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Power Electronics
C Mark Johnson University of Nottingham
Power Electronics
C Mark Johnson University of Nottingham
Overview
l Introduction to Power Electronics l Current Challenges for Power Electronics l IeMRC Power Electronics Themes l Research Examples l Conclusions
Introduction to Power Electronics Current Challenges for Power Electronics IeMRC Power Electronics Themes
What Does Power Electronics Do?
Efficient, flexible control and conversion of electrical energy
AC
AC
• Typically involves controlled change of voltage/current level and/or frequency
• Conversion efficiencies typically in excess of 90%
AC sources: single phase or three phase AC
Rectification
Inversion
ACAC conversion
AC loads: machines, industrial processes, power transmission and distribution systems
conversion
What Does Power Electronics Do?
Efficient, flexible control and conversion of electrical energy
DC
DC
Typically involves controlled change of voltage/current level
Conversion efficiencies typically in excess of 90%
DC sources: batteries, solar panel, power supply output
Rectification
Inversion
conversion
DC loads: electrical/electronic circuits, machines, industrial processes
DCDC conversion
Benefits of Power Electronics
l Energy saving l Cost and space saving l Reduced maintenance l Longer life l Low environmental impact
Sustainability Environmental
footprint Energy
Efficiency
Benefits of Power Electronics
Energy Efficiency
Availability Flexibility
Quality of life
l Better performance l Better control l Flexibility l Improved reliability
Power Electronics Applications
1 cm 1 W
Power Electronics Applications
200 m 2 GW
Power Electronics is Growing
Enabling technology throughout the energy supply chain
Primary energy extraction & transport
Energy conversion & concentration
Electricity 39%
Transport 21%
Other 40%
~16,000 TWh/annum global electricity
40% today growing to 60% by 2040 80% of this will be managed by power electronics
Power Electronics is Growing
Enabling technology throughout the energy supply chain
Energy transmission
and distribution
Energy delivery
IT 14%
Lighting 19%
HVAC 16%
Motion 51%
Heat
Work
~16,000 TWh/annum global electricity
80% of this will be managed by power electronics
The Market
l Power electronics is an essential technology in all future sustainable energy scenarios
l It is the only technology that can deliver efficient and flexible control of electrical energy
l share of electrical energy which will be controlled by power electronics is expected to increase from 40% in 2000 to 80% in 2015
l Global market for power electronics devices in 2007 was $9.8bn and is expected to reach $17.7bn by 2013 with a compound annual growth rate of 11.6%
l In 2007 power electronics contributed to another $1 trillion of sales in related hardware electronics
[1] “Power Electronics: Technologies and Global Markets” http://www.electronics.ca/reports/power_energy/utility_power_ele ctronics.html
Power electronics is an essential technology in all future sustainable energy scenarios It is the only technology that can deliver efficient and flexible control of electrical energy share of electrical energy which will be controlled by power electronics is expected to increase from 40% in
Global market for power electronics devices in 2007 was $9.8bn and is expected to reach $17.7bn by 2013 with a compound annual growth rate of 11.6% 1
In 2007 power electronics contributed to another $1 trillion of sales in related hardware electronics
[1] “Power Electronics: Technologies and Global Markets” http://www.electronics.ca/reports/power_energy/utility_power_ele
Growth areas for power electronics
l Power supplies: new concepts can improve overall efficiency by 2 4%
l Motor drives: use 5060% of all electrical energy consumed in the developed world: a potential reduction in energy consumption of 20 30% is achievable.
l Home appliances: electronic thermostats for refrigerators and freezers can yield 23% energy saving: an additional 20% can be saved by using power electronics to control compressor motors (with 3phase PMDC motors).
l Lighting: power electronics can improve the efficiency of fluorescent and HID ballasts by a minimum of 20%.
l Connection of renewable energy sources possible without power electronics.
l Future electricity networks will incorporate power electronics. l Automotive: electric and hybrid drive trains are only possible with efficient and intelligent power electronics.
l Aerospace: weight savings through power electronics will reduce fuel demand over the flight cycle.
Growth areas for power electronics
new concepts can improve overall efficiency by 2
60% of all electrical energy consumed in the developed world: a potential reduction in energy consumption of 20
electronic thermostats for refrigerators and freezers can yield 23% energy saving: an additional 20% can be saved by using power electronics to control compressor motors (with
power electronics can improve the efficiency of fluorescent and HID ballasts by a minimum of 20%.
renewable energy sources to power grids is not possible without power electronics.
will incorporate power electronics. electric and hybrid drive trains are only possible with
efficient and intelligent power electronics. weight savings through power electronics will reduce
fuel demand over the flight cycle.
