Alloy Thin FilmsBy: Nelson Voldeng Advisor: Dr. King

Thin Film Applications

• •Semiconductor processing for integrated electronic components and sensors• •Super conductor materials for tomorrow’s new technologies• •Anti-reflective (AR) optical films for better light transmission and clarity• •Clear conductive films used in touch-screen and plasma flat panel display

technologies• •Hard film wear-ability coatings for tool steel and internal combustion engine

components• •Reflective coatings for media storage like CD’s, DVD’s, and tape• •Conductive coatings for miniature medical probes and sensors• •Flexible and bendable lenses for X-ray wave length telescopes for space

exploration• •Thin film coatings on Mylar, poly-carbine, and other substances for protective

and/or decorative applications• Etc…

Overview of Research

-Goals

-Sputtered films/sectioned films

-Taking data (largest hurdle)

-Results

-Future research

Goals• Research electronic applications (as well as

others) for alloy thin films.

• Have alloy film with columnar single crystals from top the film to bottom.

Phase Diagram Cu-Ag

Sputtering Mechanism and Film

Physics

Physics Continued.

• Em=0.4E*(M1+M2)/(M1+M2)^2• E=Kinetic energy of incoming particle.• M1=Mass of incoming particle.• M2=Mass of target particle.

• If Em>bond energy there’s a chance you can remove a target particle.

Hurdles with taking data• ZIESS and Profilometer microscope failed.

AFM failed at first due to 150µm maximum scanning parameter. Succeeded by measuring cracks and scratches on films

Measuring the films at first• Not easy, time consuming, and poor data.

More bad data

Good results

Gap picture

Results Overview• Height graphs for Ag and Cu

• Approximate Deposition rates for Ag and Cu

• Composition charts for CuAg film

Height graphs AgAg20min2cm side1

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Ag20min2cm side2

0100200300400500600700800900

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Series1

Ag30min2cm(9-16side) height(nm) vs. position

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Deposition rates for Ag

Atoms per sec 1st half of side1

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Atoms per sec 1 side 2nd half

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Unusable height graph for Cu

Cu20min2cm height(nm) vs. position

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-Diamond scribe unreliable for scratching films.-Cuts into substrate and shatters film.

Most Recent Breakthrough!-Previously we thought Profilometry

gave unusable results. -However, the once deemed useless

profilometer is much quicker at measuring films. 1hr40mins per film (profilometer) vs. 5hrs per film (AFM)

Cu30min2cm side 1 height(nm) vs. position

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Cu30min2cm side 2 height(nm) vs. position

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Sputtering rates

Cu30min2cm and Ag30min2cm(9-16side) height(nm) vs. position

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Concentration and Mole Wt Graphs for AgCu Alloy

Percentage vs. position

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Mole Wt% Ag

Mole Wt% Cu

Percentage vs. position

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Concen. Wt% Ag

Concen. Wt% Cu

For Future research• Film measurement Profilometer

• Film sputtering scotch tape method, or lithography

• Composition control Use targets with unequal element areas. Use target that is an alloy

• Need more accurate results More data points for film thickness.

Thanks• Dr. King and the Materials Department.

• Grad. Students and Kei.