ALSEP Array E Engineering Model Subpackage No. 2 design

ALSEP Array E Engineering Model Subpackage No. 2 Design Limit Vibration Test Results

NO.

ATM-1090

PAGI! 1

RI!V. NO.

OF-

DATE 3 I 2 0 I 7 2

This teclmical memorandum represents the engineering vibration test report for EEM Subpackage No. 2.

Prepared by: (£. 1~ R. Thomas

Approved by:~~:, • Mas·zat s

Approved by:~ iMCNaughtOU

1.0 'Introduction

t..O Test Article

3.0 Test Description

4.0 Instrumentation

5.0 Results

6.0 Conclusion

7.0 i'

References

ALSEP Array E Engineering Model Subpackage No. t. Design Limit Vibration Test Results

TABLE OF CONTENTS

HO. REV. NO.

ATM-1090'

PAGE 2 OF-

DATE 3/20/72

Page

4

4

4

4

4

6

7

1 \ : :. . .

\

LIST JF TABLES

Table I

1

3

4

LIST OF FIGURES

Figure

1

2

3-7

8-16

17-L.S

26-34

35-43 I


ATM-1090

PAGE 3

REV. NO.

OP:-

DATE 3/20/72

Title

EEM-SPZ Hardware 8

EEM-SP2 Design Limit Vibration Test Levels 9

EEM-SPZ Instrumentation 10

EEM-SP2 Vibration Response Values 11

Title

EEM-SP2 (Photo)

EEM..;SP2 Instrumentation

Alsep SP2 Vibration Test Levels

RTG Response Data

LEAM Response Data

AAM Response Data

HFE Electronics Response Data

HFE Probe Response Data

I

Page

I 12

13

14-18

19-27

z8 -36

37-45

46-54

\

ALSEP Array E Engineering Model Subpackage No. 2

NO.

ATM-1090

4

REV. lofO

Design Limit Vibration Test Results PAGE OF-

DATE 3/20/72

1. 0 Introduction

The Array E Subpackage No. 2 engineering model (EEM-SP2) was subjected to the ALSEP specified design limit vibration levels. The primary purpose of the test was to verify the structural integrity of the system and to verify that the component environments are consistent with component specifications given in reference 1.

2. 0 Test Article

The EEM Subpack 2 consists primarily of EEM and modified Qual D components. A detail breakdown of the major components is given in Table I. The individual experiments and components mount to the basic pallet: and the HFE subpallet. A photograph of Subpack 2 is shown in Fi,ure I.

3. 0 Test Description

EEM Subpack 2 was subjected to sinusoidal and random vibration tests as outlined in Table 2. The subpack experienced sinusoidal sweep, launch and boost random, and lunar descent random environments in all three axes (x, y, z) for a total of nine individual vibration tests. Accelerometers were mounted on the subpack in order to obtain response data at the individual experiment attachment points. Additional information with respect to the test plan is contained in reference t..

4. 0 Instrumentation

Eighteen accelerometers were mounted on Subpack L. and monitored during each of the EEM vibration tests. Figure 2 shows a schematic of Subpack t. with the exact locations of the accelerometers. Additional informaJtion regarding locations and response directions is listed in Table 3 and reference 3.

5. 0 Results

Response data is given for each of the three orthogonal axes for the individual components - the R TG, LEAM, AAM, HFE electronics, and HFE probe. Response envelopes giving g -peak and power spectral

I

J

ALSEP Array E Engineering Model Subpackage No. t.

NO.

~TM-1090

5

REV. NO.

i

······~D8178De Design Limit Vibration Test Results

PAGE OF_

Systema Dlvllalon DATE 3 I 20 I 72.

density values due to sine and random inputs are shown. For the LEAM and the AAM segmented straight line curves are superimposed on each of the response envelopes which represent specification levels to which the individual components are designed and tested (Ref. I). Solid curves represent response for which the output is in the same direction as the input (e. g., response in x-direction due to input in x-direction). Dashed lines represent cross -axis response (e. g., response in x-direction due to input in y-direction). For the RTG, HFE probe, and HFE electronics response data is shown in the same manner. However, since original specification levels for the RTG and HFE are no longer applicable, the response data for these must be compared to the qualification vibration levels of each component. These levels were recorded at the component attachment points during the Qual SA, Qual B, and/or Qual C tests.

· Table 4 is included to summarize the maximum g-peak and g-rms values: for each of the individual components due to sine and ra:ndom testing.