Why Manufacture in the UK?
l UK based technology and manufacturing capability is currently relatively strong
l UK is internationally competitive across the whole supply chain
l Many systems are application specific, highly customised and tend to have a relatively high added value
l Suited to a technologically advanced manufacturing base and can absorb the relatively high UK labour costs
Why Manufacture in the UK?
UK based technology and manufacturing capability is currently relatively strong UK is internationally competitive across the whole
Many systems are application specific, highly customised and tend to have a relatively high
Suited to a technologically advanced manufacturing base and can absorb the relatively
Early History of Power Electronics
1880
Bridge rectifier (1896)
Mercury arc rectifier (1902)
Phase angle control (1903)
I d1
v L
i as1
i as2
i L
3 phase input
I d2
Cycloconverter (1922)
Thyratron (1927)
Selenium rectifier (1876)
Early History of Power Electronics
Thyratron (1927)
Ignitron (1933)
HVDC (1935)
Thyristor (1957)
Thyratron motor (1934)
1960
Silicon power diode (1954)
0.4kV, 0.08kA
1kV, 0.15kA
2.5kV, 0.5kA
2.5kV, 1.5kA
4kV, 3kA
0.6kV, 0.2kA
2.5kV, 0.6kA
4.5kV, 3kA
6kV, 6kA
1kV, 25A
0.5kV, 0.2kA
0.01
0.1
1
10
100
1960 1970 1980 1990
Year
Switc
hed Po
wer (M
VA)
Development of Power Semiconductor Devices
12kV, 1.5kA
2.5kV, 1.5kA
8kV, 4kA
4.5kV, 3kA
6kV, 6kA
1kV, 25A
0.5kV, 0.2kA
1kV, 0.3kA
1.2kV, 0.6kA
1.7kV, 1.2kA
3.3kV, 1.2kA
6.5kV 0.9kA
4.5kV, 2.1kA
4.5kV, 4kA
6kV, 6kA
1990 2000
ETT
LTT
GTO
IGBT
IEGT
GCT
Development of Power Semiconductor Devices
What’s in Today’s Power Electronic Systems?
S A+
S A
D A+
D A 600 V
C DC 20µF, 1000V
GDU A GDU B
DC+
DC
Passive components
Gate drives and control
semiconductor
What’s in Today’s Power Electronic
P A
P B
P C
Halfbridge sandwich (one per phase)
GDU C
Power semiconductor
module
Thermal management
Overview
l Introduction to Power Electronics
l Current Challenges for Power Electronics
l IeMRC Power Electronics Themes l Research Examples l Conclusions
Introduction to Power Electronics
Current Challenges for Power
IeMRC Power Electronics Themes
Challenges in Power Electronics
l Increased power densities l High reliability in extreme operating environments
l Lower electromagnetic emissions
l Modular turnkey systems l Higher levels of integration l Lower throughlife costs
Challenges in Power Electronics
Higher levels of integration
Structured collection of expert input at workshop
Initial workshop review of results
Roadmapping Roadmapping
Online review of roadmap
Challenges in Power Electronics: Road Mapping Exercise
Knowledge database built from results
Initial workshop review of results
Roadmapping Roadmapping Process Process
Challenges in Power Electronics: Road Mapping Exercise
Analysis
Product Area
Reliability and qualification
Packaging and integration
Thermal management
Materials Technologies
Efficiency
Simulation and design methods
Active devices Automotive power train 26 26 22 22 21 19 Renewable energy sources (grid interface and control) 22 21 18 19 23 19 Aircraft actuation 25 24 23 23 20 19 Aircraft power distribution 23 25 21 21 20 18 Aircraft generation 22 21 20 20 18 16 Marine propulsion 21 19 19 19 18 15 Automotive controls 21 21 18 16 16 17 Rail traction 21 20 18 19 16 16 High performance drives 21 18 20 20 16 16 Large industrial drives 21 18 16 16 13 14 Small drives for home appliances 17 15 14 13 16 16 Components: active 17 18 13 13 13 13 Aircraft engine controls 18 17 17 16 11 13 Power transmission and distribution infrastructure 14 15 11 13 12 11 Components: thermal management 13 14 13 11 11 10 Components: passive 11 13 11 11 9 6 Pulsed power 11 11 10 11 10 8 Other 1 1 1 1 1 1 Total Records 325 317 285 284 264 247
l Priority product areas l Priority technology areas l TRL analysis
Active devices
Power Quality
Control
Passive devices
Life Cycle
Business process
Health and usage management
Other 15 16 12 14 8 6 6 3 216 16 18 17 10 11 11 6 1 212 17 15 10 14 6 7 6 2 211 17 17 10 11 7 7 5 3 205 15 15 10 12 7 4 6 3 189 15 16 9 11 7 5 7 3 184 13 11 13 10 7 7 6 3 179 12 13 10 12 8 4 6 3 178 15 12 10 10 6 4 4 2 174 13 13 8 9 8 4 4 3 160 11 11 14 6 8 6 6 2 155 17 12 11 6 5 7 4 1 150 13 9 8 11 4 4 6 2 149 10 10 10 5 10 3 4 3 131 9 10 9 8 4 7 3 1 123 4 9 6 11 8 3 2 1 105 9 9 5 8 4 4 2 1 103 1 1 1 1 1 1 1 1 14 222 217 173 169 119 94 84 38 2838
