Unit Intervals

NormalizedAmplitude

-0.5

-1.0

1544 kbit/s Electrical Interface



The output pulse mask of the 2048 kbit/s electrical interface is shown in Figure 9.


269 ns(244 + 25)

194 ns(244 – 50)

244 ns

219 ns(244 – 25)

488 ns(244 + 244)

1 0 %

1 0 %

1 0 %

1 0 %

0 %

5 0 %

1 0 %

1 0 %

2 0 %

2 0

%

V = 10 0 %

2 0 %

Nominal pulse

Note: V in this figure and the following figures corresponds to the nominal peak value.




Figure 10 illustrates the output pulse mask of the 34368 kbit/s electrical interface.


17 ns

0

V(14.55 + 2.45)

8.65 ns(14.55 5.90)

14.55 ns

12.1 ns(14.55 2.45)

24.5 ns(14.55 + 9.95)

0.1

0.1

0.2

0.2

0.1

0.1

0.1

0.1

0.2

29.1 ns(14.55 + 14.55)

0.5

1.0

标称脉冲

-

-

Nominal pulse




Figure 11 illustrates the output pulse mask of 44736 kbit/s electrical interface.


1.5

1.0

0.5

0

-0.5

NormalizedAmplitude

1.51.00.50-0.5

Time, in Unit Intervals

-1.0-1.0




Masks of pulses corresponding to a binary 0 and a binary 1 at the 155520 kbit/s electrical interface are respectively shown in Figure 12 and Figure 13.

F I G U R E 12 . MAS K O F A P U L S E C O R R E S P O N D I N G T O A B I N A R Y 0 AT T H E 155520 K B I T / S E L E C T R I C AL I N T E R F AC E

3 ns

V

3 ns 3 ns

3 ns

3 ns3 ns

1 ns 1 ns

NominalPulse

0.60

0.55

0.50

0.45

0.40

0.05

-0.05

-0.40

-0.45

-0.55

-0.60

-0.50

0.3 ns 0.3 ns

0.3 ns

4.82 ns 4.82 ns

0.3 ns

T = 19.3 ns

4.82 ns4.82 ns

F I G U R E 13 . MAS K O F A P U L S E C O R R E S P O N D I N G T O A B I N A R Y 1 AT T H E 155520 K B I T / S E L E C T R I C AL I N T E R F AC E

1 ns

V

1 ns

1 ns

1 ns

NominalPulse

0.60

0.55

0.50

0.45

0.40

0.05

0.1 ns0.1 ns

3.215 ns 3.215 ns

1.2 ns 1.2 ns

1.608 ns 1.608 ns

0.5 ns 0.5 ns

T = 6.43 ns

-0.05

-0.40

-0.45

-0.55

-0.60

-0.50

155520 kbit/s Electrical

Interfaces



Jitter Specifications of Interfaces Jitter and Wander Tolerance of PDH Input Interface

The jitter and wander tolerance at the input interface refers to the maximum jitter and wander value that the interface can endure in the specified performance range.

The jitter and wander tolerance of 1544 kbit/s electrical input interface is got by testing a pseudo-random data sequence with the length of 220-1. The 1544 kbit/s electrical input interface of ZXMP S325 meets the requirements shown in Figure 14 and Table 41.

F I G U R E 14 . J I T T E R AN D W A N D E R TO L E R AN C E O F 1544 K B I T / S E L E C T R I C AL I N P U T I N T E R F A C E

103 104 105101 10210-110101010

1

10

100

Frequency f (Unit: Hz)

0.01

0.1

Peak-peak jitterand wander

tolerance (Unit: UI)

-2-3-4-5

T AB L E 41 . J I T T E R AN D W AN D E R TO L E R AN C E O F 1544 K B I T / S E L E C T R I C AL I N P U T I N T E R F AC E

Frequency f (Hz) Peak-peak Jitter and Wander Tolerance (UI)

1.2×10-5 ≤ f ≤ 3.5×10

-4 28 (18 μs) (Note 1)

3.5×10-4

< f ≤ 5.6×10-4

9.8×10-3

f -1

(6.35×10-3

f -1

μs)

5.6×10-4

< f ≤ 0.014 17 (11 μs)

0.014 <f ≤ 0.016 0.238f -1

(0.154f -1

μs)

0.016 < f ≤ 0.16 15 (10 μs)

0.16 < f ≤ 0.19 2.4f -1

(1.6f -1

μs)

Definition





0.19 <f ≤ 3.9 13 (8.4 μs)

3.9 <f ≤ 10 50.7f -1

(32.8f--1

μs)

10 <f ≤ 120 5 (3.2 μs)

120 <f ≤ 6000 600f -1

(384f -1

μs)

6000 <f ≤ 40000 0.1 (0.0648 μs) (Note 2)

Notes:

1. 18 μs represents for the relative phase deviation between the input signal and the local timing signal got from the reference clock.

2. This value needs further study.

3. For the 1544 kbit/s electrical interface, 1 UI=648 ns



100

1810

8.8

1

0.098

0.01

1e-005

1.2e-005

0.001 0.1 10 1000 100000

1.67 20 2400 18000 1000000.00488 0.01

0.1

0.73


Peak-peak jitter andwander tolerance

(Unit: µs)

0.1

1

10

100


(Unit: UI)

T AB L E 42 . J I T T E R AN D W AN D E R TO L E R AN C E O F 2048 K B I T / S E L E C T R I C AL I N P U T I N T E R F AC E

Frequency f (Hz) Peak-peak Jitter and Wander Tolerance

1.2×10-5

< f ≤ 4.88×10-3

18 µs

4.88×10-3

< f ≤ 0.01 0.088f -1

µs





0.01 < f ≤ 1.67 8.8 µs

1.67 < f ≤ 20 15f -1

µs

20 < f ≤ 2400 (Note 1) 1.5 UI

2400 < f ≤ 18000 (Note 1) 3.6×103f

-1 UI

18000 < f ≤ 100000 (Note 1) 0.2 UI

Notes:

1. For the 2048 kbit/s electrical interfaces in the same operator network, the frequency of 2400 Hz in the table should be 93 Hz, and the frequency of 18000 Hz in the table should be 700 Hz. For the 2048 kbit/s electrical interfaces in different carrier networks, the 2400 Hz and 18000 Hz in this table are used unless all the test parties agree to use other values.

