B e s t M a n u f a c t u r i n g P r a c t i c e s

REPORT OF SURVEY CONDUCTED AT

LAWRENCE LIVERMORENATIONAL LABORATORY

LIVERMORE, CA

JANUARY 1997

BEST MANUFACTURING PRACTICES CENTER OF EXCELLENCECollege Park, Maryland

www.bmpcoe.org

F o r e w o r d

This report was produced by the Best Manufacturing Practices (BMP)program, a unique industry and government cooperative technology transfereffort that improves the competitiveness of America's industrial base both hereand abroad. Our main goal at BMP is to increase the quality, reliability, andmaintainability of goods produced by American firms. The primary objectivetoward this goal is simple: to identify best practices, document them, and thenencourage industry and government to share information about them.

The BMP program set out in 1985 to help businesses by identifying,researching, and promoting exceptional manufacturing practices, methods, and

procedures in design, test, production, facilities, logistics, and management – all areas which arehighlighted in the Department of Defense's 4245-7.M, Transition from Development to Productionmanual. By fostering the sharing of information across industry lines, BMP has become a resource inhelping companies identify their weak areas and examine how other companies have improvedsimilar situations. This sharing of ideas allows companies to learn from others’ attempts and to avoidcostly and time-consuming duplication.

BMP identifies and documents best practices by conducting in-depth, voluntary surveys such asthis one at Lawrence Livermore National Laboratory, Livermore, California conducted during theweek of January 28, 1997. Teams of BMP experts work hand-in-hand on-site with the company toexamine existing practices, uncover best practices, and identify areas for even better practices.

The final survey report, which details the findings, is distributed electronically and in hard copy tothousands of representatives from government, industry, and academia throughout the U.S. andCanada – so the knowledge can be shared. BMP also distributes this information through severalinteractive services which include CD-ROMs, BMPnet, and a World Wide Web Home Page located onthe Internet at http://www.bmpcoe.org. The actual exchange of detailed data is between companiesat their discretion.

Lawrence Livermore National Laboratory’s most distinguishing feature is the ability to solvecomplex technical problems by integrating its diverse capabilities in science, engineering, andmanagement. In addition, the Laboratory remains committed to serving the Nation; supportinginnovative, cutting-edge initiatives; fostering scientific and mathematical education; and inspiringfuture generations of scientists and engineers. Among the best examples were Lawrence LivermoreNational Laboratory’s accomplishments in precision systems and precision manufacturingtechnology; laser cutting and machining; accelerator mass spectrometry; nondestructive andmechanical evaluation; and zephyr paperless procurement system.

The Best Manufacturing Practices program is committed to strengthening the U.S. industrial base.Survey findings in reports such as this one on Lawrence Livermore National Laboratory expandBMP’s contribution toward its goal of a stronger, more competitive, globally-minded, andenvironmentally-conscious American industrial program.

I encourage your participation and use of this unique resource.

Ernie RennerDirector, Best Manufacturing Practices

Lawrence Livermore National LaboratoryC o n t e n t s

1. Report Summary

Background ......................................................................................................... 1Best Practices ...................................................................................................... 2Information ......................................................................................................... 3Point of Contact .................................................................................................. 4

2. Best Practices

DesignAutomated and Intelligent Systems ................................................................... 5Electromagnetic Modeling and Measurements .................................................. 5Electronic Technologies for Precision Manufacturing ........................................ 6Laser Cutting and Machining ............................................................................. 7Sensors and Sensor Systems ............................................................................... 9Vapor Phase Manufacturing .............................................................................. 10

TestAccelerator Mass Spectrometry ......................................................................... 11Nondestructive and Mechanical Evaluation .................................................... 12

ProductionMicroelectronics Technology .............................................................................. 13Optoelectronics Manufacturing ......................................................................... 14Precision Systems and Precision Manufacturing Technology ......................... 14Semiconductor Technology ................................................................................ 15Zephyr Paperless Procurement System ............................................................ 15

FacilitiesChemical and Electrochemical Processes ......................................................... 16Microtechnology ................................................................................................. 16

i

Lawrence Livermore National LaboratoryC o n t e n t s (Continued)

ii

3. Information

DesignDecision Sciences and Systems Research ......................................................... 19Multilayer Materials .......................................................................................... 20Product and Process Design Modeling .............................................................. 20Technical Data Exchange .................................................................................. 21

ProductionElectronic Manufacturing Group ...................................................................... 22Technologies Enabling Agile Manufacturing ................................................... 22Vacuum Process .................................................................................................. 23

FacilitiesUser Facilities .................................................................................................... 23

ManagementAdvanced Telecommunications for Manufacturing .......................................... 24

APPENDIX A - Table of Acronyms ......................................................................... A-1APPENDIX B - BMP Survey Team ......................................................................... B-1APPENDIX C - Critical Path Templates and BMP Templates .......................... C-1APPENDIX D - BMPnet and the Program Manager’s WorkStation ................. D-1APPENDIX E - Best Manufacturing Practices Satellite Centers ...................... E-1APPENDIX F - Navy Manufacturing Technology Centers of Excellence ..........F-1APPENDIX G - Completed Surveys ........................................................................ G-1

Lawrence Livermore National Laboratory

Figures

2-1 DSI-TIGER Overview of Approach ......................................................................... 62-2 Advanced Controller Within the Total Manufacturing System ............................. 62-3 MOS Architecture .................................................................................................... 72-4 Chirped Pulse Amplification Technique ................................................................. 82-5 Laser Cutting Project Schematic ............................................................................. 92-6 Clementine Sensor Suite ....................................................................................... 102-7 Airborne Multisensor Pod System......................................................................... 102-8 Net Shape Vapor Deposition System..................................................................... 112-9 Schematic of CAMS AMS System ......................................................................... 112-10 Laser Doping & Electronics on Plastic ................................................................. 142-11 Microtechnology Center Layout ............................................................................ 173-1 Multilayer Technologies ......................................................................................... 203-2 Significant Performance Benefits from Parallelization ....................................... 213-3 The TEAM Concept ................................................................................................ 23

Table

3-1 First-cut Allocation ................................................................................................ 19

F i g u r e s & T a b l e

iii

1

S e c t i o n 1

Report Summary

Background

The Lawrence Livermore National Laboratory(LLNL) was founded in 1952 by E.O. Lawrence, aNobel laureate and distinguished pioneer in man-aging large-scale, innovative research projects thatcombined the expertise of many disciplines. Thefacility, built on the site of an old World War IInaval air station, was established to ensure Na-tional security through the design, development,and stewardship of nuclear weapons. Today, LLNLfocuses on global security to reduce nuclear danger;global ecology to harmonize the economy with theenvironment; and bioscience to advance the under-standing of life and health. Beyond these primaryfocuses, LLNL facilitates the sharing of its exper-tise through industrial and academic partnerships;champions the building of scientific foundationsthrough innovative science and technology research;and encourages future generations of scientistsand engineers through community outreach pro-grams. Located in Livermore, California, LLNLencompasses one square mile of land and employs8,500 personnel. Its 1995 fiscal budget was inexcess of $1 billion.

LLNL has been administered since its inceptionby the University of California, first for the AtomicEnergy Commission and now for the U.S. Depart-ment of Energy. Throughout its history, LLNL hasdeveloped into a multidisciplinary facility with abroad range of technical capabilities, specific corestrengths, and unique scientific expertise. Likeother national laboratories, LLNL faces newchanges, challenges, and opportunities. The facility'smost distinguishing feature is the ability to solvecomplex technical problems by integrating its di-verse capabilities in science, engineering, and man-agement. In addition, LLNL continues to attractthe best researchers in the world, promote scien-tific excellence and technological achievement ashigh priorities, and achieve success through anefficient management and cost-effective infrastruc-

ture. Among the best practices documented wereLLNL's precision systems and precision manufac-turing technology; laser cutting and machining;accelerator mass spectrometry; nondestructive andmechanical evaluation; and zephyr paperless pro-curement system.

As an exclusive technology, LLNL is developinghigh precision cutting which uses extremely shortpulse lasers (pulse width <200 femtoseconds). Ad-vantages of this technology include extreme preci-sion, very high cutting efficiency, virtually no heat-ing of the material being cut, and no detectableheat-affected zone at the cut edges. Holes drilledwith femtosecond pulses are more precise andcleaner than those drilled by conventional meth-ods. In addition, nondestructive and mechanicalevaluation is becoming an increasingly more im-portant element of the design and manufacturingprocesses. LLNL has applied various technologies(e.g., computer axial tomography, radiography,scanning x-ray fluorescence microscopy) to uniqueinspection situations (e.g., evaluating heart valves;automobile brakes and gears; mines buried in sand;plastic explosives). LLNL works routinely withproduction plants in a flexible manufacturing envi-ronment, transfers developed technology from thelaboratory to industry, and actively promotes therole of nondestructive evaluation technology inconcurrent engineering.

As a world-renown facility, LLNL's vision for thefuture is one of sustained, results-oriented excel-lence. LLNL continues to cultivate and inspire aquality-driven laboratory staff guided by high prin-ciples and strong core values. Through its scientificand technical expertise, LLNL remains committedto serving the Nation; supporting innovative, cut-ting-edge initiatives; fostering scientific and math-ematical education; and inspiring future genera-tions of scientists and engineers. The BMP surveyteam considers the following practices to be amongthe best in industry and government.

2

neering and manufacturing capabilities with afull system mentality, LLNL has designed anddeployed various remote sensing systems andunattended monitoring systems.

Vapor Phase Manufacturing 10

LLNL's Laser Directorate is developing andtransferring electron-beam manufacturing tech-nology to industry and government. This tech-nology enables complex metal alloy shapes to befabricated by depositing vaporized metal onto amold or mandrel, which is later separated fromthe alloy part. In parallel with this effort, LLNLis developing a real-time, laser-based controlsystem to measure and control the alloy compo-sition during vapor deposition of the part.

Accelerator Mass Spectrometry 11

At LLNL, the Center for Accelerator Mass Spec-trometry develops and operates accelerator-based isotopic abundance measurements usingaccelerator mass spectrometry and spatially-defined elemental distributions using an ionmicroprobe, for a wide range of applications.The Center has applied these techniques inbiodosimetry; atmospheric and geosciencemechanisms; paleoclimatology; non-prolifera-tion; and materials science.

Nondestructive and Mechanical 12Evaluation

Nondestructive evaluation is becoming an in-creasingly more important element of the de-sign and manufacturing processes. LLNL hasapplied various technologies to unique inspec-tion situations such as evaluating heart valves;automobile brakes and gears; mines buried insand; and plastic explosives.

Microelectronics Technology 13

LLNL uses microelectronics technology for suchapplications as field emission flat panel dis-plays, microelectro-magnetic devices, and elec-tronic packaging. In each case, LLNL relies onits expertise in materials science; thin filmprocess development; application knowledge;and 3-D surface lithography capabilities to con-tribute to the success of the project.

Optoelectronics Manufacturing 14

LLNL has been developing improved passivealignment techniques. With its optoelectroniccapabilities, LLNL pursues low-cost, high-pre-cision passive coupling of optical fibers to opto-electronic devices, the automation of the fiber

Item PageBest Practices

The following best practices were documented atLLNL:

Item Page

Automated and Intelligent Systems 5

LLNL has developed a telerobotic system whichincreases flexibility and autonomous capabili-ties, reduces programming time, and offers a 3-Dshape recognition system. With its unique alli-ance of robotics and the stereo 3-D surfaceimaging, the telerobotic system allows the robotto perform random-part recognition, controlled-force compliance, and real-time path planning.