0
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0.4
0.5
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0.7
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1
y2008 y2009 y2010 y2011 y2012 y2013 y2014 y2015 y2016 y2017
TRL 12 TRL 34
TRL 56 TRL 78 TRL 9
Priority Product Areas
l Many challenges apply to a large number of priority product areas
l Substantial potential for cross
Product area
Automotive power train Renewable energy sources (grid interface and control) Aircraft actuation Aircraft power distribution Aircraft generation Automotive controls Marine propulsion High performance drives Rail traction Large industrial drives
Priority Product Areas
Many challenges apply to a large number of priority
Substantial potential for crosssector activities
Proportion of challenges
58% Renewable energy sources (grid interface and control) 53%
56% 58% 52% 50% 47% 50% 47% 44%
Priority Technology Areas
l Many challenges identify same priority technology areas
l Technology areas are strongly interdependent
l Priorities are mainly underpinning technologies that can be applied across many product sectors
Technology area
Reliability and qualification Packaging and integration Thermal management Materials technologies Efficiency Simulation and design methods Active devices
Priority Technology Areas
Many challenges identify same priority technology areas
Technology areas are strongly interdependent
Priorities are mainly underpinning technologies that can be applied across many product sectors
Proportion of challenges
61% 65% 56% 55% 56% 44% 47%
The Power Density Challenge
l How far can we go? l Limiting factors:
• Losses (efficiency) • Cooling capability (heat transfer from surface)
• Energy storage requirements (filters etc.)
• Upper limit for “core” temperature
Converter volume
Core temperature (Tcore)
The Power Density Challenge
Cooling capability (heat transfer from
Energy storage requirements (filters
Upper limit for “core” temperature
Heat
Cooling
( ) 2
3
~
− a core eff
e
T T h P V η
The Reliability Challenge
l Automotive drive train, rail traction, aerospace, renewable generation interfaces etc. are subject to significant load and environmental cycling
l Desire for higher power density means temperatures and increased thermal cycling range – both tend to reduce reliability
l However… l Customers demand very high levels of unexpected failures are not acceptable
l Unscheduled maintenance expensive
The Reliability Challenge
Automotive drive train, rail traction, aerospace, renewable generation interfaces etc. are subject to significant load and environmental cycling Desire for higher power density means increased
increased thermal cycling range reduce reliability
Customers demand very high levels of availability, unexpected failures are not acceptable Unscheduled maintenance is time consuming and
Meeting the Challenge
S A+
S A
D A+
D A
GDU A
DC+
DC
P A
Reliability
Packaging & Integration
Prognostics & Health Management
Design Tools & Methodology
Component Technologies
Power Quality
Energy Efficiency
Mission Profile
Reliability/ Availability
Meeting the Challenge
Thermal Management
Packaging & Integration
Prognostics & Health Management
Design Tools & Methodology
Component Technologies
Weight
Volume
Mission Profile
Throughlife Cost
Power Electronics Integration
l Performance specifications for power electronics include electrical, reliability, cost and end targets
l Strong interactions between packaging, thermal performance and reliability themes means ALL aspects of power electronics technology must be addressed concurrently
l An integrated approach is essential in the design and manufacture of future power electronic systems
Power Electronics Integration
Performance specifications for power electronics include electrical, reliability, cost and endoflife
Strong interactions between packaging, thermal performance and reliability themes means ALL aspects of power electronics technology must be
An integrated approach is essential in the design and manufacture of future power electronic
