bq2022A 1K-Bit Serial EPROM with SDQ .bq2022A ID ROM (64 bits) EPROM MEMORY (1024 bits) EPROM STATUS

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  • bq2022A

    ID ROM

    (64 bits)

    EPROM

    MEMORY

    (1024 bits)

    EPROM

    STATUS

    (64 bits)

    SDQ Communications

    Controller and 8-Bit CRC

    Generation Circuit

    InternalBus

    RAM

    Buffer(8 bytes)

    SDQ 1

    2VSS 3 VSS

    Product

    Folder

    Sample &Buy

    Technical

    Documents

    Tools &

    Software

    Support &Community

    An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

    bq2022ASLUS724E SEPTEMBER 2006REVISED MARCH 2016

    bq2022A 1K-Bit Serial EPROM with SDQ Interface

    1

    1 Features1 1024 Bits of One-Time Programmable (OTP)

    EPROM For Storage Of User-ProgrammableConfiguration Data

    Factory-Programmed Unique 64-Bit IdentificationNumber

    Single-Wire Interface to Reduce Circuit BoardRouting

    Synchronous Communication Reduces HostInterrupt Overhead

    15KV IEC 61000-4-2 ESD Compliance on DataPin

    No Standby Power Required Available in a 3-Pin SOT-23 Package and TO-92

    Package

    2 Applications Security Encoding Inventory Tracking Product-Revision Maintenance Battery-Pack Identification

    3 DescriptionThe bq2022A is a 1K-bit serial EPROM containing afactory-programmed, unique 48-bit identificationnumber, 8-bit CRC generation, and the 8-bit familycode (09h). A 64-bit status register controls writeprotection and page redirection.

    The bq2022A SDQ interface requires only a singleconnection and a ground return. The DATA pin isalso the sole power source for the bq2022A.

    The small surface-mount package options savesprinted-circuit-board space, while the low cost makesit ideal for applications such as battery packconfiguration parameters, record maintenance, assettracking, product-revision status, and access-codesecurity.

    Device Information(1)PART NUMBER PACKAGE BODY SIZE (NOM)

    bq2022ASOT-23 (3) 2.92 mm x 1.30 mmTO-92 (3) 4.30 mm x 4.30 mm

    (1) For all available packages, see the orderable addendum atthe end of the datasheet.

    SPACER

    SPACER

    Simplified Schematic

    http://www.ti.com/product/bq2022a?qgpn=bq2022ahttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=pfhttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=sandbuysamplebuyhttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=tddoctype2http://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=swdesKithttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=supportcommunity

  • 2

    bq2022ASLUS724E SEPTEMBER 2006REVISED MARCH 2016 www.ti.com

    Product Folder Links: bq2022A

    Submit Documentation Feedback Copyright 20062016, Texas Instruments Incorporated

    Table of Contents1 Features .................................................................. 12 Applications ........................................................... 13 Description ............................................................. 14 Revision History..................................................... 25 Pin Configuration and Functions ......................... 46 Specifications......................................................... 4

    6.1 Absolute Maximum Ratings ...................................... 46.2 ESD Ratings ............................................................ 46.3 Recommended Operating Conditions....................... 46.4 Thermal Information .................................................. 56.5 Electrical Characteristics: DC ................................... 56.6 Switching Characteristics: AC................................... 56.7 Typical Characteristics .............................................. 6

    7 Detailed Description .............................................. 77.1 Overview ................................................................... 77.2 Functional Block Diagram ......................................... 7

    7.3 Feature Description................................................... 77.4 Device Functional Modes.......................................... 97.5 Programming ............................................................ 9

    8 Application and Implementation ........................ 198.1 Application Information............................................ 198.2 Typical Application ................................................. 19

    9 Power Supply Recommendations ...................... 2210 Layout................................................................... 23

    10.1 Layout Guidelines ................................................. 2310.2 Layout Example .................................................... 23

    11 Device and Documentation Support ................. 2411.1 Documentation Support ........................................ 2411.2 Trademarks ........................................................... 2411.3 Electrostatic Discharge Caution............................ 2411.4 Glossary ................................................................ 24

    12 Mechanical, Packaging, and OrderableInformation ........................................................... 24

    4 Revision History

    Changes from Revision D (December 2014) to Revision E Page

    Added text: "No additional capacitance..." to the Typical Application section ..................................................................... 19 Added the SDQ Master Best Practices section ................................................................................................................... 20 Added text and Figure 21 to the Power Supply Recommendations section ....................................................................... 22

    Changes from Revision C (August 2007) to Revision D Page

    Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementationsection, Power Supply Recommendations section, Layout section, Device and Documentation Support section, andMechanical, Packaging, and Orderable Information section. ................................................................................................ 1

    Deleted Bus-Interface Architecture Allowing Multiple bq2022As Attached to a Single Host from Features.......................... 1 Deleted last sentence from second paragraph in Description ............................................................................................... 1 Added Junction temperature to Absolute Maximum Ratings ................................................................................................. 4 Deleted last two sentences and figure from Serial Communication section .......................................................................... 9 Deleted second sentence from READ ROM Command section ............................................................................................ 9 Deleted MATCH ROM and SEARCH ROM sections ............................................................................................................ 9 Deleted text from first sentence and deleted third sentence from SKIP ROM Command section......................................... 9 Changed from: a part is selected by a ROM command to: a part is issued a SKIP ROM command in the last

    sentence of the Memory/Status Function Commands section ............................................................................................... 9 Changed from: the ROM command is followed to: the SKIP ROM command is followed in the first sentence of the

    READ MEMORY/Page CRC section.................................................................................................................................... 10 Changed from: Initialization and ROM Command Sequence to: Initialization and SKIP ROM Command Sequence in

    Figure 7 ............................................................................................................................................................................... 10 Changed from: the ROM command is followed to: the SKIP ROM command is followed in the first sentence of the

    READ MEMORY/Field CRC section .................................................................................................................................... 10 Changed from: Initialization and ROM Command Sequence to: Initialization and SKIP ROM Command Sequence in

    Figure 8................................................................................................................................................................................. 11 Changed from: After issuing a ROM command to: After issuing a SKIP ROM command in the second sentence of

    the second paragraph of the WRITE MEMORY Command section .................................................................................... 11 Changed from: After issuing a ROM command to: After issuing a SKIP ROM command in the first sentence of the

    http://www.ti.com/product/bq2022a?qgpn=bq2022ahttp://www.ti.comhttp://www.ti.com/product/bq2022a?qgpn=bq2022ahttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLUS724E&partnum=bq2022A

  • 3

    bq2022Awww.ti.com SLUS724E SEPTEMBER 2006REVISED MARCH 2016

    Product Folder Links: bq2022A

    Submit Documentation FeedbackCopyright 20062016, Texas Instruments Incorporated

    READ STATUS Command section ...................................................................................................................................... 12 Changed from: Initialization and ROM Command Sequence to: Initialization and SKIP ROM Command Sequence in

    Figure 10 ............................................................................................................................................................................. 13 Chang