Electromagnetic Modeling and 5Measurements

LLNL has developed an EIGER frequency-do-main modeling technique and a DSI-TIGERtime-domain modeling technique. When per-formed on a massively parallel, high-speed com-puter, these techniques will describe currentson 2-D and 3-D objects; impedances; S-param-eters; fields at general observation points; far-field patterns and radar cross-sections; andinterface to commercial computer aided designfor mesh generation.

Electronic Technologies for Precision 6Manufacturing

LLNL has been developing and building ad-vanced computer control systems for variousapplications since the early 1980s. LLNL iscurrently leading a joint effort to develop a next-generation controller for manufacturing thatoffers more flexibility and maintainability. Theproject focuses on looking at the total manufac-turing system.

Laser Cutting and Machining 7

LLNL is developing an exclusive technology forhigh precision cutting which uses extremelyshort pulse lasers (pulse width <200femtoseconds). This technology consistentlyproduces kerf widths as small as 20 microme-ters through metals one-millimeter thick.

Sensors and Sensor Systems 9

LLNL, in collaboration with industry, academiaand other government agencies, has demon-strated several high-quality affordable sensorsystems which address the Nation's needs andrequirements. By combining its scientific, engi-

3

pigtailing process, and the computer aided de-sign of optoelectronic devices to reduce fabrica-tion development costs.

Precision Systems and Precision 14Manufacturing Technology

LLNL is a developer of precision systems com-prising precision machines and precision manu-facturing processes. The ability to develop amaterial removal process, as well as to designand build the machinery that embodies a pro-cess, has led to significant contributions to thestate of technology in single point diamondturning and in the grinding of brittle materials.

Semiconductor Technology 15

As a world expert in laser recrystallization anddoping of silicon for semiconductor devices,LLNL's Advanced Process Development Grouphas been developing and demonstrating tech-nologies which may replace ion implantation for0.18-micrometer and below generations of inte-grated circuits. Those LLNL programs with thegreatest potential for quantum-leap impacts inthe semiconductor industry include gas immer-sion laser doping; poly-silicon electronics onplastic; micron thin crystalline silicon electron-ics; and two-dimensional ion implant and heatflow modeling.

Zephyr Paperless Procurement System 15

LLNL has developed a paperless procurementsystem called Zephyr which improves procurementprocessing time by 90%. In addition, the Zephyrsystem's web server maintains security throughfull-access and restricted-access entrances.

Chemical and Electrochemical 16Processes

LLNL's Fabrication Processes Group specializesin chemical and electrochemical processes suchas the development, testing, and application ofcoating processes, metal finishing, and materialprocessing. In addition, the Group has expertisein transferring laboratory-developed technolo-gies into a production environment.

Microtechnology 16

The Microtechnology Center, a multidisciplinaryengineering and science center, partners withLLNL programs and external customers to solveproblems by using state-of-the-art microelec-tronics technology. By inventing and applyingnew microtechnologies, the Center enables itspartners and customers to achieve their goals inglobal security, biosciences, and global ecology.

Item Page Information

The following information items were documentedat LLNL:

Item Page

Decision Sciences and Systems 19Research

LLNL uses its expertise in Decision Sciencesand Systems Research to solve or prevent acustomer's problem. LLNL's expertise includesreliability, availability, and maintainability;decision analysis; probability; statistics; simu-lation; optimization; economic modeling; anddatabase design.

Multilayer Materials 20

Multilayer technology allows engineers to de-sign materials at the atomic level. Multilayers,a new class of matter, are fabricated in layersatom-by-atom ranging in scale from atomic tomicroscopic.

Product and Process Design Modeling 20

LLNL has more than two decades of experiencein code development, design, and analysis offinite element software for powerful simulationcapabilities. LLNL-developed simulations, avail-able to external users, include manufacturing,structural mechanics, biomechanics, heat trans-fer, and fluid mechanics.

Technical Data Exchange 21

LLNL is identifying and applying informationtechnologies likely to dominate in the electroniccommerce, the National Information Infrastruc-ture, and the Global Information Infrastructurearenas. Two pilot projects, currently underway,involve the sharing and security of data over theInternet.

Electronic Manufacturing Group 22

LLNL's Electronic Manufacturing Group pro-vides manufacturing expertise and support thatfeatures high-quality products and quick re-sponse to programmatic needs. In addition toaddressing electronic safety and health issues,the Group provides the core technology requiredfor classified and programmatic requests.

Technologies Enabling Agile 22Manufacturing

LLNL is a participating member of the Depart-ment of Energy-funded facilities team to de-velop a technology toolbox. To evaluate an agile

4

enterprise with deployment through commercialpartners, private industry will use the Tech-nologies Enabling Agile Manufacturing toolboxin three demonstrations of material removal,forming, and electromechanical assembly.

Vacuum Process 23

LLNL's Vacuum Process Group features experi-enced personnel, state-of-the-art facilities, andcoating equipment and capabilities. The Groupspecializes in applying coatings to a variety ofparts by using physical vapor deposition meth-ods and can deposit vacuum-compatible materi-als onto substrates in thicknesses ranging fromangstroms to hundreds of microns.

User Facilities 23

LLNL provides accessability of some of its facili-ties to industry and academic institutions thatneed access to sophisticated fabrication, cali-bration, and testing equipment. Users have theopportunity to conduct hands-on research anddevelopment activities for producing a productprototype or for developing or evaluating a noveltechnology or process.

Advanced Telecommunications for 24Manufacturing

LLNL is taking aggressive action to define anddevelop very high bandwidth capabilities formeeting its future network needs. This actionwill support the Department of Energy's Accel-erated Strategic Computing Initiative and pro-mote further advancement by applying emergingcommunication and networking technologies.

Point of Contact

For further information on items in this report,please contact:

Ms. Barbara EhlertLawrence Livermore National LaboratoryP.O. Box 808, L-6447000 East Avenue, L-644Livermore, California 94551(510) 422-5205FAX: (510) 423-7914E-mail: ehlert1@llnl.gov

Item Page Item Page

S e c t i o n 2

Best Practice

Design

Automated and Intelligent Systems

Robots typically are programmed through eithera teach mode or by manually correcting programsthat have been downloaded from a model-basedprogramming system. Both methods reduce flex-ibility and require extensive programming time. Inindustry, most robotic applications use the pick-and-place methods which lack part recognition orcollision avoidance capabilities. Lawrence LivermoreNational Laboratory (LLNL) has developed atelerobotic system which increases flexibility andautonomous capabilities, reduces programming time,and offers a 3-D shape recognition system.

The alliance of robotics and the stereo 3-D surfaceimaging system has made this system very unique.The telerobotic system allows the robot to performrandom-part recognition, controlled-force compli-ance, and real-time path planning. With a forcereflecting hand controller, the robot's end effectorcan be programmed to move to a part or surface andeither grasp or avoid contact with it. By using the3-D imaging system, the system enables the robotto visualize a part and its orientation and thenquickly move it to its designation.

LLNL's telerobotic system offers major advan-tages over existing robotic systems. Advantagesinclude an easy-to-use control system for teachingand operating the system; a collision avoidance andforce compliance capability to keep the robot fromdamaging itself or other equipment; programmableoperations which use force compliance, 3-D vision,and a graphic model to describe a work cell insteadof teaching the robot to move to set positions; andautomatically-planned, collision-free paths for per-forming new tasks. The 3-D imaging system, anintegral part of the telerobotic system, is a low endunit which does not require a laser as the activelight source, and can be configured for a PC host forless than $10 thousand.

Electromagnetic Modeling andMeasurements

While used for years in industry and governmentfacilities, electromagnetic modeling has been re-stricted to discrete elements of a total system prob-lem. These elements must be seamed together, asbest as possible, to model the entire system. Thisprocedure offers a slow, often non-exacting process.In recent years, LLNL has developed an EIGERfrequency-domain modeling technique and a DSI-TIGER time-domain modeling technique. When per-formed on a massively parallel, high-speed com-puter, these techniques will describe currents on 2-Dand 3-D objects; impedances; S-parameters; fieldsat general observation points; far-field patternsand radar cross-sections; and, most importantly,interface to commercial computer aided design formesh generation. These new modeling tools, to-gether with new computers, will allow larger por-tions of entire systems to be modeled.

EIGER code is a collaborative development bythe experts at LLNL; Sandia National Laboratory;University of Houston; and the Navy's Research,Development, Test, and Evaluation Division andNaval Command Control and Ocean SurveillanceCenter Laboratory. DSI-TIGER code features ob-ject oriented design; serial and parallel platformoptions; hybrid multi-block, multi-dimensionalgrids; multiple equation types (e.g., electromag-netic, acoustic, elastic); and multiple equation solverapproaches (e.g., Finite Difference Time Domain,Distributed Surface Integral (DSI), Finite VolumeTime Domain). Figure 2-1 shows an overview of theDSI-TIGER.

Both codes run on massively parallel computers,allow a quantum advance in electromagnetic (EM)simulation capability, and lead to innovative solu-tions of 3-D EM problems of magnitude and com-plexity not previously possible. Potential applica-tions for these techniques include high power radiofrequency sources (gyrotrons and klystrons); accel-erator design; low observable aircraft, missile, andunmanned vehicle design; semiconductor inter-connect design; integrated photonics device design;and electromagnetic interference assessment forships, land vehicles, and aircraft.

5

6

ners. Present emphasis of the project isto look at the total manufacturing system(Figure 2-2) and develop a machine con-troller with the following capabilities:• Input process model information and

process unique control strategies intothe manufacturing controls software

• Rapidly communicate between con-trollers over a network so thatcontrollers can be coordinated andintegrated

• Handle in-process monitoring ofcritical process parameters, real-timecalculation of control algorithmchanges based on in-process meas-urements, and reporting of processvariations to quality assurance

• Intelligently deal with exception handling in acomplex manufacturing environment

Many of the design constraints are influenced bythe industry partners who require the system touse commercially-available hardware. It must runon Intel architecture PCS in real time using famil-iar tools such as Windows 95. LLNL is serving as anindependent broker to assure that commerciallyavailable and standardized components are se-lected to provide the hardware design baseline forthe system software.

Figure 2-1. DSI-TIGER Overview of Approach

LLNL's design and development of highly-ca-pable, portable instrumentation which can mea-sure EM coupling has lead to the fabrication ofsimilar units for the Army, Navy, and Air Force.These units combined with computer simulationcan accurately characterize potential EM problemsof land, sea, or air vehicles.

Electronic Technologies for PrecisionManufacturing

LLNL has a long history of expertise in precisionmachining and inspection gauges. Since the early1980s, the laboratory has been developingand building advanced computer controlsystems for a variety of applications. Inmost cases, it was necessary for LLNL todevelop controllers because there was noth-ing available in the commercial sector tomeet the specific application requirements.Applications included digital signal pro-cessing for scanning types of coordinatemeasuring machines; multi-loop servo sys-tems for precision applications; sensors andelectronics for high precision measurementsand positioning; remote machining of ex-plosives and other energetic materials; andinexpensive temperature control.