2. For the 2048 kbit/s electrical interface, 1 UI=488 ns



10

1

0.1

0.01

0.0044

0.0010.01

0.011 100 10000 1e+006

1000 800000

0.1

1

10

4.4

1004

1

0.044

0.13

0.032 Frequency f (Unit: Hz)


(Unit: µs)


(Unit: UI)

T AB L E 43 . J I T T E R AN D W AN D E R TO L E R AN C E O F 34368 K B I T / S E L E C T R I C AL I N P U T I N T E R F A C E


1×10-2

< f ≤ 3.2×10-2

4 µs





3.2×10-2

< f ≤ 0.13 0.13f -1

µs

0.13 < f ≤ 4.4 1 µs

4.4 < f ≤ 100 4.4f -1

µs

100 < f ≤ 1000 1.5 UI

1000 < f ≤ 10000 1.5 × 103f

-1 UI

10000 < f ≤ 800000 0.15 UI

Note: For the 34368 kbit/s electrical interface, 1 UI=29.1 ns



103 104 105101 1021010101010-5

1

10

100

1000

0.1

0.01-4 -3 -2 -1


(Unit: UI)


T AB L E 44 . J I T T E R AN D W AN D E R TO L E R AN C E O F 44736 K B I T / S E L E C T R I C AL I N P U T I N T E R F A C E


1.2×10-5

≤ f ≤ 6.12×10-5

805 (18 μs) (Note 1)

6.12×10-5

< f ≤ 1.675 62.6+5.81f -1/2

(1.4+0.130f -1/2

μs)

1.675 < f ≤ 21.9 110f -1

(2.45f -1

μs)

21.9 < f ≤ 600 5 (0.112 μs)

600 < f ≤ 30000 3000f -1

(67.1f -1

μs)





30000 < f ≤ 400000 0.1 (2.24×10-3

μs)

Notes:

1. 18 μs represents for the relative phase deviation between the input signal and the local timing signal got from the reference clock.

2. For the 44736 kbit/s electrical interface, 1 UI=22.4 ns

Jitter and Wander Tolerance of SDH Input Interface

The capability of the STM-N input interface to endure jitter and wander is specified and tested with the digital test signal in sine-modulated phase.

The input interfaces jitter and wander tolerance of the ZXMP S325 SDH terminal multiplexer satisfies the requirements described in Figure 18, Table 45, and Table 46.

F I G U R E 18 . J I T T E R TO L E R AN C E O F STM-N TE R M I N AL M U L T I P L E X E R I N P U T I N T E R F AC E

eak-peak jitter and wander (logarithm)

A0

A1

A2

A3

A4

f0 f12 f11 f10 f9 f8 f1 f2 f3 f4Frequency

Slope= -20dB/decade

T AB L E 45 . I N P U T J I T T E R AN D W AN D E R TO L E R AN C E (U I P - P ) O F SDH TE R M I N AL M U L T I P L E X E R

Interface A0 A1 A2 A3 A4

STM-1 (E) 2800 311 39 1.5 0.075

STM-1 (O) 2800 311 39 1.5 0.15

STM-4 (O) 11200 1244 156 1.5 0.15

Terminal Multiplexer



Interface A0 A1 A2 A3 A4

STM-16 (O) 44790 4977 622 1.5 0.15

T AB L E 46 . FR E Q U E N C Y (H Z ) O F I N P U T J I T T E R AN D W AN D E R TO L E R AN C E O F SDH TE R M I N AL M U L T I P L E X E R

Interface f0 f12 f11 f10 f9 f8 f1 f2 f3 f4

STM-1 (E) 1.2 ×10-5

1.78×10-4

1.6 ×10-3

1.56×10-2 0.125 19.3 500 3.25

×103 6.5 ×104

1.3 ×106

STM-1 (O) 1.2 ×10-5

1.78×10-4

1.6 ×10-3

1.56×10-2 0.125 19.3 500 6.5

×103 6.5 ×104

1.3 ×106

STM-4 (O) 1.2 ×10-5

1.78×10-4

1.6 ×10-3

1.56×10-2 0.125 9.65 1000 2.5

×104 2.5 ×105

5 ×106

STM-16 (O) 1.2 ×10-5

1.78×10-4

1.6 ×10-3

1.56×10-2 0.125 12.1 5000 1

×105 1 ×106

2 ×107

The input interfaces jitter and wander tolerance of the ZXMP S325 SDH regenerator satisfies the requirements shown in Figure 19 and Table 47.

F I G U R E 19 . I N P U T J I T T E R TO L E R AN C E O F STM-N SDH R E G E N E R AT O R

T AB L E 47 . I N P U T J I T T E R TO L E R AN C E S O F STM-1 , STM-4 AN D STM-16 R E G E N E R AT O R S

STM Interface f1 (kHz) f2 (kHz) A1 (UIP-P) A2 (UIP-P)

A 65 6.5 0.15 1.5 STM-1

B 12 1.2 0.15 1.5

A 250 25 0.15 1.5 STM-4

B 12 1.2 0.15 1.5

A 1000 100 0.15 1.5 STM-16

B 12 1.2 0.15 1.5

Regenerator



Inherent Output Jitter of STM-N Interface

The inherent jitter of the STM-N interface of the SDH equipment is defined as the jitter amount of the equipment at the STM-N output interface when there is no input jitter.

For ADM, TM, and DXC equipments of ZXMP S325, STM-N interface inherent output jitters meet the requirements listed in Table 48.

T AB L E 48 . S P E C I F I C AT I O N S O F I N H E R E N T OU T P U T J I T T E R S AT STM-N I N T E R F AC E S I N SDH E Q U I P M E N T

STM Interface Test Filter (kHz) Peak-Peak Value of Jitter (UI)

0.5~1300 0.50 STM-1

65~1300 0.10

1~5000 0.50 STM-4

250~5000 0.10

5~20000 0.50 STM-16

1000~20000 0.10

Note: Due to the randomness of jitter, the test value might be over the indexes. Therefore, as long as 99% of the test (about 1 to 2 minutes) satisfies the index, the test result is acceptable.

For REG equipment, when the test filter is a 12 kHz high-pass filter, the root mean square value caused by jitter should be no more than 0.01 UI.

Definition

Specifications



Output Jitter of Network Interface

The output jitter of network interface at STM-N level in the SDH equipment is defined as the output jitter value at any output interface of STM-N level in the SDH network.

For ADM, TM, and DXC equipments of ZXMP S325, output jitters of network interfaces at STM-N level meet the requirements listed in Table 49.