I

I Figure~ 8-16 show response levels for RTG due to sinusoidal, launch and boost random, and lunar descent random inputs. A maximum response of 11. 5 g-peak at 63 Hz due to sine input is shown in Figure 8. Figures 9 & 10 show the Y & Z sine response. Figures 11-16 show the power spectral density levels for the random environments. Levels are generally low across the frequency band except at about 1500Hz where a spike exists.

Figures 17 -~5 show response levels for the LEAM due to the different input environments. Figure 17 shows a maximum x-axis sinusoidal response of 15.0 g-peak at 65 Hz, whereas the spec level limit (Ref. 1) is '1. Og. Figures 18 & 19 show Y & Z sine response to be in good agreement with spec levels. Response levels due to launch and boost and lunar descent random vibration levels are shown in Figure 20 -~5. These response levels are in good agreement with the spec levels across the frequency band.

Figures ~6-34 show response levels for the AAM due to the sine and random vibration environments. Response levels are consistent with spec levels (Ref. 1) for all three input axes and all three input environments.

Figures 35-43 show response levels for the HFE electronics. The sine response in Figure 3 5 shows a maximum x-response of ~3. 0 g-peak at bO Hz. Figures 36 & 37 show a maximum Y & Z response level of 8. 0


Design Limit Vibration Test Results

NO.

ATM-1090

PAGE 6

REV. NO.

OF_

DA T! 3 I 2 0 /7 2

g-peak due to cross axis input. The response levels due to launch and boost and lunar descent random inputs are shown in Figures 38-43. The response levels across the frequency band are similar having a high power spectral density in the lower frequency range and a low power spectral density in the high frequency range. The response data should be compared with previous arrays for proper interpretation.

Figures 44-5~ show response levels for the HFE probe. In general the response levels are similar to the HFE electronics. The sine response in Figure 44 shows a maximum X-response of 23.0 g-peak at 65 Hz. Response levels under 9. 0 g-peak are seen in Figures 4-' & 46 for the Y & Z directions. The response levels due to launch and boost and lunar descent random inputs are shown in Figures 44-52. Much like the HFE electronics the response levels across the frequency band are higher in the low frequency range and lower in the high frequency range. Again this response data should be compared with previous arrays for proper interpretation.

6. 0 Conclusion

Vibration testing of Array E engineering model of Subpack 2 was completed on ~~ July 71. Individual component response levels were ascertained for the R TG, LEAM, AAM, HFE electronics, & HFE probe, due to the design limit vibration levels as specified for ALSEP.

For the RTG a maximum X-response of 11.5 g-peak at 63 Hz due to sine input was seen. This compares with a g-peak of 5. ~at 43 Hz in previous arrays. The power spectral density levels for the random environments are generally low across the frequency band except at about 1500 Hz where a spike exists. Except for these two excursions the response levels are in fairly ~ood agreement with those from the previous arrays.

For the LEAM the response levels are generally in good agreement with the specification levels across the frequency band for both sinusoidal and random tests. The only exception is a maximum X-axis sinusoidal response of 15.0 g-peak at Hz, whereas the specification level (Ref. 1) is 9· 0 g-peak.

For the AAM the response levels for both the sinusoidal and random vibration environments are entirely consistent with specification levels (Ref. 1) for all three axes and all ~hree input environments.

j

ALSEP Array E Engineering Model Subpackage No. Z Design Limit Vibration Test Results

NO. RI!V. N

~T\1-lt'90

DATE 3/20/72

For both the HFE electronic• and the HFE probe the maximum response was foWlci to be 23.0 &-peak ~t about 60 Hz along the x-axis. ~ht~ responee levela due to the random input were similar having a high po-wt· r spectral density in the lower frequency range and a desirable low powe'r spectral den1ity in the hi&h frequency range. The above sine response of 23.0 g-peak at 60 Hz compares to 7 g-peak at ~z Hz for Qual D - SP z tests.

The increa•e m amplitude during the X-axis sinusoidal vibration for the RTG, LEAM, & HFE components is due primarily to the additional mass on EEM-SP2 relative to Qual D-SP2 and secondary effects due to ,over used rubber &romm.et•. It baa been demonstrated in reference 4 pertaining to the HFE that thi1 combination probably caused a non-linear spring bel1avior and lower dampin& of the system resulting in the frequency shift with an increa•e in aaplit.ie at re•onance.

Recommendation• have been made to (I) stiffen the pallet ,in the X-direction and (2) to replace all used silicone rubber grommets with !.

new one'.•· This combination will increase the natural frequency and ins\.ue maximur damping reeultin& in decreased amplitude.

I

It i1 concluded then that the basic structural integrity of the system has been verified and, with the above recommendations, the component environments 1hould be entirely consistent with the test level component specifications and previou• component qual levels.