Currently, LLNL has a major effort un-derway to develop a next generation con-troller for manufacturing. It is in responseto needs in the Department of Energy (DOE)and the commercial sector for more flexibil-ity and maintainability in controllers. Theproject is a joint effort led by LLNL involv-ing other DOE facilities and industry part- Figure 2-2. Advanced Controller Within the Total

Manufacturing System

7

LLNL is developing the Manufacturing Operat-ing System (MOS) software that will create anenvironment that allows the largest variety ofcontrol problems to be solved over a wide range ofperformance and cost constraints. This system willallow the existing sequential nature of manufac-turing to be replaced by a more agile process.Improvement goals are to develop a software sys-tem capable of executing motion control functionsat the CPU level on a PC, and to interface with avariety of commercially-available sensor and ac-tuator systems via commercially-available inter-faces. The key to this architecture is the ability ofusers to reconfigure the controller for their process.MOS will enable users to quickly reconfigure ma-chine tools to produce different parts on demand bysimply changing software. When unanticipated tasksarise, hardware redesign will be unnecessary.

LLNL is designing Application ProgrammingInterfaces (APIs) that allow the MOS to bereconfigured for unanticipated tasks. APIs enableusers to concentrate on specific manufacturingprocess problems rather than having to build entirecontrollers from the ground up. This approach sup-ports functions migrating either to or from hard-ware-based accelerators depending on cost and per-formance constraints. This approach is so promisingthat NIST has agreed to develop standards for APIs.

These APIs, depicted in Figure 2-3, divide thecontroller into well-defined modules. These corre-spond with known functions in current controllers,and will also provide extended and improved ser-vices in future controllers. For producing a particu-lar product, one module might direct the trajectoryof a machine tool, one could solve logic problems,and another could coordinate tasks. Applicationmodules can be specific to a milling machine, lathe,or almost any other manufacturing step. New func-tions or specialized modules could be added simplyby plugging them in.

A proof-of-concept prototype is running at anindustrial site. It controls a K&T 3-axis millingmachine. The system is totally software based. Ituses a single PC processor and SERCOS standardas the motor drive interface. The core of the control-ler is the industrial partner's existing human inter-face software combined with LLNL's existing mo-tion control software.

Laser Cutting and Machining

LLNL is developing the application of extremelyshort pulse lasers (pulse widths <200 femtoseconds)for high precision cutting. This technology is exclu-sive to LLNL. It has the advantages of extremeprecision, very high cutting efficiency, and mini-

Figure 2-3. MOS Architecture

8

mal heating of the part being cut. The technologyconsistently produces kerf widths as small as 20micrometers through metals one-millimeter thick.There is virtually no heating of the material and nodetectable heat-affected zone at the cut edges.Holes drilled with femtosecond pulses are moreprecise and cleaner than those drilled by conven-tional methods.

Femtosecond lasers can cut with no collateraldamage, higher precision, and higher efficiencythan is achievable with conventional lasers. Thismakes them very useful for drilling through hardtissues such as teeth or bone where collateraldamage minimization is essential. New approachesto laser dentistry and surgery are now possible. Forexample, ultra-short (300 femtosecond) pulses havebeen used successfully to drill a hole through a one-millimeter wide bone in a human middle ear.

The desirable properties for manufacturing re-sult from the fact that energy deposition and mate-rial removal are separated with femtosecond pulses.During the pulse, energy is deposited in a scale less

than one micrometer. After the pulse, hydrody-namic expansion of the hot plasma removes mate-rial from the interaction region. Therefore, eachfemtosecond pulse strikes a clean surface with nointerference from ejecta.

LLNL built a demonstration and developmentworkstation which serves as a prototype for theproduction version. This system uses a chirpedpulse amplification technique which makes it pos-sible to achieve femtosecond lasers with high peakpower. An initial short pulse from a low powercommercial laser is stretched in time prior to ampli-fication with a unique LLNL grating design. Ampli-fication by seven orders of magnitude and recom-pression ultimately produces a very high energy,ultra short pulse as shown in Figure 2-4. The layoutfor the prototype version of the laser cutter is shownin Figure 2-5. LLNL is preparing to deliver a produc-tion version of the cutter to another DOE laboratoryfor use in an industrial environment for manufactur-ing applications requiring high precision.

Figure 2-4. Chirped Pulse Amplification Technique

9

Sensors and Sensor Systems

LLNL in collaboration with industry, academiaand other government agencies, has demonstratedseveral high-quality affordable sensor systemswhich address the Nation's needs and require-ments. By combining its scientific, engineering,and manufacturing capabilities with a full systemmentality, LLNL has designed and deployed vari-ous remote sensing systems and unattended moni-toring systems.

The Remote Optical Monitor for Airborne Chemi-cals (ROMAC) is a passive infrared cross-disper-sion spectrometer designed for chemical sensingapplications such as proliferation detection, chemi-cal weapon detection, industrial pollution studies,and environmental monitoring. LLNL has opti-mized the current instrument for the remote, air-borne identification of the effluents being emittedfrom an industrial smokestack. Because this robustsensor has no moving parts, its is far more immuneto vibration than conventional Fourier Transform

Spectrometers. In addition, because it takes datasimultaneously over its entire spectral range, it isimmune from the data corruption caused by rapidlychanging background scenes. This feature, and itssmall size and weight, make it ideal for airbornedeployments. It has recently been flight tested on aNavy P-3 aircraft.

The Compact Airborne Multispectral Imager(CAMI) is a demonstrated system for visual andnear infrared remote sensing. CAMI can be usedfor environmental hot spot/spill detection, camou-flage detection, troop and vehicle detection, etc. Itis a near real-time, multi-band system with point-ing and signal/noise advantages over conventionalpushbroom sensors. It is small and light enough tobe deployed on small aircraft and unmanned aerialvehicle platforms.

LLNL has designed and constructed a frequencyagile mid-wave infrared light detection and rang-ing system which can provide remote measure-ments of atmospheric aerosol distributions. LLNLdeveloped all the component technologies for the

Figure 2-5. Laser Cutting Project Schematic

10

Clementine payload that flew in 1994 and verysuccessfully performed all required objectives (Fig-ure 2-6). An integrated effluent identification andmeasurement system, airborne multisensor pod sys-tem (AMPS), for which LLNL provided a sensor andintegrated the sensors from Sandia National Labora-tory and Pacific Northwest Laboratory, has flown ona Navy P-3 and demonstrated high sensitivity chemi-cal effluent identification and measurement for ap-plications of treaty verification, proliferation detec-tion, and industrial effluent studies (Figure 2-7).

Additional sensor development with seismic,magnetic and infrared capabilities for detectingillegal entry of drugs and people into the U.S. and

for protecting archaeological andnatural sites from vandalism andtheft have been developed. LLNL isdeveloping new technologies to betested in 1997 that offer the poten-tial to detect, identify, and locatekey elements in buried facilities andtechnologies like an acoustic spec-trometer which could detect and clas-sify vehicle and rotating machinery.LLNL has approached each of thesesensor developments from a full sys-tem perspective with the objective ofbeing cost effective, producible, andhave multi-application potential.

Vapor Phase Manufacturing

LLNL's Laser Directorate is de-veloping and transferring electron-beam manufacturing technology to

industry and government. This technology enablescomplex metal alloy shapes to be fabricated bydepositing vaporized metal onto a mold or mandrel,which is later separated from the alloy part. Themetal is vaporized by electron-beam heating. Theprocess has successfully produced alloy parts withmetallurgical properties that exceed those of equiva-lent forged parts. LLNL currently is up-scaling theprocess to handle larger part sizes. In parallel withthis effort, LLNL is developing a real-time, laser-based control system to measure and control the alloy

composition during vapor depositionof the part.

Additionally, LLNL's Laser Direc-torate is developing laser-based va-por diagnostics and computer mod-els to control the vapor phase manu-facturing processes. Target applica-tions include controlling processesfor making titanium alloy matrixcomposites and oxide thermal bar-rier coatings which are important inthe aerospace industry. For titaniummatrix composites, silicon-carbonfibers are coated with titanium al-loys and then consolidated into fin-ished parts that are lightweight,strong, and stiff at high temperature.

Electron beam evaporation can provide high-volumeproduction, as long as alloy composition and thefraction of vapor capture can be precisely controlled.

Figure 2-6. Clementine Sensor Suite

Figure 2-7. Airborne Multisensor Pod System

11

LLNL sensors and computer modelsare being used to improve process con-trol and capture efficiency. Laser ab-sorption spectroscopy, which uses diodelasers, provides the basis for vapor den-sity and composition monitoring sen-sors. Prototype systems are currently inuse in industry, plans are underway forlicensing the LLNL signal processingsoftware, and similar systems are beingdeveloped for other alloys.

One example of LLNL's success wasthe development of a vapor depositionprocess for manufacturing precisionnuclear weapon system components. Theproject's objective was to provide a sim-pler, lower cost, and lower waste processfor certain critical components. Withthis project, LLNL demonstrated thefeasibility of vapor deposition of densematerial in the required thickness, ability to meetcomposition specifications, and equal or bettermechanical properties of the vapor-deposited metalcompared to wrought metal. Material utilizationfor this process was more than 30 times better thanexisting processes. Figure 2-8 shows a cut-away viewof the equipment for this process in operation. Thesuccess of this project led to a three-year, $6 millionplan for manufacturing and certifying full-scale com-ponents. In addition, LLNL has transferred thevapor deposition process to commercial applications.

Test

Accelerator Mass Spectrometry

At LLNL, the Center for Ac-celerator Mass Spectrometry(CAMS) develops and operatesaccelerator-based isotopic abun-dance measurements using ac-celerator mass spectrometry(AMS) and spatially-defined el-emental distributions using anion microprobe, for a wide rangeof applications. CAMS has ap-plied these techniques inbiodosimetry; atmospheric andgeoscience mechanisms; paleo-climatology; non-proliferation;and materials science. External

collaborators and fee-for-service users conduct re-search in archaeology; oceanography; clinical andnutritional sciences; genotoxicity screening; intel-ligence; and art history.

AMS detects long-lived radioisotopes to sensitivi-ties of 1:1015 (or one part in a thousand-million-million) in only a few minutes. CAMS has estab-lished AMS analysis for the cosmogenic isotopes 3H,7Be, 14C, 26Al, 36Cl, 41Ca, 59, 63 Ni, and 129I. New capabili-ties are being developed to measure isotopes of ironand selenium for use in protein labeling and trac-ing. Continuing development will extend this iso-tope capability over much of the Periodic Table ofelements. Figure 2-9 shows a simple schematic ofthe AMS system.

Figure 2-8. Net Shape Vapor Deposition System

Figure 2-9. Schematic of CAMS AMS System

12

Another technique CAMS has developed uses aMeV ion microprobe to characterize elemental dis-tributions at micron spatial resolution and fiveparts-per-million sensitivity. This technique hasapplications in many biological systems; for ex-ample, a simultaneous measurement of multipleelemental profiles within individual cells and cellu-lar organelles with approximately 10-18 mole sensi-tivity for trace metals and specific proteins hasbeen demonstrated.

These unique techniques may be used to addressimportant problems in management of health andenvironmental risks and in fundamental biochem-istry. An example is in the established field oftagged radiocarbon tracing. With the AMS technol-ogy, CAMS is able to provide results that are 103 to 106

times more sensitive than conventional countingtechniques. In many applications, extremely smallamounts of the tagged material, that are well belowregulatory control, can be traced with accuracy.