T AB L E 49 . S P E C I F I C AT I O N S O F OU T P U T J I T T E R S AT STM-N N E T W O R K I N T E R F AC E S I N SDH EQ U I P M E N T

Test Filter Output Jitter (UIp-p) STM Interface

f1 (Hz) f3 (kHz) f4 (MHz) f1~f4 f3~f4

STM-1 (O) 500 65 1.3 1.5 0.15

STM-1 (E) 500 65 1.3 1.5 0.075

STM-4 (O) 1000 250 5 1.5 0.15

STM-16 (O) 5000 1000 20 1.5 0.15

Note: Due to the randomness of jitter, the test value might be over the indexes. Therefore, as long as 99% of the test (about 1 to 2 minutes) satisfies the index, the test result is acceptable.

For REG equipment, when the test filter is a 12 kHz high-pass filter, the root mean square value caused by jitter should be no more than 0.01 UI.

Mapping Jitter of PDH Tributary

Mapping jitter refers to the jitter generated at the PDH tributary output interface when the equipment does not receive any STM-N signal without jitter and pointer activity. It is an index to measure the jitter occurrence in the process of mapping the PDH signals into the SDH data stream.

Mapping jitter at the ZXMP S325 PDH tributary interface should satisfy the requirements listed in Table 50.

Definition

Specifications



T AB L E 50 . M A P P I N G J I T T E R O F PDH TR I B U T AR Y I N T E R F AC E

Test Filter Max. Peak-Peak Value Mapping Jitter (UIp-p)

PDH Tributary Interface (kbit/s)

Tolerance (ppm)

f1 (Hz) f3 (kHz) f4 (kHz) f1~f4 f3~f4

1544 ±22 10 8 40 0.7 –

2048 ±50 20 18 100 To be determined

0.075

34368 ±20 100 10 800 To be determined

0.075

44736 ±20 10 30 400 0.4 0.1

Note: 1ppm=1×10-6.

Combined Jitter

In SDH system, generally there are both mapping jitter and pointer adjustment jitter. When these two kinds of jitters are present, they produce the combined jitter.

Under all test sequences, the test values of the ZXMP S325 should meet the requirements listed in Table 51.

T AB L E 51 . C O M B I N E D J I T T E R

High-Pass Filter 20 dB/decade

Max. Peak-Peak Value Combined Jitter (UIP-P)

PD

H

Interface

(kbit/s)

Bit R

ate Toleran

ce (ppm

)

f1 (Hz)

f3 (Hz)

f4 (Hz) f1~f4 (UIp-p) f3~f4 (UIp-p)

±50 20 18 k 100 k 0.4 0.4 0.4 - 0.075 0.075 0.075 - 2048

Test sequence a b c d a b c d

±20 100 10 k 800 k 0.4 0.4 0.4 0.75 0.075 0.075 0.075 0.07534368

Test sequence a b c d a b c d

±20 10 30 k 400 k 1.5 1.5 1.5 1.5 0.075 0.075 0.075 0.07544736

Test sequence e f g h e f g h

Note: 1ppm=1×10-6.



Jitter Transfer Characteristic of Regenerator

The jitter transfer characteristic of regenerator is defined as the relation between the frequency and the ratio of the output STM-N signal jitter to the added input STM-N signal jitter.

The jitter transfer characteristic of the ZXMP S325 SDH regenerator is shown in Figure 20.

F I G U R E 20 . J I T T E R TR AN S F E R C H AR AC T E R I S T I C O F R E G E N E R AT O R

The parameters of the jitter transfer characteristic of regenerator are listed in Table 52.

T AB L E 52 . P A R AM E T E R S O F J I T T E R TR AN S F E R C H AR AC T E R I S T I C O F R E G E N E R AT O R

STM-N fc (kHz) P (dB)

A 130 0.1 STM-1

B 30 0.1

A 500 0.1 STM-4

B 30 0.1

A 2000 0.1 STM-16

B 30 0.1



Clock Timing and Synchronization Characteristics Timing Principles

The component closest to the SDH network synchronization performance is the clock unit. ITU-T Recommendations specify three types of clocks:

1. ITU-T G.811 specifies the primary reference clock.

2. ITU-T G.812 specifies slave clocks at different levels.

3. ITU-T G.813 specifies the slave clock of SDH equipment.

All the timings of SDH system should trace the primary reference clock (PRC) described in G.811.

Output Jitter

Output jitter refers to the jitter amount at the clock output interface when there is no input jitter.

The output jitter of the ZXMP S325 2 MHz or 2 Mbit/s clock should not exceed 0.05 UIP-P when it is measured at an interval of 60 s through a single pole band-pass filter with corner frequencies at 20 Hz and 100 kHz.

Allowable Input Attenuation

The input interface should work properly (without bit error or clock lock loss) while receiving the attenuated signals through the standard connection cable.

The allowable input attenuation specification of the ZXMP S325 is as follows:

When the input interface introduces signal with attenuation compliant with the frequency square root rule and ranging from 0 dB to 6 dB, no bit error or clock lock loss occurs in the equipment.



Allowable Input Frequency Deviation

When the input interface receives signal with frequency deviation within the specified range, it can still work properly (without bit error or clock lock loss in the equipment).

The allowable input frequency deviation of ZXMP S325 ranges from -4.6 ppm to +4.6 ppm. 1ppm=1×10-6.

Bit Rate Tolerance of Output Interface Signal

The difference between the bit rate of actual clock signal and the specified nominal bit rate should not exceed the allowable range of difference at interface of various levels. The allowable range of difference is the tolerance.

The signal bit rate tolerance of ZXMP S325 output interface ranges from -4.6 ppm to +4.6 ppm. 1ppm=1×10-6.

Waveform of Output Interface

It refers to the parameter specifications of the output signal waveform with the test load impedance specified by the clock output interface.

The waveform of output interface of the ZXMP S325 clock signal conforms to corresponding mask in the G.703 recommendation, as shown in Figure 9.

Timing Reference Source Switching

The ZXMP S325 SDH has more than one external input timing reference. When the selected timing reference fails, the SDH equipment can automatically switch to another input timing reference using the S1 byte. For the external 2048 kbit/s timing source, the timing reference failure indicates loss of signal at the synchronous clock input interface; while for timing restoration from the STM-N line signal, the timing reference failure indicates loss of input STM-N signal bearing the timing signal, or AIS occurrence.



Long-Term Phase Variation in Locked Mode

The long-term phase variation in the locked mode refers to phase noise generated at the SDH equipment clock (SEC) output port when there is an ideal input reference signal. It is characterized by the maximum time interval error (MTIE) and time deviation (TDEV).

The ZXMP S325 meets the requirements in Table 53, Table 54, and Table 55.