Overview
l Introduction to Power Electronics l Current Challenges for Power Electronics
l IeMRC Power Electronics Themes l Research Examples l Conclusions
Introduction to Power Electronics Current Challenges for Power Electronics
IeMRC Power Electronics Themes
IeMRC Projects in Power Electronics
Aim: Enhance competitiveness of the UK power electronics industry through world into design and manufacturing
Product Area
Reliability and qualification
Packaging and integration
Thermal management
Materials Technologies
Efficiency
Simulation and design methods
Active devices
Power Quality
Control
Passive devices
Life Cycle
Business process
Health and usage management
Other Automotive power train 26 26 22 22 21 19 15 16 12 14 8 6 6 3 216 Renewable energy sources (grid interface and control) 22 21 18 19 23 19 16 18 17 10 11 11 6 1 212 Aircraft actuation 25 24 23 23 20 19 17 15 10 14 6 7 6 2 211 Aircraft power distribution 23 25 21 21 20 18 17 17 10 11 7 7 5 3 205 Aircraft generation 22 21 20 20 18 16 15 15 10 12 7 4 6 3 189 Marine propulsion 21 19 19 19 18 15 15 16 9 11 7 5 7 3 184 Automotive controls 21 21 18 16 16 17 13 11 13 10 7 7 6 3 179 Rail traction 21 20 18 19 16 16 12 13 10 12 8 4 6 3 178 High performance drives 21 18 20 20 16 16 15 12 10 10 6 4 4 2 174 Large industrial drives 21 18 16 16 13 14 13 13 8 9 8 4 4 3 160 Small drives for home appliances 17 15 14 13 16 16 11 11 14 6 8 6 6 2 155 Components: active 17 18 13 13 13 13 17 12 11 6 5 7 4 1 150 Aircraft engine controls 18 17 17 16 11 13 13 9 8 11 4 4 6 2 149 Power transmission and distribution infrastructure 14 15 11 13 12 11 10 10 10 5 10 3 4 3 131 Components: thermal management 13 14 13 11 11 10 9 10 9 8 4 7 3 1 123 Components: passive 11 13 11 11 9 6 4 9 6 11 8 3 2 1 105 Pulsed power 11 11 10 11 10 8 9 9 5 8 4 4 2 1 103 Other 1 1 1 1 1 1 1 1 1 1 1 1 1 1 14 Total Records 325 317 285 284 264 247 222 217 173 169 119 94 84 38 2838
Technology Drivers
Market/customer Aspirations
Road mapping
IeMRC Projects in Power Electronics
Enhance competitiveness of the UK power electronics industry through worldleading research
manufacturing
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0.3
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0.5
0.6
0.7
0.8
0.9
1
y2008 y2009 y2010 y2011 y2012 y2013 y2014 y2015 y2016 y2017
TRL 12 TRL 34 TRL 56 TRL 78 TRL 9
Technology Limiters
Technology Opportunities
Research & Development Requirements
A JoinedUp Approach
Reliability
Packaging & Integration
Prognostics & Health Management
Design Tools & Methodology
Experimental: testing, methodology, qualification Physics of failure models Model validation
Research & Technology Core
Up Approach
Thermal Management
Prognostics & Health
Design Tools &
New technologies: air and liquid cooling System optimisation Realtime models
New technologies: materials, assembly methods System optimisation Integration of passives SiC & other WBG
Technology Road mapping
Technology Demonstration Projects TRL 36
TRL 14
IeMRC Power Electronics Cluster
Design for qualification
Flagship Project
TSBfunded programmes in power electronics (TULIP & PEATE)
Power electronics roadmap
Other IeMRC projects on Advanced Capacitors, Prognostics & Diagnostics
EUfunded aerospace research within MOET and Clean Sky JTI
Reliability and Physics of Failure
IeMRC SiP Design
EPSRC Grand Challenge:
3D Mintegration
IeMRC Power Electronics Cluster
Design for qualification
Advanced packaging
TSBfunded research into improved bonding technology (IMPECT & NEWTON)
EPSRCfunded research in SiC: Platform grant & responsive mode
electronics roadmap
TSBfunded research into modelling of power modules (MPM)
EPSRC Grand Challenge: D Mintegration
Cluster approach maximises gearing and mutual coupling between projects
Academic Partners
power electronics, module design and failure analysis, packaging, EMC, thermal management
partial discharge effects
Materials support, interconnect, capacitors
component technologies, power electronics
Academic Partners
physicsoffailure reliability predictions, multiphysics modelling and numerical optimisation, design tools
partial discharge highpermittivity dielectrics and Silicon Carbide device fabrication