Nondestructive and MechanicalEvaluation

LLNL maintains a technology base related to thenondestructive inspection and characterization ofmaterials in applications areas of interest to itslaboratory and its customers. Nondestructive evalu-ation (NDE) is becoming an increasingly moreimportant element of the design and manufactur-ing processes. Due to the ever rising cost of materialand labor, emphasis is being placed on the use ofNDE early in the design and fabrication processes.Often parts and components are too costly to permitthe luxury of destructively testing a number ofthem to demonstrate design goals.

Evaluation methods may be based on acoustics(sound), penetrating radiation (x-ray, gamma rays,beta particles, protons, neutrons), light (ultravio-let, infrared, visible), and electric and magneticfields. NDE encompasses material characterization,real-time monitoring during manufacturing, flawand damage detection in components, inspection ofassemblies for tolerances, alignment, and in-servicemonitoring of flaw and damage growth in order todetermine the maintenance requirements and con-tinued safe operation of the part. LLNL has appliedthese techniques to unique inspection problems thatrequire the applications of innovative NDE.

Computer axial tomography (CAT) measures thevolume densities of materials and provides picto-rial views of an object's internal structure of mate-

rials and fabricated parts. In computed tomography,the object being investigated is translated androtated in the path of the radiation, with transmis-sion measurements made at each position. Thedata is then reconstructed into images using com-puter algorithms. LLNL uses the signal and imageprocessing program, VIEW, and other programs tocompute the tomograms and display the images.Several slices through the object can be restruc-tured to provide a 3-D view of the internal struc-ture. Operational tomography systems, developedby LLNL, range from the KCAT, with an energy of70 to 125 keV and a resolution of 20 micrometers, tothe HECAT, with an energy of 9 MeV and a resolu-tion of 0.5 millimeter.

Imaging technology and image analysis are anever increasing part of nondestructive testing. LLNLhas assembled and developed tools which coupleimage processing with computational NDE algo-rithms. Focus areas include edge detection and im-age enhancement for digitized radiographs; focusedwave mode calculations for ultrasonic inspections;in-depth examinations of image reconstruction; andstatistical studies of different NDE algorithms.

Radiation gauging is used to measure areal den-sities of materials, where areal densities are de-fined as thickness times density. The informationprovided is similar to that obtained from film radi-ography. Radiation gauging can be highly accurateand quantitative because the information is ob-tained point-to-point, allowing for small variationsin material density or thickness to be measuredbecause of the high degree of accuracy.

Radiography covers a broad range of materials,components, and assemblies. Typical inspectionsinclude x-ray and gamma-ray energies from 3 keVto 9 MeV, using both film and electronic imaging.Current and future emphasis is on quantitativeand micro-evaluations based on a broad range ofphoton energies and beam geometries coupled withsophisticated digital signal and image processing.Radiography evaluates the internal characteristicsof a specimen. The data is presented as a 2-D imagein analog form. Radiation is routinely used toinspect machined hemispheres for voids, cracksand inclusions. Low density materials, such asfoam and composites, are inspected for composi-tion, density, and uniformity. Assembly inspectionradiograph is used to inspect assemblies ranging insize from large rocket motors to electronic circuitboards and chips.

13

Ultrasonic NDE evaluates material propertiesand conditions by probing the material with high-frequency sound waves. Pulses of ultrasonic wavesare radiated into the material and subsequentlydetected using specially-designed transducers. Thesound waves are altered as they travel into andthrough material, and therefore provide a changeto the detected pulse which is then displayed, pro-cessed, and interpreted. Ultrasonics are usually ap-plied to detect thickness and search for flaws inmetals, such as cracks and voids; however, ultrason-ics can also be applied to ascertain grain size, mea-sure residual stress, and determine bond quality.

LLNL has an established and diverse customerbase throughout the U.S. for applying its NDEtechnologies. Approximately 50% of its applica-tions serve LLNL programs and the remaining 50%is distributed over industry clients, other DOElaboratories, federal agencies, and California agen-cies. LLNL works routinely with production plantsin a flexible manufacturing environment, transfersdeveloped technology from the laboratory to indus-try, and actively promotes the role of NDE inconcurrent engineering. Successes include theevaluation of heart valves; automobile brakes andgears; aircraft structures; aquifers in six meters ofsand; mines buried in 12 centimeters of sand;weapon valves; tool bits; aircraft corrosion;mammography; turbine blades; engine components;munitions; pistons; bridge cables; plastic explosives;waste drums; laser welding; and laser cutting.

Production

Microelectronics Technology

Microelectronics refers to the use of thin filmprocessing, generally associated with the semicon-ductor industry, in advanced electronic packagingapplications. At LLNL, these applications includefield emission flat panel displays, microelectro-magnetic devices, and electronic packaging. Ineach case, LLNL's expertise in materials science;thin film process development; specific understand-ing of the science and technology of the application;and its unique ability to perform lithography on 3-Dsurfaces have contributed to project success.

In the area of advanced electronic packaging,goals are to improve performance; reduce systemsize and weight; and lower cost. Application areasinclude satellite electronics, supercomputers, andpersonal digital assistants. Specific technology fo-cus areas by LLNL include 3-D package integration

using high-speed chip-to-chip and chip-to-boardconnections; increasing connectivity through mul-tilevel metallization and metal planarization tech-niques; reducing line capacitance and propagationdelay through the development of dielectric mate-rials having low dielectric constant; and the han-dling of heat dissipation through newly developedthermal management techniques. Instrumental inachieving quantum leaps in these areas is theLLNL-developed, 3-D lithography on 3-D surfaces.

Specific examples of LLNL's microelectronics include:• Flat Panel Displays — LLNL has eight

collaborations on flat panel displays and fourcollaborations for developing display manufac-turing equipment. LLNL has developed fieldemission display “nanocone and nanofilament”to produce a less than 0.3-micrometer gatedcathode and continue work on ion trackinglithography, resistor materials, and depositionmethods to reduce turn-on voltage. Low workfunction emitters are also under developmentto further reduce turn-on voltage. LLNLcontinues its work on a low cost printing processusing sol-gel technology to produce high aspectratio silica spacers.

• High Speed Patterning of Conformal MetalTraces — Three-dimensional photolithographyprovides conformal metal traces that providelow inductance, rugged connections, andinexpensive stacking of integrated circuits.Applications include conformal traces fromGaAs integrated circuits to alumina circuitboards, stacking DRAM memory boards, andmicroelectro-mechanical components such asactuators and RF inductors.

• Low Dielectric Constant Materials —Introduction of new processes to deposit thin-film aerogel materials has reduced dielectricconstants to 1.2 for multilevel interconnections.Both package and integrated circuitinterconnect performance improve with lowerdielectric constant. The expansion coefficientcan be matched to silicon, alumina, etc. bychanging aerogel composition.

• Electrochemical Planarization Process —Techniques have been developed to platewithout voids or defects. Void-free electroplatingof copper has been demonstrated at both packageand ultra large scale integration dimensions.Uniformity can be achieved which is betterthan 3% across a six-inch wafer. Plating andpolishing processes have been demonstrated tobe defect free for seven-inch square multichipmodule circuit boards.

14

• Active Matrix Liquid Crystal Displays (Figure2-10) — LLNL is developing a low-tempera-ture, thin-film transistor fabrication processand polymer dispersed liquid crystal applica-tions of thin-film transistors. LLNL is furtherapplying its laser patterning technology to routerow and column conductors to the back side ofdisplay substrates so that drivers and otherelectronics can be located on the back of dis-plays. Ruggedness and reliability are improvedand rework cost is reduced.

Optoelectronics Manufacturing

The optoelectronics area of LLNL pursues low-cost, high-precision passive coupling of optical fi-bers to optoelectronic devices, the automation ofthe fiber pigtailing process, and the computer aideddesign of optoelectronic devices to reduce fabrica-tion development costs. For many devices, thepackaging costs, such as the attachment of sub-micron fiber optic pigtails, represent 90% of thecomponent cost. The less expensive passive align-ment techniques achieve 0.6 to 1 micrometer accu-racy while the more expensive active alignmenttechniques can achieve less than 0.1 micrometeraccuracy. LLNL has completed much work to im-prove passive alignment techniques. One uniquemethod, developed by LLNL, is the silicon micro-

bench alignment tool with built-in solder reflowheaters which won the 1996 R&D100 Award.

Techniques were also developed to improve thecost of the active alignment techniques, which areusually performed by skilled labor. In this area,LLNL has completed work in automating align-ment and bonding portions of the pigtailing processthrough the application of machine visioning tech-niques to aid rapid course alignment; fine position-ing optic terminations; attachment of adhesives,solder, and welding; and strain relief and encapsu-lation. Three automated fiber pigtailing machineshave been built using modular design techniques toenable easy upgrades as technological improve-ments continue to be developed. The equipmentfeatures sub-micron alignment, provides activealignment using machine vision, and is user-friendly. Two systems have been delivered to LLNL'spartners in the project. Commercialization of theequipment is predicted with a price of less than$100 thousand per unit.

LLNL has also applied its unique capabilities ofusing computer simulations to the design of opto-electronic devices. The ability to develop deviceconcepts on the computer minimizes fabricationcycles and leads to higher-performance and lower-cost devices. This is particularly true for optoelec-tronic components that are very specialized andexperience small markets. LLNL has developed theMulti-scale ElectroDynamics (MELD) simulationsoftware for integrating different length-scale meth-ods in a single design tool. MELD and other LLNL-developed simulation methods have produced theintegrated simulation package techniques requiredfor accurate design capability.

Precision Systems and PrecisionManufacturing Technology

LLNL's Precision Systems and Manufacturing(PS&M) Group is a developer of precision systemscomprising precision machines and precision manu-facturing processes. The ability to develop a mate-rial removal process, as well as to design and buildthe machinery that embodies a process, has led tosignificant contributions to the state of technologyin single point diamond turning and in the grindingof brittle materials. PS&M specializes in applica-tions in precision machine tools, test equipment,gauging equipment, optical systems, and metrol-ogy systems. PS&M provides the capability to de-

Figure 2-10. Laser Doping & Electronicson Plastic

15

velop these and other precision equipment needsfor LLNL and external customers. The Group main-tains expertise in computer aided analytical toolssuch as 2-D and 3-D finite element modeling forstructural and thermal analysis. The Group alsomaintains expertise in the following technologies:laser interferometry; precision machine control;dimensional workpiece metrology; surface metrol-ogy; machine tool metrology; alignment of struc-tures and systems; error analysis; and sensors andactuators for process monitoring. Together thesetechnologies add up to the ability to design, build, andbring on-line a precision manufacturing capability.

PS&M's facility includes 10,000 square feet oftemperature-controlled laboratory space and housesabout a dozen precision machine tools. These in-clude diamond turning and grinding machineswith capabilities ranging from the 84-inch swing ofDiamond Turning Machine #3 to the 20 angstrom-rms finishes of the Precision Engineering ResearchLathe; general and specialized Coordinate Measur-ing Machines; and ancillary equipment to supportsuch a state-of-the-art facility. The Group alsomaintains a collection of dimensional metrologyequipment including phase-shifting interferometersup to 12 inches in diameter, interferometric micro-scopes, various stylus instruments, and distancemeasuring interferometers.

Semiconductor Technology

As a world expert in laser recrystallization anddoping of silicon for semiconductor devices, LLNL'sAdvanced Process Development Group has beendeveloping and demonstrating technologies whichmay replace ion implantation for 0.18-micrometerand below generations of integrated circuits. ThoseLLNL programs with the greatest potential forquantum-leap impacts in the semiconductor indus-try include gas immersion laser doping; poly-sili-con electronics on plastic; micron thin crystallinesilicon electronics; and two-dimensional ion im-plant and heat flow modeling.