T AB L E 53 . WAN D E R TO L E R AN C E U N D E R C O N S T AN T TE M P E R AT U R E (MTIE)

MTIE Limit (Unit: ns) Observation Interval (Unit: s)

40 0.1 < τ ≤ 1

40τ0.1 1 < τ ≤ 100

25.25τ0.2 100 < τ <1000

T AB L E 54 . WAN D E R TO L E R AN C E U N D E R TE M P E R AT U R E IM P AC T (MTIE)

Permissible Additional MTIE Value (Unit: ns) Observation Interval (Unit: s)

0.5τ 0.1 < τ ≤ 100

50 τ > 100

T AB L E 55 . WAN D E R TO L E R AN C E U N D E R C O N S T AN T TE M P E R AT U R E (TDEV)

TDEV Limit (Unit: ns) Observation Interval (Unit: s)

3.2 0.1 < τ ≤ 25

0.64τ0.5 25 < τ ≤ 100

6.4 100 < τ ≤ 1000

Clock Accuracy in Hold Mode

Once all the timing references are lost, the SEC would enter the hold mode after a temporary transient phase variation. And then the SEC uses the last frequency information saved before the timing reference signal is lost as the timing reference. At the same time, the oscillation frequency of the oscillator will wander slowly, but it can ensure that SEC frequency only has very small frequency deviation from the reference frequency in a long time. Therefore, the slip loss will be within the acceptable index requirement. This mode can be used in case of external clock failure in several days.

Hold Mode



When the SEC loses its reference source and enters the hold mode, from the very moment that the SEC loses its reference source, the phase error ΔT of the SEC output signal compared to its input signal should not exceed the following limit when observation time S is greater than 15 s:

ΔT (S) = [(a1+a2)S+0.5bS2+c] ns

Where,

a1=50 ns/s, representing the initial frequency deviation of 5×10-8.

a2=2000 ns/s, representing the frequency deviation caused by temperature change in the hold mode. It corresponds to 2×10-6. If there is no temperature change, there will be no “a2S” in the phase error.

b=1.16×10-4 ns/s2. It is caused by aging, corresponding to the frequency wander of 1×10-8/day.

c=120 ns, including any additional phase deviation that might be generated during the interim hold mode.

The ZXMP S325 meets all the requirements above.

Frequency Accuracy of Internal Oscillator in Free-oscillation Mode

When the SEC loses all timing references and the timing reference memory, or there is no hold mode at all, the SEC internal oscillator works in the free oscillation mode. And the SEC output frequency precision should reach a certain precision.

For a reference that can trace the G.811 clock, the SEC output frequency precision of TM equipment in the free-oscillation mode should be no worse than 4.6×10-6.

For REG equipment, it should be no worse than 20×10-6.

The ZXMP S325 meets the requirements above.

Phase Error

Free-oscillation

Mode

SEC Output Frequency Precision



OA Board Specifications OA (Optical Amplifier) boards fall into two categories as per their positions in the system:

OBA: 1-channel optical booster amplifier

OPA: 1-channel pre-amplifier

Table 56 lists the specifications of OBA board.

T AB L E 56 . TY P E S AN D S P E C I F I C AT I O N S O F OB A B O AR D

Index Unit OBA12 OBA14 Remark

Working wavelength nm 1530~1562 1530~1562 -

Optical received power range dBm -12~+4 -12~+4 -

Optical launched power (typical value) dBm 12 14 -

Adjustment range of optical launched power dB 9~12.5 11~14.5 Can be directly

adjusted.

Output controllable precision dB ±0.5 ±0.5 -

Optical launched power in Eyesafe (APR) mode dBm <3 <3 -

Optical interface connector type - LC/PC LC/PC -

Working environment temperature

ºC -10~+60 -10~+60 -

Table 57 lists the specifications of OPA board.

T AB L E 57 . TY P E S AN D S P E C I F I C AT I O N S O F OP A B O AR D

Index Unit OPA38 Remark

Working wavelength nm 1550.12 -

Optical received power range dBm -38~-20 -

Optical launched power (typical value) dBm -12 -

Adjustment range of optical launched power dB -15~-9 Can be directly

adjusted.

Output controllable precision dB ±0.5 -

Optical interface connector type - LC/PC -

Categories

Specifications



Index Unit OPA38 Remark

Working environment temperature

ºC -10~+60 -



Ethernet Specifications Ethernet interface specifications include specifications of Ethernet interfaces, the transparent transmission performance, Virtual Local Area Network (VLAN), and L2 switching.

Ethernet Interface Specifications

10 Mbit/s and 100 Mbit/s Ethernet interfaces of ZXMP S325 comply with the IEEE802.3 standard.

10 Mbit/s Ethernet interface of ZXMP S325 supports 10Base-T.

100 Mbit/s Ethernet interface of ZXMP S325 supports 100Base-TX and 100Base-FX.

Transparent Transmission Performance Specifications

Frame length refers to the length of the Ethernet data stream.

The frame lengths that can be processed by the smart fast Ethernet board (SFEx6) of ZXMP S325 meet the requirements listed in Table 58.

T AB L E 58 . S P E C I F I C AT I O N S O F FR AM E LE N G T H

Data Frame Type Maximum Frame Length (byte)

Minimum Frame Length (byte)

Data frame without VLAN tag 1532 64

Data frame with VLAN tag 1536 64

Board throughput refers to the maximum transfer rate of the Ethernet interface without packet loss.

For the ZXMP S325, when the ports of SFEx6 board are configured with 46 VC-12s, the port throughput can reach the line speed of 100 Mbit/s.

Tip: The flow control function of port must be disabled while testing the port throughput.

Packet loss ratio refers to the maximum acceptable packet loss ratio under the prerequisite that data is normally received. There is

Maximum and Minimum

Frame Lengths

Board Throughput

Packet Loss Ratio



no specific criterion for packet loss ratio. However, it should be as low as possible and close to zero under certain conditions.

Tip: The flow control function of port must be disabled when conducting the packet loss ratio test.

Delay refers to the maximum acceptable delay under the prerequisite that data is normally received. There is no specific criterion for delay. However, it should be as small as possible under certain conditions.

VLAN Specifications

The basic function of VLAN refers to the function of the tag-based VLAN that complies with the IEEE 802.1Q standard. Through the configuration in the ZXONM E300, the Smart Fast Ethernet board (SFEx6) of ZXMP S325 supports this function.

Trunk refers to the transmission of large-capacity Ethernet services by binding multiple Ethernet interfaces. The Ethernet ports in the same Trunk group have the same VLAN configuration attributes. They cannot interwork with the Ethernet ports that do not belong to the same Trunk group.

The SFEx6 board supports two trunk groups, and each group can support four Ethernet ports at most.

