View
215
Download
0
Embed Size (px)
bq2022A
ID ROM
(64 bits)
EPROM
MEMORY
(1024 bits)
EPROM
STATUS
(64 bits)
SDQ Communications
Controller and 8-Bit CRC
Generation Circuit
InternalBus
RAM
Buffer(8 bytes)
SDQ 1
2VSS 3 VSS
Product
Folder
Sample &Buy
Technical
Documents
Tools &
Software
Support &Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq2022ASLUS724E SEPTEMBER 2006REVISED MARCH 2016
bq2022A 1K-Bit Serial EPROM with SDQ Interface
1
1 Features1 1024 Bits of One-Time Programmable (OTP)
EPROM For Storage Of User-ProgrammableConfiguration Data
Factory-Programmed Unique 64-Bit IdentificationNumber
Single-Wire Interface to Reduce Circuit BoardRouting
Synchronous Communication Reduces HostInterrupt Overhead
15KV IEC 61000-4-2 ESD Compliance on DataPin
No Standby Power Required Available in a 3-Pin SOT-23 Package and TO-92
Package
2 Applications Security Encoding Inventory Tracking Product-Revision Maintenance Battery-Pack Identification
3 DescriptionThe bq2022A is a 1K-bit serial EPROM containing afactory-programmed, unique 48-bit identificationnumber, 8-bit CRC generation, and the 8-bit familycode (09h). A 64-bit status register controls writeprotection and page redirection.
The bq2022A SDQ interface requires only a singleconnection and a ground return. The DATA pin isalso the sole power source for the bq2022A.
The small surface-mount package options savesprinted-circuit-board space, while the low cost makesit ideal for applications such as battery packconfiguration parameters, record maintenance, assettracking, product-revision status, and access-codesecurity.
Device Information(1)PART NUMBER PACKAGE BODY SIZE (NOM)
bq2022ASOT-23 (3) 2.92 mm x 1.30 mmTO-92 (3) 4.30 mm x 4.30 mm
(1) For all available packages, see the orderable addendum atthe end of the datasheet.
SPACER
SPACER
Simplified Schematic
http://www.ti.com/product/bq2022a?qgpn=bq2022ahttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=pfhttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=sandbuysamplebuyhttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=tddoctype2http://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=swdesKithttp://www.ti.com/product/bq2022A?dcmp=dsproject&hqs=supportcommunity
2
bq2022ASLUS724E SEPTEMBER 2006REVISED MARCH 2016 www.ti.com
Product Folder Links: bq2022A
Submit Documentation Feedback Copyright 20062016, Texas Instruments Incorporated
Table of Contents1 Features .................................................................. 12 Applications ........................................................... 13 Description ............................................................. 14 Revision History..................................................... 25 Pin Configuration and Functions ......................... 46 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 46.2 ESD Ratings ............................................................ 46.3 Recommended Operating Conditions....................... 46.4 Thermal Information .................................................. 56.5 Electrical Characteristics: DC ................................... 56.6 Switching Characteristics: AC................................... 56.7 Typical Characteristics .............................................. 6
7 Detailed Description .............................................. 77.1 Overview ................................................................... 77.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 77.4 Device Functional Modes.......................................... 97.5 Programming ............................................................ 9
8 Application and Implementation ........................ 198.1 Application Information............................................ 198.2 Typical Application ................................................. 19
9 Power Supply Recommendations ...................... 2210 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 2310.2 Layout Example .................................................... 23
11 Device and Documentation Support ................. 2411.1 Documentation Support ........................................ 2411.2 Trademarks ........................................................... 2411.3 Electrostatic Discharge Caution............................ 2411.4 Glossary ................................................................ 24
12 Mechanical, Packaging, and OrderableInformation ........................................................... 24
4 Revision History
Changes from Revision D (December 2014) to Revision E Page
Added text: "No additional capacitance..." to the Typical Application section ..................................................................... 19 Added the SDQ Master Best Practices section ................................................................................................................... 20 Added text and Figure 21 to the Power Supply Recommendations section ....................................................................... 22
Changes from Revision C (August 2007) to Revision D Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementationsection, Power Supply Recommendations section, Layout section, Device and Documentation Support section, andMechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Deleted Bus-Interface Architecture Allowing Multiple bq2022As Attached to a Single Host from Features.......................... 1 Deleted last sentence from second paragraph in Description ............................................................................................... 1 Added Junction temperature to Absolute Maximum Ratings ................................................................................................. 4 Deleted last two sentences and figure from Serial Communication section .......................................................................... 9 Deleted second sentence from READ ROM Command section ............................................................................................ 9 Deleted MATCH ROM and SEARCH ROM sections ............................................................................................................ 9 Deleted text from first sentence and deleted third sentence from SKIP ROM Command section......................................... 9 Changed from: a part is selected by a ROM command to: a part is issued a SKIP ROM command in the last
sentence of the Memory/Status Function Commands section ............................................................................................... 9 Changed from: the ROM command is followed to: the SKIP ROM command is followed in the first sentence of the
READ MEMORY/Page CRC section.................................................................................................................................... 10 Changed from: Initialization and ROM Command Sequence to: Initialization and SKIP ROM Command Sequence in
Figure 7 ............................................................................................................................................................................... 10 Changed from: the ROM command is followed to: the SKIP ROM command is followed in the first sentence of the
READ MEMORY/Field CRC section .................................................................................................................................... 10 Changed from: Initialization and ROM Command Sequence to: Initialization and SKIP ROM Command Sequence in
Figure 8................................................................................................................................................................................. 11 Changed from: After issuing a ROM command to: After issuing a SKIP ROM command in the second sentence of
the second paragraph of the WRITE MEMORY Command section .................................................................................... 11 Changed from: After issuing a ROM command to: After issuing a SKIP ROM command in the first sentence of the
http://www.ti.com/product/bq2022a?qgpn=bq2022ahttp://www.ti.comhttp://www.ti.com/product/bq2022a?qgpn=bq2022ahttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLUS724E&partnum=bq2022A
3
bq2022Awww.ti.com SLUS724E SEPTEMBER 2006REVISED MARCH 2016
Product Folder Links: bq2022A
Submit Documentation FeedbackCopyright 20062016, Texas Instruments Incorporated
READ STATUS Command section ...................................................................................................................................... 12 Changed from: Initialization and ROM Command Sequence to: Initialization and SKIP ROM Command Sequence in
Figure 10 ............................................................................................................................................................................. 13 Chang