Gas immersion laser doping (GILD) appliesLLNL's technology base of gas immersion laserdoping to shallow junction formation in submicronCMOS integrated circuit processing and low powerelectronics. GILD has proven to be superior overother doping techniques primarily because of itsimproved reduction in thermal budgets. The tech-nique is adaptable to a step-and-repeat laser pro-cess which can result in the combination of the

doping and lithographic processes into one step.Poly-silicon electronics on plastic applies LLNL's

technology base of low temperature depositions,pulsed laser crystallization, and doping to siliconthin film transistor fabrication on plastic substratesfor low-cost, flexible rugged electronics. LLNL'sfabrication techniques produce processing tempera-tures of less than 100°C on polyester, a laser crys-tallized channel, and a laser doped source-drainwhich resulted in thin-film transistor yields of 90%on a four-inch wafer.

Micron thin crystalline silicon electronics appliesLLNL's technology base of silicon circuit transferon arbitrary substrates to high-performance flex-ible silicon and thin electronics on any material. Byconverting crystalline silicon wafers to flexible cir-cuits on plastic or metal-foil holding substrates,this technology achieves very large scale integra-tion density circuits at low power, light weightelectronics. The final product is a robust sheet ofmicron thin flexible silicon microelectronics.

Two-dimensional implant and heat flow model-ing applies LLNL's technology base of modelingand simulation to focused ion beam machining andGILD two-dimensional, non-equilibrium meltingand heat flow. The technology incorporates heatflow data into SUPREM IV; however, the methodhas not been fully tested. Two-dimensional meltand solidification modeling has had limited testingon a square heat-flow mesh. This modeling hasproduced laser material interaction from a simplemodel, and full-scale modeling is presently in theconceptual stage.

Zephyr Paperless Procurement System

Recognizing the need to decrease procurementprocessing time, LLNL developed the ConcurrentEngineering and Rapid Prototyping System(CERPS). CERPS was successfully demonstratedin 1995. As the next generation system, LLNL hasdeveloped a paperless procurement system calledZephyr which improves procurement processingtime by 90%. In addition, the Zephyr system's webserver maintains security through full-access andrestricted-access entrances.

Since traditional procurement processing basedon paper can create delays, LLNL designed webpages for its engineering and procurement depart-ments. When an item needs to be purchased, engi-neering transfers a purchase request and associ-ated design documents to procurement via the web

16

pages. Next, procurement contacts the participat-ing vendors via electronic mail and notifies themthat a request for quotes based on the engineeringrequirements is available on the website. Vendorsrespond to procurement's web page with quotes,and the winning bid is then awarded the same dayvia the vendor's web page on the LLNL site. Designdocuments are transferred to the vendor via theInternet which also speeds up the process. Vendorsmust be willing to accept credit card payments touse the Zephyr system. Upon shipment of the item,the vendor initiates a credit card transaction whichresults in a transfer payment to the vendor's bank.Typically, electronic payments occur 48 to 72 hoursafter the shipment notification.

Comparison between traditional methods andthe Zephyr system shows impressive results. Foridentical items, traditional methods took 56 work-ing days while the Zephyr system completed thetask in 5.5 days. Most of the delays using traditionalmethods could be traced to paperwork. By using theZephyr system, the cost of a stereolithography partdecreased 40%, from $850 to $510.

Facilities

Chemical and Electrochemical Processes

LLNL's Fabrication Processes Group specializesin chemical and electrochemical processes such asthe development, testing, and application of coat-ing processes, metal finishing, and material pro-cessing. In addition, the Group has expertise intransferring laboratory-developed technologies intoa production environment.

Housed in a 6,000 square-foot area, the Group'schemical and electrochemical processing facilityemploys six people (with 125 years of combinedexperience) and is part of the Manufacturing Mate-rials Engineering Department fabrication complex.The facility maintains processing capabilities formore than 85 different plating processes represent-ing almost the entire spectrum of materials. Elec-troplating and metal finishing can be done on partswith dimensions up to 3 x 2 x 4 feet. Platingsavailable include anodizing (hard, clear, or color);black nickel; black oxide; chemical black; iridite;copper; nickel and electroless nickel; gold; silver;glass; indium; lead; platinum; rhodium; tin; andzinc. Electrojoining and electroforming over man-drels can also be performed.

The chemical and electrochemical processing fa-cility supports various fabrication processes, devel-oped and used by LLNL, including electroplating;physical vapor deposition; laser and electron-beamcutting, welding, and surface treatment; compos-ites and plastics fabrication; machine tool coolantrecycling; and mixed radioactive/toxic waste reduc-tion through lubricant/coolant free machining.

The Fabrication Processes Group also has expe-rience in waste management and pollution preven-tion and has successfully modified its facility forrecycling and containing metal wastes. Throughwaste minimization efforts, the Group has reducedsewer water usage from three million gallons peryear to zero. Waste water has been reduced from60,000 gallons to 1,500 gallons per year. The Groupprovides processing expertise and assistance tosmall businesses and handles more than 200 tele-phone calls and 25 site visits per year.

Microtechnology

The Microtechnology Center, a multidisciplinaryengineering and science center, partners with LLNLprograms and external customers to solve prob-lems by using state-of-the-art microelectronics tech-nology. By inventing and applying newmicrotechnologies, the Center enables its partnersand customers to achieve their goals in globalsecurity, biosciences, and global ecology. Currentresearch areas include custom microfabricatedstructures, micro-analytical instrumentation,microelectro-mechanical systems (MEMS), highspeed electro-optic modulators, quantum electronicdevices, guided wave photonics, flat panel displays,and semiconductor and MEMS device monitoring.

As an interdisciplinary group of more than 50people, the Center relies on physicists, chemists,biologists, chemical engineers, mechanical engi-neers, electronics engineers, and support person-nel. By interacting and communicating across thedisciplines, the diverse staff offers various experi-ences and approaches for solving complex prob-lems. In addition, the Center draws upon all ofLLNL's departments and resources as needed. Theresult is a high degree of synergy which is re-inforced by the layout of the facility. The Center ishoused in an 18,000 square-foot laboratory with7,500 square-foot, class 10 to 100 clean rooms. Eachclean room is process-oriented rather than disci-

17

The Microtechnology Centerachieved an exceptional record ofinnovation and success. In 1996,the Center won a Federal Labora-tory Consortium award for its ex-tremely thin, high resolution CRTdisplay which uses LLNL-devel-oped gated nanocones. The Centeralso provided a major advance-ment in microelectronics coolingtechnology by developing produc-ible silicon microchannel coolersthat can achieve a heat dissipationof over 1000 watts per square cen-timeter. By using microfabricationtechnology, the Center miniatur-ized biomedical instruments withapplications in DNA sequencing,flow cytometry, polymerase chainreaction-based diagnostics, andmicro-tools for interventionaltherapies. The Center also devel-oped pioneering microinstru-mentation advancements with ap-plications in chemical and biologi-cal warfare detection.

The Microtechnology Center fo-cuses on technologies needed byits customers that are not avail-able elsewhere. In those caseswhere commercial technology isavailable, the Center then focuses

on niche applications. By using multidisciplinaryteams and pooled resources, the Center has suc-cessfully worked with industry to solve problemsand develop commercial applications.

Figure 2-11. Microtechnology Center Layout

pline-oriented which facilitates maximum interac-tion. This arrangement (Figure 2-11) promotes anexcellent blending of staff and facilities.

Design

Decision Sciences and Systems Research

LLNL uses its expertise in Decision Sciences andSystems Research to solve or prevent a customer'sproblem. By defining and structuring the customer'srequirements, LLNL can determine the correctblend of personnel and skills for various situations.LLNL's expertise includes reliability, availability,and maintainability; decision analysis; probability;statistics; simulation; optimization; economic mod-eling; and database design.

The LLNL Decision Sciences and Systems Re-search expertise has been applied to the NationalIgnition Facility by developing a reliability andavailability allocation model which used Bayesiantechniques to allocate goals and quantify uncer-tainties in the early project phase. The modelidentifies sources of relative availability and reli-ability concerns; assigns preliminary subsystemgoals to achieve overall goals; examines implica-tions and insights from allocation; and iterates andupdates the process. Availability concerns are de-

lays which cause missed shot opportunities. Shotreliability concerns are ruined or failed shots.

The allocation process begins with a formal queryof experts with relevant knowledge in frequency ofproblem occurrence, length of delay, and frequencyof ruined shots. LLNL spot-checks the informationusing Nova and Beamlet data. The allocation calcu-lation reflects the relative performance of sub-systems (Table 3-1). The allocations are evaluatedrelative to their achievability. Uncertain achiev-ability requires additional data to fill in the gaps.Cost and schedule concerns are given formal con-sideration. The experts are rechecked on interpre-tation of the data and implications and insights areexamined, such as significant sources of missedand failed shots; initial performance specificationsfor designers and vendors; and opportunities forimproved design or repair policy. By using thereliability and availability allocation model, LLNLcan budget the overall availability and reliabilitygoals of subsystems and components to identify theinitial design specifications, achieve the requiredperformance, and identify performance concernsand areas for improvement.

S e c t i o n 3

Information

19

Table 3-1. First-cut Allocation

20

The LLNL System Sciences have beenapplied to the alternative strategies for long-term management or use of depleted ura-nium hexafluoride, stored in the cylinderyards in Paducah, Kentucky; Portsmouth,Ohio; and Oak Ridge, Tennessee. By develop-ing a computer cost model, the system wasable to integrate the cost estimates for theindividual options of each alternative strat-egy and then provide the cost of the strategies.

The LLNL System Sciences has also devel-oped statistical sampling methods for com-pliance auditing. Originally, LLNL's prop-erty management used a wall-to-wall inven-tory (50,000 items) method which was quitecostly. LLNL began statistical sampling in1995 and developed a sophisticated low-costsampling design in 1996. For 71 propertycenter representatives with varying numbersof assigned property items, a statistical sam-pling was set up to sample a portion of therepresentatives and then a portion of the items underthe stewardship of the representative. This designminimized the total cost while achieving a specifiedaccuracy. Investment in this sampling design re-duced LLNL's cost from 4,945 hours to 110 hours.

LLNL's Decision Sciences and Systems Researchexpertise serves a broad range of programs andtechnologies. Applications include safety analysis;vulnerability; surety; and technical risk analysis.

Multilayer Materials

Multilayer technology allows engineers to designmaterials at the atomic level (Figure 3-1).Multilayers, a new class of matter, are fabricated inlayers atom-by-atom ranging in scale from atomicto microscopic. LLNL has shown that the multilayersexist as fully dense, fine grain, high interfaceconcentration solids and that multilayer laminatecomponent layers can be as thin as two atoms with astrength that nearly approaches theoretical limits.

LLNL has demonstrated potential applicationsfor multilayer laminates such as new manufactur-ing strategies, short-wavelength optics, high-per-formance capacitors for energy storage, industrialcapacitors, integrated-circuit interconnects, tribo-logical coatings, ultra-high strength materials, andcoatings for gas turbine engines. An in-processCooperative Research And Development Agree-ment (CRADA) with Pratt & Whitney will addressthe application of turbine engine use of materials atthe limit of theory. This application has enormous

potential for increased thrust-to-weight ratio; ef-fective erosion and corrosion barriers; lighter weightturbines for NASA shuttle fights; and operation ofcommercial airline engines at higher temperatures.