In IEEE 802.1Q standard, a header of four bytes is defined as a VLAN ID. Each port can belong to multiple VLANs.

The range of VLAN ID is 1 to 4094.

The SFEx6 board of ZXMP S325 meets the requirement above.

Under the prerequisite that the QoS function is enabled, when services from multiple sources are converged at one transmit port, the port can transmit these services according to the preset VLAN priorities and bandwidths. Once the total traffic exceeds the transmit bandwidth of the port, the port will discard the services with lower priorities and over bandwidth limit, to ensure the normal transmission of services with higher priorities.

The SFEx6 board of ZXMP S325 supports the configurations of VLAN priority and bandwidth proportion.

L2 Switching Specifications

The security filtering characteristics include the static MAC address setting, MAC address filtering, and broadcast address filtering.

Setting of static MAC address

Delay

Specification of VLAN Basic

Function

Trunk Specification

Quantity of VLAN IDs

VLAN Priority

Security Filtering

Characteristics



Manually add a MAC address and the information of the corresponding port into the MAC address list. Only the receive port which has been set can receive the traffic normally without any packet loss.

MAC address filtering

Filter frames that have a MAC address as the source address or the destination address by adding the MAC address manually into the MAC address list. The port that has been set cannot receive any traffic.

Broadcast address filtering

A broadcast address is a MAC address of all “F”s. It may increase network load and cause path congestion.

Broadcast address filtering can prevent path congestion.

Through configuration in ZXONM E300, the SFEx6 board of ZXMP S325 supports the above three functions.

Both the QoS and flow control are methods of handling congestion.

QoS emphasizes the normal operation of standardized services to maximize the utilization of bandwidth. It discards packets of the service exceeding the flow standard to handle congestion.

The flow control function suspends transmission to the transmit end to handle congestion and ensure that the traffic is not discarded.

Through configuration in ZXONM E300, the SFEx6 board of ZXMP S325 supports these two functions.

Specifications of QoS and

Flow Control Function



ATM Characteristics The ATM characteristics include the VP/VC exchange, range of VPI/VCI value, VP/VC multicast, transmission priority of ATM cell, VP-Ring protection, protection between layers, and ATM transmission performance.

VP/VC Exchange

The permanent virtual circuit (PVC) established for ATM service has two connection types: virtual path (VP) connection and virtual channel (VC) connection.

Figure 21 illustrates the relations between the transmission channels and these two types of connections.

F I G U R E 21 . RE L AT I O N S B E T W E E N VP, VC, AN D TR A N S M I S S I O N C H AN N E L S

Transmission Channel

VP

VP

VP

VP

VC

VC

VC

VC

… …

The ATM determines the source address and destination address of cells according to the identifier of VP and VC (VPI/VCI). Therefore, there are two kinds of exchanges: VP exchange and VC exchange.

The VP exchange refers to exchange between virtual paths. The VCI in this VP does not change after exchanging.

For example, as illustrated in Figure 22, after the VP (1) is exchanged to VP (4), the value of VCI in VP (1) does not change.

F I G U R E 22 . VP E X C H AN G E

VPI=1

VPI=5

VPI=2

VPI=4

VCI=1

… …

VCI=2

VCI=1

VCI=2

VCI=1

VCI=2

VCI=1

VCI=2

The VC exchange involves the VP exchange and VC exchange at the same time.

Categories

VP exchange

VC exchange



At first, the VP exchange is performed. After the VP connection terminates, all virtual channels on that VP continue exchanging, and are added into the destination VC finally.

For example, Figure 23 illustrates the VC exchange of two groups:

Exchange between VP (1) VC (1) and VP (2) VC (3);

Exchange between VP (1) VC (2) and VP (4) VC (4).

F I G U R E 23 . VC E X C H AN G E

VCI=1

VCI=2

VCI=4

VCI=3VPI=1 VPI=2

VPI=4

VCI=1

VC Exchange

VP Exchange

VCI=3VCI=2 VCI=4

The four-channel ATM processor board (AP1x4) of ZXMP S325 supports the VP/VC exchange after being configured in ZXONM E300.

Range of VPI/VCI Value

ATM services can be transmitted or received normally only when the VP/VC connection is within the value range.

The range of VPI value for network-to-network interface (NNI) is 1 to 4095.

The range of VPI value for user-to-network interface (UNI) is 1 to 255.

The range of VCI value is 1 to 16383.

The AP1x4 board of ZXMP S325 meets the value range requirements above.

Range of VPI Value

Range of VCI Value



VP/VC Multicast

The VP/VC link transmitting ATM service can be copied to two or more physical interfaces, and for each interface there is only one ATM link.

The VP/VC link transmitting ATM service can be copied to VP/VC links sharing one physical interface.

The AP1x4 board provided by ZXMP S325 supports both the VP/VC spatial multicast and logical multicast.

Transmission Priority of ATM Cells

The ATM service has four types:

Constant bit rate service (CBR)

Real-time variable bit rate service (rt-VBR)

Non-real-time variable bit rate service (nrt-VBR)

Unspecified bit rate service (UBR)

The ATM services transmission priority is: CBR > rt-VBR > nrt-VBR > UBR.

When the transmission flow of ATM services exceeds the maximum cell flow traffic of the ATM equipment, the ATM equipment will discard cells according to the priority of services once the congestion occurs.

The AP1x4 board provided by the ZXMP S325 has the above function.

VP-Ring Protection

The VP-Ring protection adopts the principle of concurrent transmitting and preferred receiving with alarm supervision.

The standby VP connection of the receive direction will be selected when alarms are found, such as VP-AIS (VP alarm indication signal), LOS (loss of signal), LOF (loss of frame), OOF (out of frame), and LAIS (line alarm indication signal). When the alarms disappear and no alarm appear after the switching restore time, the previous active VP connection will recover automatically.

The AP1x4 board supports the enable and restore of VP-Ring protection after configured in the ZXONM E300.

VP/VC spatial multicast

VP/VC logical multicast

ATM Service Types

ATM Service Priorities



Tip: The ATM service type of CBR is recommended for testing the VP-Ring protection

Protection between Layers

The AP1x4 board provided by ZXMP S325 can support the protection of SDH layer and ATM layer.

The protection of ATM layer refers to VP or VC protection.

1. When network fault occurs, the SDH layer protection will launch first.

2. If the SDH layer protection fails after the delay of ATM layer protection switching, the ATM layer protection will be enabled.

3. Once the service recovers, the ATM service will return to the working connection channel from protection connection after switching restore time.

The delay of protection between layers ranges from 0 s to 10 s.

The default value is 500 ms.