metallography and microscopy
component technologies,
Industrial Partners
l Areva T&D l Corac Group l Dynex Semiconductor l Flomerics (Mentor Graphics) l Hispano Suiza (Safran) l Goodrich l GE Aviation l International Rectifier l Morgan Technical Ceramics l RollsRoyce l Semelab (TT Electronics) l SRDrives l TRW Automotive l Zodiac
Industrial Partners
Flomerics (Mentor Graphics)
Morgan Technical Ceramics
Overview
l Introduction to Power Electronics l Current Challenges for Power Electronics l IeMRC Power Electronics Themes
l Research Examples l Conclusions
Introduction to Power Electronics Current Challenges for Power Electronics IeMRC Power Electronics Themes
Research Examples
IeMRC Flagship Project
l Aim: Enhance competitiveness of the UK power electronics industry through improvements to the design and manufacturing
l Key target is technologies and techniques to improve power module performance
l Total IeMRC funding £811 k, 5 directly academic partners, 11 industrial partners
l Fundamental research that underpins many activities
l Total of “geared” funding exceeds £8 M
IeMRC Flagship Project
Aim: Enhance competitiveness of the UK power electronics industry through improvements to the
manufacturing capability Key target is technologies and techniques to improve power module performance Total IeMRC funding £811 k, 5 directlyfunded academic partners, 11 industrial partners Fundamental research that underpins many
Total of “geared” funding exceeds £8 M
Flagship Themes
l Road mapping: A UK centred power electronics road map highlighting the research priorities for IeMRC/EPSRC and TSB support was published in 2007
l Technology watch: The project maintains a “technology watch” on emerging technologies for power electronic modules and associated thermal management systems
l Reliability and physics of failure • Combined Modelling and Accelerated Life Testing carried out by
academic and industrial partners • Identify Root Cause (Physics) of Failures • Develop Physics of Failure models • Apply validated models:
» to assess design options (MPM project) » prognostics and health management (IeMRC prognostics and diagnostics
project)
l Advanced packaging: investigate the feasibility of a range of advanced power electronic module manufacturing technologies: • Capacitor technology • Thermal management technology • Novel Interconnect and die attach • Enhanced wire bonding
Flagship Themes
A UK centred power electronics road map highlighting the research priorities for IeMRC/EPSRC and TSB
The project maintains a “technology watch” on emerging technologies for power electronic modules and associated thermal management systems Reliability and physics of failure
Combined Modelling and Accelerated Life Testing carried out by academic and industrial partners Identify Root Cause (Physics) of Failures Develop Physics of Failure models
to assess design options (MPM project) prognostics and health management (IeMRC prognostics and diagnostics
investigate the feasibility of a range of advanced power electronic module manufacturing technologies:
Thermal management technology Novel Interconnect and die attach
Power Electronic Modules
l Principal functional element of power electronics l Physical containment for one or more basic component building blocks e.g. semiconductor dies, resistors, etc.
l Can include control and protection functions l Protection from environment e.g. ingress of liquids, dust etc.
l Circuit interconnections (internal and external) l Electromagnetic management l Thermal Management
Power Electronic Modules
Principal functional element of power electronics Physical containment for one or more basic component building blocks e.g. semiconductor
Can include control and protection functions Protection from environment e.g. ingress of
Circuit interconnections (internal and external) Electromagnetic management – EMC issues
Anatomy of Typical Module and Heatsink
Leadout interconnect Bond wire Encapsulation Housing
Thermal stack has 9 layers, 8 interfaces!
Heatsink Thermal Grease Copper baseplate
Anatomy of Typical Module and
Solder Direct bonded copper Ceramic Direct bonded copper Solder Die
Thermal stack has 9 layers, 8 interfaces!