With applications in the Pratt & Whitney CRADA,a solid-state detonator system for arming bombs,material development indicating a diamond-likehardness; and a penetrator program for DARPA,potential for multilayers appears to be unlimited. Asthe multilayer fabrication techniques improve, theeconomics of producing these materials will becomemore competitive. With its research and applicationsgroups, LLNL will continue its leadership role in thedevelopment of multilayer technology.

Product and Process Design Modeling

LLNL has more than two decades of experiencein code development, design, and analysis of finiteelement software for powerful simulation capabili-ties. LLNL-developed simulations, available to ex-ternal users, include manufacturing, structuralmechanics, biomechanics, heat transfer, and fluidmechanics.

DYNA, NIKE, and TOPAZ are a family of similarexplicit and implicit finite element codes for dy-namic and quasi-static structural mechanics andheat transfer. By applying simulation methods toproduct and process design modeling, LLNL hasfocused its active research and development onparallelization techniques for these finite elementcodes and on algorithm developments to enhance

Figure 3-1. Multilayer Technologies

21

Figure 3-2. Significant Performance Benefits from Parallelization

simulation capabilities. Figure 3-2 illustrates thesignificant performance benefits from parallelization.

LLNL recently completed research on rigid bodymechanics simulations and advanced nonlinearmodeling for large bridge structures. Increasedcomputational speed and memory reduction im-provements provide solutions with speed and ro-bustness. Primary analysis solutions for LLNL'sLasers and Defense and Nuclear Technologies Di-rectorates include optical laser components, sup-port structures, nuclear components, shipping con-tainers, and manufacturing process simulations.

LLNL has substantial expertise in applying simu-lation techniques for product and process designmodeling. Active collaborations outside LLNL in-clude superplastic forming (Boeing); sheet metalforming (Vehicle Maintenance/TEAM consortium);biomechanics modeling (National Highway TrafficSafety Administration); blade-off simulations (Fed-eral Aviation Administration); seismic safety analy-sis (California Department of Transportation); sheetmetal springback predictions and composite model-ing (Partnership for Next Generation Vehicle); andvehicle/road barrier interactions (Federal High-way Administration).

Technical Data Exchange

LLNL is identifying and applying informationtechnologies likely to dominate in the electroniccommerce, the National Information Infrastruc-ture (NII), and the Global Information Infrastruc-ture (GII) arenas. Focus technologies include Trans-mission Control Protocol/Internet Protocol; SimpleMail Transfer Protocol and Multipurpose InternetMail Extensions; HTTP/HTML (protocol and lan-guage of the World Wide Web); Lightweight Direc-tory Access Protocol, a simplified version of theX.500 directory services protocol from the Interna-tional Standards Organization; and security mecha-nisms based on public key cryptography. LLNL isstructuring its own data architecture for easy evolu-tion into future NII/GII capabilities.

LLNL has applied these technologies to two pilotprojects. The first project, with the Bank of America,uses encrypted electronic mail via the Internet forelectronic fund transfers plus remittance (invoice)information to execute payment orders. These elec-tronic data interchange transactions demonstratethe capability to move sensitive information be-tween computer systems over the Internet. Since ithas met all of LLNL's and the Bank of America's

22

requirements, the pilot project has been continuedwith expanded scope and benefits of lessons learned.

The second pilot project, with 33 partners fromthe American Textile Partnership, is Textile Net-work (TEXNET). As an Internet-based system forthe Demand-Activated Manufacturing Architec-ture Project, TEXNET provides secure, selectivedata sharing among retailers, apparel manufactur-ers, mills, and fiber producers. TEXNET providesthe authentication capability for the data users(with appropriate access rights), while the Internetprovides the cost-effective distribution capabilityfor a greatly-expanded client base.

LLNL is also examining the possibility of apply-ing the information technologies for classifyingdesign and manufacturing data within the DOE.Considerations include the use of SecureNet andpublic key security mechanisms.

Production

Electronic Manufacturing Group

LLNL's Electronic Manufacturing Group (EMG)provides manufacturing expertise and support thatfeature high-quality products and quick responseto programmatic needs. In addition to addressingelectronic safety and health issues, EMG providesthe core technology required for classified andprogrammatic requests.

EMG's business groups include Coordination;Central Drafting; Engineering InstrumentationServices; Environmentally Conscious Manufactur-ing; Special Process; Manufacturing, Quality, Reli-ability, Packaging, and Components Engineering;Phototooling; Quality Control; and Rapid Proto-type Service Center. To maintain the highest levelof services, each business group has a working leadwho controls out-going quality; charges; cost; in-side and outside decisions; delivery; and cost esti-mates. In cases where the customer's request can-not be performed cost-effectively by an individualgroup, EMG will submit the request to a qualifiedoutside vendor.

The Coordination group provides information,guidance, support, and organizational expertise tocustomers who access the services of EMG's busi-ness groups. The Central Drafting group designsand drafts complex state-of-the-art printed wiringboards which include rigid, flex, or a combination ofrigid and flex for through-hole, surface mount, andfine pitch technology components. In addition, Cen-

tral Drafting offers various electro-mechanical draft-ing services such as chassis design, schematic gen-eration, wiring diagrams, silk-screen signs, andparts lists.

The Engineering Instrumentation Services groupmanages a pool of more than 2,200 items rangingfrom audio and visual equipment to various testand measurement equipment. EnvironmentallyConscious Manufacturing tests and evaluates newmaterials and processes; assists with the solutiondevelopment for eliminating hazardous waste andpromoting energy efficiency and cost competitive-ness. These services are available to internal andexternal customers. One notable project, currentlyunderway, uses lasers to plate copper on printedcircuit boards for circuit traces and drilling holes,thereby eliminating chemicals from the manufac-turing process.

The Special Process group performs chemicaletching and machining of specialized parts in vari-ous configurations and materials. In addition, thisgroup fabricates single and double-sided, unique,prototype printed circuit boards. The Manufactur-ing, Quality, Reliability, Packaging, and Compo-nents Engineering group provides broad-back-ground expertise in design, packaging, manufac-turing, materials, and quality assurance.

The Phototooling group converts customer-gen-erated design data into precision phototools forproofing or production. The Quality Control groupperforms the required inspections of electrical andelectronic parts per specific standards and specifi-cations. Rapid Prototype Service Center providesteams who work closely with the customer. To-gether, they design and fabricate assemblies andsubassemblies (e.g., chassis, cable, printed circuitboard, mechanical) to produce prototype and pre-production units.

Through its business groups, LLNL's EMG pro-vides a wide range of services. EMG's manufactur-ing expertise and support offer direct response,quick turnaround, minimal paperwork require-ments, and low overhead to its customers.

Technologies Enabling AgileManufacturing

LLNL is a participating member of the DOE-funded facilities team (which includes Sandia Na-tional Laboratory, Los Alamos National Labora-tory, Kansas City Plant, and the Oak Ridge Y-12Plant) to develop a technology toolbox. To evaluate

23

an agile enterprise with deployment through com-mercial partners, private industry will use theTechnologies Enabling Agile Manufacturing(TEAM) toolbox in three demonstrations of mate-rial removal, forming, and electromechanical as-sembly. TEAM will deliver an enabling technologytoolbox; implementation of the toolbox in a virtualenterprise; and validating demonstrations of TEAMtechnologies via product demonstrations.

TEAM will pursue five thrust areas (Figure 3-3):product design and enterprise concurrency; virtualmanufacturing; manufacturing planning and con-trol; intelligent closed-loop processing; and enter-prise integration. LLNL will lead the thrust area inintelligent closed-loop processing and focus on theexecution (manufacturing) phase.

During the Material Removal Demonstration in1995, the four laboratories and industry were inter-connected with a partially-networked infrastruc-ture, a limited document archiving, and a limitedcollaborative design environment. In 1997, theMaterial Removal Demonstration will utilize analuminum engine head for a Chevrolet Corvettewhich General Motors manufactured via TEAMtechnologies. The Ford Motor Company will do theinspection. This process will feature a maturing ofthe TEAM thrust areas and demonstrate a seam-less process. By late 1997, LLNL's contribution ona titanium nozzle, done in partnership with Pratt &Whitney, will be fully evaluated at the FormingDemonstration.

Vacuum Process

LLNL's Vacuum Process Group features experi-enced personnel, state-of-the-art facilities, and coat-ing equipment and capabilities. The Group special-izes in applying coatings to a variety of parts byusing physical vapor deposition methods and candeposit vacuum-compatible materials onto sub-strates in thicknesses ranging from angstroms to

hundreds of microns.As an application and de-

velopment facility, theGroup's staff can solve coat-ing problems for most appli-cations. They have developedcomputer codes which enablethem to optimize source de-sign, coating material, andprocess variables. Specialtyequipment includes a ca-thodic arc system for amor-phous diamond coatings; ion-plating; sputtering for x-raymultilayer optics; transpar-ent conductive oxides; andsurface engineering for ad-hesion, wear resistance, cor-rosion resistance, and super-conductive wires.

With its diverse skills andcapabilities, LLNL's Vacuum

Process Group is set up to work with most coatingapplications. The Group also operates with indus-trial interactions via CRADAs; work-for-others pro-grams; tool and material partnerships; and smallbusiness initiatives programs.

Facilities

User Facilities

LLNL provides accessibility of some of its facili-ties to industry and academic institutions thatneed access to sophisticated fabrication, calibra-tion, and testing equipment. Users have the oppor-tunity to conduct hands-on research and develop-ment activities for producing a product prototypeor for developing or evaluating a novel technologyor process. Currently, LLNL offers three user fa-cilities: Livermore Center for Advanced Manufac-turing and Productivity (LCAMP); Livermore UserFacility for Inspection and Characterization; andVirtual Laboratory Testbed.

Figure 3-3. The TEAM Concept

24

LCAMP is currently coming on line. This facilityhouses a variety of equipment such as advancedlathes; grinders; diamond-turning machines; andmeasuring and inspection devices. LCAMP's usershave access to specialized on-site services and fa-cilities that were previously only available to LLNL'sinternal manufacturing program. Services and fa-cilities include plastics processing, heat treating,high-precision cutter grinding, machine tool ser-vices, sheet metal shop, metal finishing, modeling,and welding.

LLNL offers its user facilities on a full-cost recov-ery basis. In addition, LLNL uses a streamlinedprocess to facilitate the application, review, andscheduling processes.

Management

Advanced Telecommunications forManufacturing

LLNL has an existing LAN architecture whichefficiently routes and services approximately 15,000computers at the Livermore site, Site 300, andwithin the town of Livermore. Connections areprovided by Ethernet, FDDI, and T1. Nodes, hubs,and services provide sufficient features to effi-ciently integrate more than 140 subsets and servemore than 350 buildings. The LAN includes aswitched backbone, secure net encryption, andInternet capabilities.

Additionally, LLNL is taking aggressive action todefine and develop very high bandwidth capabili-ties for meeting its future network needs. Thisaction will support DOE's Accelerated StrategicComputing Initiative and promote further advance-ment by applying emerging communication andnetworking technologies.