The stepping is 100 ms.

The switching restore time refers to the restore time of the ATM layer protection.

The range is 0 min to 30 min.

The default value is 720 s, and the stepping is 100 ms.

The AP1x4 board can be configured in the ZXONM E300 to enable and restore the protection between layers.

Tip: The ATM service type of CBR is recommended for testing the protection between layers.

ATM Transmission Performance

The ATM transmission performance represents the transmission quality of ATM cells.

The cell transmission quality involves cell transfer delay (CTD), cell delay variation (CDV), cell loss ratio (CLR), cell error ratio (CER), cell mis-insertion ratio (CMR), and bit error ratio (BER).

To guarantee the transmission quality of ATM services, the requirements of parameters specified above are different for ATM services of different types (CBR, rt-VBR, nrt-VBR, and UBR).

Protection Types

Protection Principle

Protection Delay

Switching Restore Time



The AP1x4 board supports ATM services of the type CBR, rt-VBR, nrt-VBR, or UBR. And the cell transmission quality of these services can be supervised with data network analyzers.



RPR Performance Specifications ZXMP S325 complies with the RPR performance specifications with L2 switching function.

Burst Interval

The burst interval refers to the time interval between the frame bursts of the Ethernet port at the user side.

It is generally defined as the minimum frame interval between Ethernet frames.

Table 59 lists the burst intervals.

T AB L E 59 . TH E M I N I M U M FR A M E I N T E R V AL B E T W E E N E T H E R N E T FR AM E S

Ethernet Rate (Unit: Mbit/s) Minimum Frame Interval (Unit: μs)

10 9.6

100 0.96

1000 0.096

The burst interval of ZXMP S325 satisfies the above requirements.

RPR Loop Protection Switching Time

The RPR loop protection switching time is the protection switching time of RPR itself.

The RPR loop protection switching includes two modes: wrapping and steering.

The protection switching time of both these two modes should be less than 50 ms.

The RPR loop protection switching time of ZXMP S325 satisfies the above requirements.



Address Buffering Capability

The address buffering capability refers to the number of MAC addresses that one port/module/node can buffer. The buffered MAC address can prevent the abandon or flooding of received frames during the transition.

The ZXMP S325 RPR ring network can buffer no less than 128 k addresses.

RPR Ring Network Bandwidth

The RSEB board of ZXMP S325 supports the RPR sub-ring bandwidth ranging from 155 Mbit/s to 1.25 Gbit/s.

Service Characteristics

The total number of type-A and type-C services supported by the RSEB board of ZXMP S325 is 1000. And the number of type-B services supported is eight. Table 60 compares different RPR service types.

T AB L E 60 . C O M P AR I S O N S O F RPR S E R V I C E TY P E S

RPR Service Type

Throughput Delay Jitter Loss of Frame

A0 Constant rate, with guarantee

Extremely low, with guarantee mechanism

Extremely low, with guarantee mechanism

Extremely low

A1 Variable rate, with guarantee

Low Variable Low

B

Can be over configured; has higher priority than C

No requirement No requirement

Medium

C No guarantee; depends on the network situation

No requirement No requirement

High, depends on the network situation

ZXMP S325 supports the service bandwidth ranging from 20 kbit/s to 1 Gbit/s.

ZXMP S325 supports the service rate limit granularity of 20 kbit/s.

Service Types

Service Bandwidth

Range

Service Rate Limit Granularity



Protection between Layers

The RSEB board provided by ZXMP S325 supports both SDH layer protection and RPR MAC layer protection.

The RPR MAC layer protection supports the wrapping or steering protection.

Whether to use RPR MAC layer protection and SDH layer protection simultaneously can be configured in the EMS.

When these two protections are configured to be used simultaneously, delaying the switching time of RPR MAC layer protection can support the switching between layers and thus guarantee that these two switchings will not overlap.

1. When network fault occurs, the SDH layer protection will launch first.

2. The delay of RPR MAC layer protection switching is the waiting time between the service failure detection and switching launch. During this period, if service recovers, the switching will not occur.

3. If the SDH layer protection fails after the delay of RPR MAC layer protection switching, the RPR MAC layer protection will launch.

4. When the service recovers and keeps normal after the switching restore time had passed, the service will return to the previous working path from the protection path.

5. The switching restore time is the waiting time between the service recovery and the service fault status clearance (i.e. the cancellation of protection status). During this period, if the service fails, the protection will not be cancelled any more.

The RSEB board supports setting the protection switching to be returnable or non-returnable.

The returnable switching indicates that when the working path is faulty, the service will switch to the protection path; and when the service recovers, the service will switch back to the previous working path.

The non-returnable switching will not return to the working path even after the service recovers.

The default configuration is “returnable”.

The delay of protection between layers ranges from 0 ms to200 ms.

The default value is 0 ms.

The stepping is 10 ms.

Protection Types

Protection Configuration

Protection Principle

Returnable and Non-returnable

Protection Switching

Protection Delay



The switching restore time ranges from 0 s to 1440 s.

The default value is 10 s.

The stepping unit is “second” which is configurable.

It takes effect only when the “returnable switching" is set.

Switching Restore Time



External Interface Recommendations The external interfaces refer to interfaces that connect the ZXMP S325 with other external equipment.

155520 kbit/s, 622080 kbit/s, 2488320 kbit/s Optical Interfaces

ITU-T G.707 Network node interface for the synchronous digital hierarchy (SDH)

ITU-T G.957 Optical interfaces for equipments and systems relating to the synchronous digital hierarchy (SDH)

ITU-T G.691 Optical interfaces for single-channel SDH systems with optical amplifiers and STM-64 system

ITU-T G.692 Optical interfaces for multi-channel systems with optical amplifiers

ITU-T G.825 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH)


ITU-T G.707 Network node interface for the synchronous digital hierarchy (SDH)

ITU-T G.703 Physical/electrical characteristics of hierarchical digital interfaces


1544 kbit/s, 2048 kbit/s, 34368kbit/s, 44736 kbit/s Electrical Interfaces


ITU-T G.704 Synchronous frame structures used at 1544, 6312, 2048, 8448, and 44736 kbit/s hierarchical levels




2.048 MHz Network Clock Synchronous Interface


Dual-line Interface of Orderwire Phone

The frequency range is 300 Hz ~ 3400 Hz. The modulation method is PCM, and the bit rate is 64 kbit/s.

Ethernet Interfaces

100BASE-TX, 100Base-FX, and 10Base-T physical interfaces specified by IEEE 802.3 standard.





C h a p t e r 3

Recommendations/ Standards

Table 61 lists the ITU-T recommendations and other standards that ZXMP S325 is compliant with.