7. 0 References

I. ATM-96-4, "ALS~P Array E Component Non-Operating Vibration Specifications Z/ 2/71 ''.

2. BxALetter No. 9712-331 "ALSEP Array E EEM Vibration Test .Pl..aft" 4:/27/71 ~

3. BxA Letter No. 9112-383, "EEM Instrumentation Plan for Vibration Testing',', 6/10/7 ~·

4. BxA Lettel' No. 9712-631 "HFE Vibration Environment-EEM Subpack No. Z", lOjl$/71.

_; .. :



TABLE I

EEM SUBPACK II HARDWARE

Pallet Qual D (modified)

HFE subpallet Qual D (modified)

LEAM subpallet EEM

Tools & carry bar EEM

Gimbal and container Qual D

RTG Qual D (Simulator)

HFE DVT (SN -1)

MO. RE''. MO.

ATM-1090

PAGE 8 OF

DATE 3/20 I 72

\

LEAM EEM (Dynamic Simulator)

' ¥ . 5

(; /(


TABLE 2

MO. RIV. NO.

ATM-1090

PAGI 9 or_

DATI 3/20/72

EEM SUBPACK n VIBRATION TESTS- DESIGN LIMIT LEVELS

Test Axis Level

Sine X Fig. 3

Random (L&B) X Fig. 4

Random (L. D. ) X Fig. 7

Sine y Fig. 3 ,-

Random ( L& B) y Fig. 5

Random (L. D. ) y Fig. 7

S:ine z Fig. 3

Random (L& B) z Fig. b

Random (L. D. ) z Fig. 7

,, '

Location No.

a

A

B

F

G


TABLE 3

EEM/SP-l INSTRUMENTATION

Ace. Nos. Location

1, l, 3 Sunshield, near RTG brkt. and strut brkt.

-4, 5, b

7, 8, 9

10

Carrier near right rear LEAM brkt. (on hat sect. )

Carrier, near rear AAM brkt.

Carrier, near right fwd. LEAM brkt.

11, ll, 13 Upper left HFE brkt,. top

14 Lower right HFE brkt., top

15, lo, 17 Left HFE probe brkt

Accelerometers

3

3

3

1

3

1

j

18 Right HFE probe brkt 1

.... ,_ ........ '

.. o. tn:v. r.v. I

ATM-1090

PAGE 10

OF-

DATE 3/20/72

Response Dir.

x,y,z

x, y, z

x,y,z

input-axis

x, y, z

input-~is

x,y,z

input-~xis

' ,,

I

ALSEP Array E Engineering Model Subpackage No. L.


TABLE 4

EEM SP 2 VIBRATION RESPONSE VALUES

INPUT

PAGE 11

OF_

DATE 3/20/72

~Launc1'.C&' Boost Lunar lJescent '

RESPONSE Sinuaoidal Random

RTG 1-2-3

LEAM 4-5-6

AAM I

7-8-9

HFE Elect. ll-I2-13

HFE Prob~ l5-I6-17 '

'

NOTE:

X y z X y z

X 11.9 1.0 1.0 6.0 j. L. 6.4

y 1.0 1.7 O.t.. 4.5 5. 8 7.!:>

z 3.0 0. l o. j 5. 5 3. 8 6.8

X 15. 5 1. 3 1.1 5.8 j.6 j.O

y 1. 7 1.7 0.4 j.t! 4.2 j.4

z 2. u 0.3 j. 6 4.1! 2. 8 L..L.

X 2. 8 l. 1 1.9 5.L. j. 8 2.5

y l.I 1.6 0.3 3. I 4.0 1.5

z 0.4 0.3 2. 8 4.L. 2. 8 2. 3

X 23.5 1.3 3.6 I. 6 1.0 l.U

y 7.5 3.4 l.I I. 4 0.8 < I

z 7.5 0.8 4.9 N.D. 0.7 N.D.

X 23.5 3.0 z. 5 1.5 1.6 < 1

y 9.0 4.6 1.0 l.Z 0.8 1.0

z 5.0 z. z 1.8 0.3 0.8 < I

SINE LEVELS ARE G-PEAK VALUES. RANDOM LEVELS ARE G (RMS) VALUES.

Random

X y z

4. !;) j.O !:>.4

j.8 4.1! 6.6

3.8 2.8 6.0

::s. 5 j.U 3. 1

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2. 8 2.4 1.8

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ALSEP Array E Engineering Model Subpackage No. Z


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Figure t. EEM-SP 2 Instrumentation

ATM-1090

PAGE 13 OF

DATE 3/20/72

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ALSEP Array E Engineering Model Subpackage No. 2 design