To date, significant initiatives include participa-tion in ANSI standards development and develop-ment of an Asynchronous Transfer Mode (ATM)network testbed and a Fibre Channel testbed. TheATM network testbed connects advanced LLNLfacilities (including compressed video) with theNational Transparent Optical Network (NTON), a10-gigabit-per-second prototype network for highprofile, high bandwidth emerging technologies andapplications. LLNL is the lead integrator for NTONand has led the network design, management, andapplication activities. The NTON consortium com-prises key telecommunications organizations in-cluding NORTEL, Pacific Bell, Sprint, Rockwell,Hughes, Uniphase Telecommunications Products,University of California at San Diego, ColumbiaUniversity, and Case Western Reserve Universityin addition to LLNL.

NTON uses wavelength division multiplexingwhich provides significant capabilities for new band-width allocation. NTON currently implements startopology and will incorporate full bi-directionalring topology upon completion of the fibre paths.The network will operate as an open testbed fordemonstrating emerging technologies with high-capability, low-cost, format-transparent, wave-length-on-demand features.

A-1

A p p e n d i x A

Table of Acronyms

Acronym Definition

AMPS Airborne Multisensor Pod SystemAMS Accelerator Mass SpectrometryAPI Application Programming InterfaceATM Asynchronous Transfer Mode

CAMI Compact Airborne Multispectral ImagerCAMS Center for Accelerator Mass SpectrometryCAT Computer Axial TomographyCERPS Concurrent Engineering and Rapid Prototyping SystemCRADA Cooperative Research And Development Agreement

DOE Department of EnergyDSI Distributed Surface Integral

EM ElectromagneticEMG Electronic Manufacturing Group

GII Global Information InfrastructureGILD Gas Immersion Laser Doping

LCAMP Livermore Center for Advanced Manufacturing and ProductivityLLNL Lawrence Livermore National Laboratory

MELD Multi-scale ElectroDynamicsMEMS Microelectro-mechanical SystemMOS Manufacturing Operating System

NDE Nondestructive EvaluationNII National Information InfrastructureNTON National Transparent Optical Network

PS&M Precision Systems and Manufacturing Group

ROMAC Remote Optical Monitor for Airborne Chemicals

TEAM Technologies Enabling Agile ManufacturingTEXNET Textile Network

B-1

A p p e n d i x B

BMP Survey Team

Team Member Activity Function

Larry Robertson Crane Division Team Chairman(812) 854-5336 Naval Surface Warfare Center

Crane, IN

Cheri Spencer BMP Center of Excellence Technical Writer(301) 403-8100 College Park, MD

Team 1

Rick Purcell BMP Center of Excellence Team Leader(301) 403-8100 College Park, MD

Larry Halbig Hughes Air Warfare Center(317) 306-3838 Indianapolis, IN

Ron Hawkins University of Maryland(301) 405-3814 College Park, MD

Team 2

Dick Rumpf Rumpf Associates International Team Leader(703) 351-5080 Arlington, VA

Bob Harper BMP Center of Excellence(301) 403-8100 College Park, MD

Larry Robertson Naval Surface Warfare Center(812) 854-5336 Crane, IN

C-1

“CRITICAL PATH TEMPLATESFOR

TRANSITION FROM DEVELOPMENT TO PRODUCTION”

A p p e n d i x C

Critical Path Templates and BMP Templates

This survey was structured around and concen-trated on the functional areas of design, test, pro-duction, facilities, logistics, and management aspresented in the Department of Defense 4245.7-M,Transition from Development to Production docu-ment. This publication defines the proper tools—ortemplates—that constitute the critical path for asuccessful material acquisition program. It de-scribes techniques for improving the acquisition

process by addressing it as an industrial processthat focuses on the product’s design, test, and pro-duction phases which are interrelated and interde-pendent disciplines.

The BMP program has continued to build onthis knowledge base by developing 17 new tem-plates that complement the existing DOD 4245.7-M templates. These BMP templates address newor emerging technologies and processes.

D-1

A p p e n d i x D

BMPnet and the Program Manager’s WorkStation

The BMPnet, located at the Best ManufacturingPractices Center of Excellence (BMPCOE) in Col-lege Park, Maryland, supports several communica-tion features. These features include the ProgramManager’s WorkStation (PMWS), electronic mailand file transfer capabilities, as well as access toSpecial Interest Groups (SIGs) for specific topicinformation and communication. The BMPnet canbe accessed through the World Wide Web (athttp://www.bmpcoe.org), through free software thatconnects directly over the Internet or through amodem. The PMWS software isalso available on CD-ROM.

PMWS provides users withtimely acquisition and engi-neering information through aseries of interrelated softwareenvironments and knowledge-based packages. The maincomponents of PMWS areKnowHow, SpecRite, the Tech-nical Risk Identification andMitigation System (TRIMS),and the BMP Database.

KnowHow is an intelligent,automated program that pro-vides rapid access to informa-tion through an intelligentsearch capability. Informationcurrently available in KnowHow handbooks in-cludes Acquisition Streamlining, Non-DevelopmentItems, Value Engineering, NAVSO P-6071 (BestPractices Manual), MIL-STD-2167/2168 and theDoD 5000 series documents. KnowHow cuts docu-ment search time by 95%, providing critical, user-specific information in under three minutes.

SpecRite is a performance specification genera-tor based on expert knowledge from all uniformedservices. This program guides acquisition person-

nel in creating specifications for their requirements,and is structured for the build/approval process.SpecRite’s knowledge-based guidance and assis-tance structure is modular, flexible, and providesoutput in MIL-STD 961D format in the form ofeditable WordPerfect® files.

TRIMS, based on DoD 4245.7-M (the transitiontemplates), NAVSO P-6071, and DoD 5000 event-oriented acquisition, helps the user identify andrank a program’s high-risk areas. By helping theuser conduct a full range of risk assessments through-

out the acquisition process,TRIMS highlights areas wherecorrective action can be initi-ated before risks develop intoproblems. It also helps userstrack key project documenta-tion from concept through pro-duction including goals, respon-sible personnel, and next ac-tion dates for future activities.

The BMP Database con-tains proven best practices fromindustry, government, and theacademic communities. Thesebest practices are in the areasof design, test, production, fa-cilities, management, and lo-gistics. Each practice has been

observed, verified, and documented by a team ofgovernment experts during BMP surveys.

Access to the BMPnet through dial-in or on Inter-net requires a special modem program. This pro-gram can be obtained by calling the BMPnet HelpDesk at (301) 403-8179 or it can be downloaded fromthe World Wide Web at http://www.bmpcoe.org. Toreceive a user/e-mail account on the BMPnet, senda request to helpdesk@bmpcoe.org.

There are currently six Best Manufacturing Practices (BMP) satellite centers that provide representationfor and awareness of the BMP program to regional industry, government and academic institutions. Thecenters also promote the use of BMP with regional Manufacturing Technology Centers. Regional manufac-turers can take advantage of the BMP satellite centers to help resolve problems, as the centers hostinformative, one-day regional workshops that focus on specific technical issues.

Center representatives also conduct BMP lectures at regional colleges and universities; maintain lists ofexperts who are potential survey team members; provide team member training; identify regional expertsfor inclusion in the BMPnet SIG e-mail; and train regional personnel in the use of BMP resources such asthe BMPnet.

The six BMP satellite centers include:

California

Chris MatzkeBMP Satellite Center ManagerNaval Warfare Assessment DivisionCode QA-21, P.O. Box 5000Corona, CA 91718-5000(909) 273-4992FAX: (909) 273-4123cmatzke@bmpcoe.org

Jack TamargoBMP Satellite Center Manager257 Cottonwood DriveVallejo, CA 94591(707) 642-4267FAX: (707) 642-4267jtamargo@bmpcoe.org

District of Columbia

Margaret CahillBMP Satellite Center ManagerU.S. Department of Commerce14th Street & Constitution Avenue, NWRoom 3876 BXAWashington, DC 20230(202) 482-8226/3795FAX: (202) 482-5650mcahill@bxa.doc.gov

Illinois

Thomas ClarkBMP Satellite Center ManagerRock Valley College3301 North Mulford RoadRockford, IL 61114(815) 654-5515FAX: (815) 654-4459adme3tc@rvcux1.rvc.cc.il.us

Pennsylvania

Sherrie SnyderBMP Satellite Center ManagerMANTEC, Inc.P.O. Box 5046York, PA 17405(717) 843-5054, ext. 225FAX: (717) 854-0087snyderss@mantec.org

Tennessee

Tammy GrahamBMP Satellite Center ManagerLockheed Martin Energy SystemsP.O. Box 2009, Bldg. 9737M/S 8091Oak Ridge, TN 37831-8091(423) 576-5532FAX: (423) 574-2000tgraham@bmpcoe.org

E-1

A p p e n d i x E

Best Manufacturing Practices Satellite Centers

F-1

A p p e n d i x F

Navy Manufacturing Technology Centers of Excellence

Best Manufacturing Practices Centerof Excellence

The Best Manufacturing Practices Center of Excel-lence (BMPCOE) provides a national resource toidentify and promote exemplary manufacturing andbusiness practices and to disseminate this informa-tion to the U.S. Industrial Base. The BMPCOE wasestablished by the Navy’s BMP program, Depart-ment of Commerce’s National Institute of Stan-dards and Technology, and the University of Mary-land at College Park, Maryland. The BMPCOEimproves the use of existing technology, promotesthe introduction of improved technologies, and pro-vides non-competitive means to address commonproblems, and has become a significant factor incountering foreign competition.

Point of Contact:Mr. Ernie RennerBest Manufacturing Practices Center ofExcellence4321 Hartwick RoadSuite 400College Park, MD 20740(301) 403-8100FAX: (301) 403-8180ernie@bmpcoe.org

Center of Excellence for CompositesManufacturing Technology

The Center of Excellence for Composites Manufac-turing Technology (CECMT) provides a nationalresource for the development and dissemination ofcomposites manufacturing technology to defensecontractors and subcontractors. The CECMT ismanaged by the GreatLakes Composites Consor-tium and represents a collaborative effort amongindustry, academia, and government to develop,evaluate, demonstrate, and test composites manu-facturing technologies. The technical work is prob-lem-driven to reflect current and future Navy needsin the composites industrial community.

Point of Contact:Dr. Roger FountainCenter of Excellence for Composites ManufacturingTechnology103 Trade Zone DriveSuite 26CWest Columbia, SC 29170(803) 822-3705FAX: (803) 822-3730rfglcc@glcc.org

Electronics Manufacturing ProductivityFacility

The Electronics Manufacturing Productivity Facil-ity (EMPF) identifies, develops, and transfers inno-vative electronics manufacturing processes to do-mestic firms in support of the manufacture of afford-able military systems. The EMPF operates as aconsortium comprised of industry, university, andgovernment participants, led by the American Com-petitiveness Institute under a CRADA with theNavy.

Point of Contact:Mr. Alan CriswellElectronics Manufacturing Productivity FacilityPlymouth Executive CampusBldg 630, Suite 100630 West Germantown PikePlymouth Meeting, PA 19462(610) 832-8800FAX: (610) 832-8810http://www.engriupui.edu/empf/

National Center for Excellence inMetalworking Technology

The National Center for Excellence in MetalworkingTechnology (NCEMT) provides a national center forthe development, dissemination, and implemen-tation of advanced technologies for metalworkingproducts and processes. The NCEMT, operated byConcurrent Technologies Corporation, helps theNavy and defense contractors improve

The Navy Manufacturing Sciences and Technology Program established the following Centers ofExcellence (COEs) to provide focal points for the development and technology transfer of new manufactur-ing processes and equipment in a cooperative environment with industry, academia, and Navy centers andlaboratories. These COEs are consortium-structured for industry, academia, and government involvementin developing and implementing technologies. Each COE has a designated point of contact listed below withthe individual COE information.