T AB L E 61 . R E C O M M E N D AT I O N S AN D S T AN D AR D S C O M P L I E D B Y ZXMP S325

Recommendation Description Version

ITU-T G.703 Physical/electrical characteristics of hierarchical digital interfaces 11/2001

ITU-T G.704 Synchronous frame structures used at 1544, 6312, 2048, 8448, and 44736 kbit/s hierarchical levels 10/1998

ITU-T G.705 Characteristics of Plesiochronous Digital Hierarchy(PDH) equipment functional blocks 10/2000

ITU-T G.706 Frame alignment and cyclic redundancy check (CRC) procedures relating to basic frame structures defined in Recommendation G.704

04/1991

ITU-T G.707 Network node interface for the synchronous digital hierarchy (SDH) 10/2000

ITU-T G.708 Sub STM-0 network node interface for the synchronous digital hierarchy (SDH) 06/1999

ITU-T G.773 Protocol suites for Q-interfaces for management of transmission systems 03/1993

ITU-T G.774 Synchronous digital hierarchy (SDH) management information model for the network element view 02/2001

ITU-T G.780 Terms and definitions for synchronous digital hierarchy (SDH) networks 07/1999

ITU-T G.781 Synchronization layer functions 06/1999

ITU-T G.783 Characteristics of synchronous digital hierarchy (SDH) equipment functional blocks 10/2000

ITU-T G.784 Synchronous digital hierarchy (SDH) management 07/1999

ITU-T G.785 Characteristics of a flexible multiplexer in a synchronous digital environment 11/1996



Recommendation Description Version

ITU-T G.803 Architecture of transport networks based on the synchronous digital hierarchy (SDH) 03/2000

ITU-T G.805 Generic functional architecture of transport networks 03/2000

ITU-T G.806 Characteristics of transport equipment - Description methodology and generic functionality 10/2000

ITU-T G.810 Definitions and terminology for synchronization networks 08/1996

ITU-T G.811 Timing characteristics of primary reference clocks 09/1997

ITU-T G.812 Timing requirements of slave clocks suitable for use as node clocks in synchronization networks 06/1998

ITU-T G.813 Timing characteristics of SDH equipment slave clocks (SEC) 06/1998

ITU-T G.823 The control of jitter and wander within digital networks which are based on 2048 kbit/s hierarchy 03/2000

ITU-T G.824 The control of jitter and wander within digital networks which are based on the 1544 kbit/s hierarchy

03/2000


03/2000

ITU-T G.828 Error performance parameters and objectives for international, constant bit rate synchronous digital paths

03/2000

ITU-T G.829 Error performance events for SDH multiplex and regenerator sections 03/2000

ITU-T G.831 Management capabilities of transport networks based on the synchronous digital hierarchy (SDH). 03/2000

ITU-T G.832 Transport of SDH elements on PDH networks - Frame and multiplexing structures 10/1998

ITU-T G.841 Types and characteristics of SDH network protection architectures 10/1998

ITU-T G.842 Interworking of SDH network protection architectures 04/1997

ITU-T G.957 Optical interfaces for equipments and systems relating to the synchronous digital hierarchy (SDH) 07/1999


A p p e n d i x A

Abbreviations

Abbreviations Full Name

A

ADM Add/Drop Multiplexer

AIS Alarm Indication Signal

ATM Asynchronous Transfer Mode

AU Administrative Unit

AUG Administrative Unit Group

AU-n Administrative Unit, level n

AU-PTR Administrative Unit Pointer

B

BER Bit Error Ratio

B8ZS Bipolar with 8-Zero Substitution

B3ZS Bipolar with 3-Zero Substitution

C

CBR Constant Bit Rate

CDV Cell Delay Variation

CER Cell Error Ratio

CLP Cell Loss Priority

CLR Cell Loss Ratio

CMI Code Mark Inversion

CMR Cell Misinsertion Ratio

C-n Container, level n

Corba Common Object Request Broker Architecture

CPU Central Processing Unit

CTD Cell Transfer Delay

D

DC Direct Current




DCC Data Communications Channel

DCE Data Circuit-terminating Equipment

DDF Digital Distribution Frame

DNI Dual Node Interconnection

DTE Data Terminal Equipment

DXC Digital Cross Connect

E

ECC Embedded Control Channel

EMC Electro Magnetic Compatibility

EMI Electro Magnetic Interference

EML Element Management Layer

EMS Element Management System

EMS Electromagnetic Susceptibility

EOS Ethernet Over SDH

ESD Electronic Static Discharge

ESR Errored Second Ratio

E-RDI Enhanced Remote Defect Indication

F

FE Fast Ethernet

FPGA Field Programmable Gate Array

G

GUI Graphical User Interface

GNE Gateway Network Element

H

HDB3 High Density Bipolar of order 3

HP Higher-order Path

HP-TCM Higher-order Path Tandem Connection Monitoring

HP-UNEQ Higher-order Path UN-Equipped

I

IP Internet Protocol

ITU-T International Telecommunication

Union-Telecommunication Standardization Sector

L

L2 Layer 2

LAIS Line Alarm Indication Signal

LAN Local Area Network

LCT Local Craft Terminal

Appendix A - Abbreviations



LOF Loss Of Frame

LOP Loss Of Pointer

LOS Loss Of Signal

LPC Lower order Path Connection

M

MAC Medium Access Control

MCU Micro Control Unit

MSTP Multi-Service Transport Platform

MTIE Maximum Time Interval Error

N

NE Network Element

O

OBA Optical Booster Amplifier

OCXO Oven Controlled Crystal Oscillator

OOF Out of Frame

P

PDH Plesiochronous Digital Hierarchy

PGND Protection Ground

POS Packet Over SDH

PRC Primary Reference Clock

PVC Permanent Virtual Circuit

Q

QoS Quality of Service

R

RDI Remote Defect Indication

REG Regenerator

S

SDH Synchronous Digital Hierarchy

SEC SDH Equipment Clock

SFP Small Form Factor Pluggable

SMCC Subnetwork Management Control Center

SNC Subnetwork Connection

SNCP Subnetwork Connection Protection

SOH Section Overhead

SSM Synchronization Status Message

STM-N Synchronous Transport Module, level N




T

TCP Transport Control Protocol

TDEV Time Deviation

TDM Time Division Multiplex

TM Terminal Multiplexer

TU Tributary Unit

TUG-m Tributary Unit Group, level m

TU-m Tributary Unit, level m

U

UBR Unspecified Bit Rate

V

VBR Variable Bit Rate

VC Virtual Channel

VC Virtual Container

VCI Virtual Channel Indicator

VC-n Virtual Container, level n

VLAN Virtual Local Area Network

VP Virtual Path

VPI Virtual Path Indicator

VPG Virtual Path Group


Figures

Figure 1. Interfaces of the ZXMP S325 DXC Equipment .............. 10

Figure 2. Pass-through Mode.................................................. 10

Figure 3. Add/Drop Mode....................................................... 10