Reliability Limitations
CTE mismatch causes fatigue failure (debonding) at heel
CTE mismatch causes fatigue failure at interfaces
Repeated heating and cooling of assembly leads to repetitive mechanical stress and eventual failure
Reliability Limitations
Copper baseplate Solder Direct bonded copper Ceramic Direct bonded copper Solder Die Bond wire
Repeated heating and cooling of assembly leads to repetitive mechanical stress and eventual failure
l Combined Modelling and Accelerated Life Testing
l Identify Root Cause (Physics) of Failures
l Develop Physics of Failure models l Apply in design process and health management
Investigating Reliability Limitations
Identify Root Cause (Physics) of
Develop Physics of Failure models Apply in design process and health
Investigating Reliability Limitations
0.1
1.0
10.0
100.0
1000.0
10000.0
10 100 1000
delta T (K)
Thou
sand
s of Cycles
0
500
1000
1500
2000
2500
3000
3500
4000
numbe
r of c
ycles to fa
ilure
1 2 3 4 5 6 7 8 9 10 11 substrate tile number
60 to 150 C airtoair
60 to 150 C
No failure
K
ref
M
ref ref T
T T T N N
− −
∆ ∆
= 1 1
1
Thermal Management Options
l Target overall reductions in weight and volume for liquidcooled systems
l Comparison of cooler options: • Conventional baseplate and separate cooler • Integrated baseplate cooler • Direct cooler (no baseplate)
Baseplate (13mm)
Cold plate Integrated base
9 layers 8 interfaces
7 layers 6 interfaces
Thermal Management Options
Target overall reductions in weight and volume cooled systems
Comparison of cooler options: plate and separate cooler
plate cooler plate)
plate cooler Direct substrate cooler
7 layers 6 interfaces
5 layers 4 interfaces
1. Jet impingement 2. Heat transfer 3. Mixing of working fluid
1
Heat from Electronics
l
l
Impingement Cooling
3
Heat from Electronics
2
Jet impingement reduces thermal gradient and thermal resistance Heat transfer coefficient increases (>30 kW/(m 2 K) achieved)
Impingement Cooling
Impingement Cooling
l Prototype coolers manufactured in Stainless Steel (174 PH SS) using the Direct Metal Laser Sintering (DMLS) rapid prototyping process
l Grooves machined into the baseplate to improve sealing between adjacent cooling cells
Direct cooling of baseplate
Impingement Cooling
Prototype coolers manufactured in Stainless ) using the Direct Metal Laser
) rapid prototyping process Grooves machined into the baseplate to improve sealing between adjacent cooling cells
Direct cooling of DBC substrates
Thermal Impedance
l Measure of the ability of the cooler to cope with step inputs and thermal transients
l Cooling curves at a coolant flow rate of 4 litres/minute
Thermal Step Response IGBT Die Temperature
0.001 0.01 0.1 Time (seconds)
Die to
Coo
lant Tem
perature
Differen
ce
COLDPLATE BASEPLATE
Thermal Impedance
Measure of the ability of the cooler to cope with step inputs and
Cooling curves at a coolant flow rate of 4 litres/minute
Thermal Step Response IGBT Die Temperature
0
5
10
15
20
25
30
35
40
45
50
1 10 100 Time (seconds)
BASEPLATE SUBSTRATE
l Power required to pass coolant fluid through the cooler l Data shown is for flow rates up to 4 litres/min
Die To Coolant Temperature Difference vs Pumping Power
0.00 0.01 0.10
Pumping Power Required (Watts)
Die to
Coo
lant Tem
perature
Differen
ce (K
)
SUBSTRATE BASEPLATE
Pumping Power
Power required to pass coolant fluid through the cooler Data shown is for flow rates up to 4 litres/min
Die To Coolant Temperature Difference vs Pumping Power
30
40
50
60
70
80
90
100
1.00 10.00 100.00
Pumping Power Required (Watts)
BASEPLATE COLDPLATE
Pumping Power
Conclusions
l Power Electronics: • Underpins future transport and electricity supply networks • Is a current and future growth area • Is an area of UK strength
l Key challenges for power electronics include: • Increased power densities • Lower electromagnetic emissions • High reliability in extreme operating environments • Modular turnkey systems • Higher levels of integration • Lower capital and maintenance costs
l IeMRC supports research as part of a coordinated programme addressing the key challenges
Underpins future transport and electricity supply networks Is a current and future growth area Is an area of UK strength
Key challenges for power electronics include: Increased power densities Lower electromagnetic emissions High reliability in extreme operating environments
key systems Higher levels of integration Lower capital and maintenance costs
IeMRC supports research as part of a coordinated programme addressing the key challenges