F-2

manufacturing productivity and part reliabilitythrough development, deployment, training, andeducation for advanced metalworking technologies.

Point of Contact:Mr. Richard HenryNational Center for Excellence in MetalworkingTechnology1450 Scalp AvenueJohnstown, PA 15904-3374(814) 269-2532FAX: (814) 269-2799henry@ctc.com

Navy Joining Center

The Navy Joining Center (NJC) is operated by theEdison Welding Institute and provides a nationalresource for the development of materials joiningexpertise and the deployment of emerging manufac-turing technologies to Navy contractors, subcon-tractors, and other activities. The NJC works withthe Navy to determine and evaluate joining technol-ogy requirements and conduct technology develop-ment and deployment projects to address theseissues.

Point of Contact:Mr. David P. EdmondsNavy Joining Center1100 Kinnear RoadColumbus, OH 43212-1161(614) 487-5825FAX: (614) 486-9528dave_edmonds@ewi.org

Energetics Manufacturing TechnologyCenter

The Energetics Manufacturing Technology Center(EMTC) addresses unique manufacturing processesand problems of the energetics industrial base toensure the availability of affordable, quality ener-getics. The focus of the EMTC is on process technol-ogy with a goal of reducing manufacturing costswhile improving product quality and reliability.The COE also maintains a goal of development andimplementation of environmentally benign ener-getics manufacturing processes.

Point of Contact:Mr. John BroughEnergetics Manufacturing Technology CenterIndian Head DivisionNaval Surface Warfare CenterIndian Head, MD 20640-5035(301) 743-4417DSN: 354-4417FAX: (301) 743-4187mt@command.nosih.sea06.navy.mil

Manufacturing Science and AdvancedMaterials Processing Institute

The Manufacturing Science and Advanced Materi-als Processing Institute (MS&AMPI) is comprisedof three centers including the National Center forAdvanced Drivetrain Technologies (NCADT), TheSurface Engineering Manufacturing TechnologyCenter (SEMTC), and the Laser Applications Re-search Center (LaserARC). These centers are lo-cated at The Pennsylvania State University’s Ap-plied Research Laboratory. Each center is high-lighted below.

Point of Contact for MS&AMPI:Mr. Henry WatsonManufacturing Science and Advanced MaterialsProcessing InstituteARL Penn StateP.O. Box 30State College, PA 16804-0030(814) 865-6345FAX: (814) 863-1183hew2@psu.edu

• National Center for Advanced DrivetrainTechnologiesThe NCADT supports DoD by strengthening,revitalizing, and enhancing the technologicalcapabilities of the U.S. gear and transmissionindustry. It provides a site for neutral testingto verify accuracy and performance of gear andtransmission components.

Point of Contact for NCADT:Dr. Suren RaoNCADT/Drivetrain CenterARL Penn StateP.O. Box 30State College, PA 16804-0030(814) 865-3537FAX: (814) 863-6185http://www.arl.psu.edu/drivetrain_center.html/

Gulf Coast Region Maritime TechnologyCenter

The Gulf Coast Region Maritime Technology Cen-ter (GCRMTC) is located at the University of NewOrleans and will focus primarily on product devel-opments in support of the U.S. shipbuilding indus-try. A sister site at Lamar University in Orange,Texas will focus on process improvements.

Point of Contact:Dr. John CrispGulf Coast Region Maritime Technology CenterUniversity of New OrleansRoom N-212New Orleans, LA 70148(504) 286-3871FAX: (504) 286-3898

F-3

• Surface Engineering ManufacturingTechnology CenterThe SEMTC enables technology developmentin surface engineering—the systematic andrational modification of material surfaces toprovide desirable material characteristics andperformance. This can be implemented forcomplex optical, electrical, chemical, and me-chanical functions or products that affect thecost, operation, maintainability, and reliabil-ity of weapon systems.

Point of Contact for SEMTC:Dr. Maurice F. AmateauSEMTC/Surface Engineering CenterP.O. Box 30State College, PA 16804-0030(814) 863-4214FAX: (814) 863-0006http://www/arl.psu.edu/divisions/arl_org.html

• Laser Applications Research Center

The LaserARC is established to expand thetechnical capabilities of DOD by providingaccess to high-power industrial lasers for ad-vanced material processing applications.LaserARC offers basic and applied research inlaser-material interaction, process develop-ment, sensor technologies, and correspondingdemonstrations of developed applications.

Point of Contact for LaserARC:Mr. Paul DenneyLaser CenterARL Penn StateP.O. Box 30State College, PA 16804-0030(814) 865-2934FAX: (814) 863-1183http://www/arl.psu.edu/divisions/arl_org.html

As of this publication, 93 surveys have been conducted and published by BMP at the companies listedbelow. Copies of older survey reports may be obtained through DTIC or by accessing the BMPnet. Requestsfor copies of recent survey reports or inquiries regarding the BMPnet may be directed to:

Best Manufacturing Practices Program4321 Hartwick Rd., Suite 400

College Park, MD 20740Attn: Mr. Ernie Renner, Director

Telephone: 1-800-789-4267FAX: (301) 403-8180ernie@bmpcoe.org

G-1

1986

1985

A p p e n d i x G

Completed Surveys

1987

Litton Guidance & Control Systems Division - Woodland Hills, CA

Honeywell, Incorporated Undersea Systems Division - Hopkins, MN (Alliant TechSystems, Inc.)Texas Instruments Defense Systems & Electronics Group - Lewisville, TXGeneral Dynamics Pomona Division - Pomona, CAHarris Corporation Government Support Systems Division - Syosset, NYIBM Corporation Federal Systems Division - Owego, NYControl Data Corporation Government Systems Division - Minneapolis, MN

Hughes Aircraft Company Radar Systems Group - Los Angeles, CAITT Avionics Division - Clifton, NJRockwell International Corporation Collins Defense Communications - Cedar Rapids, IAUNISYS Computer Systems Division - St. Paul, MN (Paramax)

Motorola Government Electronics Group - Scottsdale, AZGeneral Dynamics Fort Worth Division - Fort Worth, TXTexas Instruments Defense Systems & Electronics Group - Dallas, TXHughes Aircraft Company Missile Systems Group - Tucson, AZBell Helicopter Textron, Inc. - Fort Worth, TXLitton Data Systems Division - Van Nuys, CAGTE C3 Systems Sector - Needham Heights, MA

McDonnell-Douglas Corporation McDonnell Aircraft Company - St. Louis, MONorthrop Corporation Aircraft Division - Hawthorne, CALitton Applied Technology Division - San Jose, CALitton Amecom Division - College Park, MDStandard Industries - LaMirada, CAEngineered Circuit Research, Incorporated - Milpitas, CATeledyne Industries Incorporated Electronics Division - Newbury Park, CALockheed Aeronautical Systems Company - Marietta, GALockheed Corporation Missile Systems Division - Sunnyvale, CAWestinghouse Electronic Systems Group - Baltimore, MDGeneral Electric Naval & Drive Turbine Systems - Fitchburg, MARockwell International Corporation Autonetics Electronics Systems - Anaheim, CATRICOR Systems, Incorporated - Elgin, IL

Hughes Aircraft Company Ground Systems Group - Fullerton, CATRW Military Electronics and Avionics Division - San Diego, CAMechTronics of Arizona, Inc. - Phoenix, AZBoeing Aerospace & Electronics - Corinth, TXTechnology Matrix Consortium - Traverse City, MITextron Lycoming - Stratford, CT

1988

1989

1990

G-2

Resurvey of Litton Guidance & Control Systems Division - Woodland Hills, CANorden Systems, Inc. - Norwalk, CTNaval Avionics Center - Indianapolis, INUnited Electric Controls - Watertown, MAKurt Manufacturing Co. - Minneapolis, MNMagneTek Defense Systems - Anaheim, CARaytheon Missile Systems Division - Andover, MAAT&T Federal Systems Advanced Technologies and AT&T Bell Laboratories - Greensboro, NC and Whippany, NJResurvey of Texas Instruments Defense Systems & Electronics Group - Lewisville, TX

Tandem Computers - Cupertino, CACharleston Naval Shipyard - Charleston, SCConax Florida Corporation - St. Petersburg, FLTexas Instruments Semiconductor Group Military Products - Midland, TXHewlett-Packard Palo Alto Fabrication Center - Palo Alto, CAWatervliet U.S. Army Arsenal - Watervliet, NYDigital Equipment Company Enclosures Business - Westfield, MA and Maynard, MAComputing Devices International - Minneapolis, MN(Resurvey of Control Data Corporation Government Systems Division)Naval Aviation Depot Naval Air Station - Pensacola, FL

NASA Marshall Space Flight Center - Huntsville, ALNaval Aviation Depot Naval Air Station - Jacksonville, FLDepartment of Energy Oak Ridge Facilities (Operated by Martin Marietta Energy Systems, Inc.) - Oak Ridge, TNMcDonnell Douglas Aerospace - Huntington Beach, CACrane Division Naval Surface Warfare Center - Crane, IN and Louisville, KYPhiladelphia Naval Shipyard - Philadelphia, PAR. J. Reynolds Tobacco Company - Winston-Salem, NCCrystal Gateway Marriott Hotel - Arlington, VAHamilton Standard Electronic Manufacturing Facility - Farmington, CTAlpha Industries, Inc. - Methuen, MA

Harris Semiconductor - Melbourne, FLUnited Defense, L.P. Ground Systems Division - San Jose, CANaval Undersea Warfare Center Division Keyport - Keyport, WAMason & Hanger - Silas Mason Co., Inc. - Middletown, IAKaiser Electronics - San Jose, CAU.S. Army Combat Systems Test Activity - Aberdeen, MDStafford County Public Schools - Stafford County, VA

Sandia National Laboratories - Albuquerque, NMRockwell Defense Electronics Collins Avionics & Communications Division - Cedar Rapids, IA(Resurvey of Rockwell International Corporation Collins Defense Communications)Lockheed Martin Electronics & Missiles - Orlando, FLMcDonnell Douglas Aerospace (St. Louis) - St. Louis, MO(Resurvey of McDonnell-Douglas Corporation McDonnell Aircraft Company)Dayton Parts, Inc. - Harrisburg, PAWainwright Industries - St. Peters, MOLockheed Martin Tactical Aircraft Systems - Fort Worth, TX(Resurvey of General Dynamics Fort Worth Division)Lockheed Martin Government Electronic Systems - Moorestown, NJSacramento Manufacturing and Services Division - Sacramento, CAJLG Industries, Inc. - McConnellsburg, PA

City of Chattanooga - Chattanooga, TNMason & Hanger Corporation - Pantex Plant - Amarillo, TXNascote Industries, Inc. - Nashville, ILWeirton Steel Corporation - Weirton, WVNASA Kennedy Space Center - Cape Canaveral, FLDepartment of Energy, Oak Ridge Operations - Oak Ridge, TN

1994

1992

1991

1993

1995

1996

1997

G-3

Headquarters, U.S. Army Industrial Operations Command - Rock Island, ILSAE International and Performance Review Institute - Warrendale, PAPolaroid Corporation - Waltham, MACincinnati Milacron, Inc. - Cincinnati, OHLawrence Livermore National Laboratory - Livermore, CA