Figure 4. Broadcast Modes..................................................... 11

Figure 5. Cross-Connect Mode................................................ 11

Figure 6. Application of Cross-Connect between Tributaries ........ 12

Figure 7. Mask of Eye Diagram for Optical Transmit Signal ......... 34

Figure 8. Output Pulse Mask at the 1544 kbit/s Electrical Interface.........................................................................................41

Figure 9. Output Pulse Mask at the 2048 kbit/s Electrical Interface.........................................................................................42

Figure 10. Output Pulse Mask at the 34368 kbit/s Electrical Interface............................................................................. 43

Figure 11. Output Pulse Mask at the 44736 kbit/s Electrical Interface............................................................................. 44

Figure 12. Mask of a Pulse Corresponding to a Binary 0 at the 155520 kbit/s Electrical Interface ........................................... 45

Figure 13. Mask of a pulse Corresponding to a Binary 1 at the 155520 kbit/s Electrical Interface ........................................... 45

Figure 14. Jitter and Wander Tolerance of 1544 kbit/s Electrical Input Interface..................................................................... 46




Figure 18. Jitter Tolerance of STM-N Terminal Multiplexer Input Interface............................................................................. 50

Figure 19. Input Jitter Tolerance of STM-N SDH Regenerator ...... 51

Figure 20. Jitter Transfer Characteristic of Regenerator.............. 55

Figure 21. Relations between VP, VC, and Transmission Channels65

Figure 22. VP Exchange......................................................... 65

Figure 23. VC Exchange ........................................................ 66





Tables

Table 1. Chapter Summary .......................................................i

Table 2. Typographical Conventions .......................................... ii

Table 3. Mouse Operation Conventions ..................................... iii

Table 4. Optical Interfaces Provided by the ZXMP S325................1

Table 5. STM-16 Optical Interfaces Provided by ZXMP S325..........2

Table 6. STM-4 Optical Interfaces Provided by ZXMP S325 ...........3

Table 7. STM-1 Optical Interfaces Provided by ZXMP S325 ...........3

Table 8. Electrical Interfaces Provided by the ZXMP S325.............4

Table 6.Multi-service Interfaces Provided by the ZXMP S325.........5

Table 7. Dimensions and Weights of ZXMP S325 Components ..... 17

Table 11. Power Consumptions of Boards in ZXMP S325............. 19

Table 9. ZXMP S325 Power Consumptions (Typical Configuration 1).........................................................................................23



Table 15. Temperature/Humidity Requirements ........................ 26

Table 16. Requirements for Harmful Gases in the Equipment Room.........................................................................................27

Table 17. ESD Resistivity....................................................... 29

Table 18. RF Electromagnetic Field Radiation Resistivity ............. 29

Table 19. Electrical Transient Burst Resistivity at DC Power Port.. 29

Table 20. Electrical Transient Burst Resistivity at AC Power Port .. 29

Table 21. Electrical Transient Burst Resistivity at Signal Cable and Control Cable Ports............................................................... 29

Table 22. Surge Resistivity of DC Power Supply ........................ 30

Table 23. Surge Resistivity of AC Power Supply ........................ 30

Table 24. Surge Resistivity of Outdoor Signal Cable................... 30

Table 25. Surge Resistivity of Indoor Signal Cable (10 m) .......... 30

Table 26. RF Field Conductivity Resistivity................................ 30



Table 27. Conductive Emission Electromagnetic Interference ...... 31

Table 28. Radiated Emission Electromagnetic Interference.......... 31

Table 29. STM-16 Optical Modules Supported by ZXMP S325 ...... 32

Table 30. STM-4 Optical Modules Supported by ZXMP S325........ 32

Table 31. STM-1 Optical Modules Supported by ZXMP S325........ 33

Table 32. Parameters of Eye Diagram Mask for Optical Transmit Signal ................................................................................. 34

Table 33. STM-N Mean Optical Launched Power (dBm)............... 35

Table 34. Extinction Ratio of STM-N Optical Interfaces ............... 35

Table 35. STM-N Receiver Sensitivity (Unit: dBm) ..................... 36

Table 36. STM-N Receiver Overload ........................................ 36

Table 37. Code Patterns of Electrical Signal .............................. 38

Table 38. Permitted Attenuation/Frequency Deviation of Input Interface, and Signal Bit Rate Tolerance of Output Interface ....... 39

Table 39. Requirements on the Reflection Attenuation Index of an Input/Output Interface.......................................................... 39

Table 40. Anti-interference Capability of ZXMP S325.................. 40

Table 41. Jitter and Wander Tolerance of 1544 kbit/s Electrical Input Interface..................................................................... 46




Table 45. Input Jitter and Wander Tolerance (UIP-P) of SDH Terminal Multiplexer ............................................................. 50

Table 46. Frequency (Hz) of Input Jitter and Wander Tolerance of SDH Terminal Multiplexer ...................................................... 51

Table 47. Input Jitter Tolerances of STM-1, STM-4 and STM-16 Regenerators ....................................................................... 51

Table 48. Specifications of Inherent Output Jitters at STM-N Interfaces in SDH equipment ................................................. 52

Table 49. Specifications of Output Jitters at STM-N Network Interfaces in SDH Equipment ................................................. 53

Table 50. Mapping Jitter of PDH Tributary Interface................... 54

Table 51. Combined Jitter ...................................................... 54

Table 52. Parameters of Jitter Transfer Characteristic of Regenerator ........................................................................ 55

Table 53. Wander Tolerance under Constant Temperature (MTIE) 58

Table 54. Wander Tolerance under Temperature Impact (MTIE) ..58

Appendix A - Abbreviations


Table 55. Wander Tolerance under Constant Temperature (TDEV)58

Table 56. Types and Specifications of OBA Board ...................... 60

Table 57. Types and Specifications of OPA Board ...................... 60

Table 58. Specifications of Frame Length ................................. 62

Table 59. The Minimum Frame Interval between Ethernet Frames70

Table 60. Comparisons of RPR Service Types............................ 71

Table 61. Recommendations and Standards Complied by ZXMP S325 .................................................................................. 77

Documents

ZXMP S325(V2.00) Product Descriptions