Kinetis mini MCUs are our smallest, ARM® Powered® devices, being shipped in a variety of wafer-level chip-scale packages (WLCSPs).

Driving innovation with tiny, industry-leading packages

TARGET APPLICATIONS

} Wearable consumer electronics

} Healthcare management and monitoring

} Mobile accessories

These MCUs are offered in industry-leading miniature packages, providing massive design potential for today’s embedded designers. Our WLCSP technology development has enabled smaller packages, with greater functionality, than previously seen in the market.

The Kinetis mini portfolio, which to-date has shipped in the millions, now includes both our smallest and thinnest Kinetis microcontrollers (MCUs).

At just 0.34 mm height – half that of a credit card – our ultra-thin K22 MCU, with a 120 MHz ARM® Cortex®-M4 core, 512KB Flash and 128KB SRAM, balances high peripheral integration and low static and dynamic power. This ultra-thin, low-power MCU further enables customers to reduce the size of their embedded applications.

TECHNICAL FEATURES

The Kinetis mini portfolio of products are assembled at the wafer level, creating the smallest form-factor package possible. They require no wire bonds or substrate interposers and use solder balls, directly attached to the silicon, to make the PCB connection.

Please refer to our Wafer-level Chip-scale Package (AN3846) Application Note on www.nxp.com for more detailed technical information.

SOFTWARE AND TOOLS

Integrated development environments (IDE)

} Kinetis Design Studio IDE

} IAR Embedded Workbench, Keil® MDK, Atollic, GCC

} Online enablement with ARM mbed™ development platform

Kinetis Mini MCUs Wafer-Level Chip-Scale Package Portfolio

KINETIS WAFER-LEVEL CHIP-SCALE MCUs

Actual Size120WLCSP5.29 mm x 5.28 mm

Actual Size142WLCSP4.83 mm x 5.58 mm

Actual Size143WLCSP6.44 mm x 5.55 mm

Actual Size169WLCSP5.63 mm x 5.49 mm

Kinetis WLCSP Family Portrait

Actual Size64WLCSP3.35 mm x3.32 mm

Actual Size20WLCSP1.99 mm x1.6 mm

Actual Size20WLCSP1.99 mm x1.94 mm

Actual Size36WLCSP2.37 mm x2.46 mm

Actual Size80WLCSP4.12 mm x3.55 mm

Actual Size35WLCSP2.53 mm x2.98 mm

Actual Size49WLCSP2.92 mm x3.14 mm

ARM® CORTEX®-M0+-BASED KINETIS MINI MCUs

Family Part Number Product StatusMemory

FLASH/SRAMTerminal

CountDimension (mm) Height (mm)

KL02 - 48 MHz, Entry-level MKL02Z32CAF4R Production 32 KB/4 KB 20 2.0 x 1.9 0.60

KL03 - 48 MHz, Entry-level MKL03Z32CAF4R Production 32 KB/2 KB 20 2.0 x 1.6 0.60

KL15 - 48 MHz, Baseline MKL15Z128CAD4R Production 128 KB/16 KB 35 3.0 x 2.5 0.60

KL26 - 48 MHz, USB MKL26Z128CAL4R Production 128 KB/16 KB 36 2.4 x 2.5* 0.60

Kinetis software development kit (SDK)

} Extensive suite of robust HAL, peripheral drivers, stacks and middleware, with supporting software examples

} Operating system abstraction (OSA) for proprietary MQX™ RTOS, FreeRTOS, and Micrium uC/OS kernels and baremetal (no RTOS) applications

} Complimentary Processor Expert software configuration tool providing I/O allocation, pin initialization and configuration of hardware abstraction and peripheral drivers

} Full ARM ecosystem support

TOWER SYSTEM DEVELOPMENT PLATFORMS

The Tower System is a modular, open-sourced development platform with reusable peripheral modules, offering connectivity, analog, graphics LCD and motor control functionality. Featuring more than 50 modules, the Tower System provides designers with building blocks for their MCU development.

} Tower plug-in (TWRPI) socket

} OpenSDA debug circuit with virtual serial port

} Tower System elevator modules and Tower System peripheral modules available for additional system capability

Learn more at www.nxp.com/Tower

FREEDOM DEVELOPMENT PLATFORMS

The Freedom development platform is a small, low-power, cost-effective evaluation and development system. The platform offers an easy-to-use mass-storage device mode flash programmer, a virtual serial port and classic programming and run control capabilities.

} Designed in an industry-standard compact form factor, with select boards compatible with Arduino R3, as well as third-party expansion boards.

} Easy access to the MCU I/O pins

} Integrated open standard serial and debug interface (OpenSDA)

Learn more at www.nxp.com/Freedom

DID YOU KNOW?

} At 0.34 mm height, the ultra-thin Kinetis K22 MCU is less than half the height of a credit card

} 19,000 Kinetis mini MCUs fit on a piece of paper (U.S. letter size)

} 23,000 Kinetis mini MCUs fill a golf ball

} 3.2 million Kinetis mini MCUs fill a soccer ball

© 2013–2015 Freescale Semiconductor, Inc.

Kinetis, Processor Expert and Tower are trademarks of Freescale Semiconductor, Inc., Reg.U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM, ARM Powered, Cortex and Keil are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. mbed is a trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

Document Number: KINMINIMCUFS REV 5

www.nxp.com/Kinetisminis

ARM CORTEX-M4-BASED KINETIS MINI MCUs

Family Part Number Product StatusMemory

FLASH/SRAMTerminal Count

Dimension (mm) Height (mm)

K10 – 100 MHz MK10DN512ZAB10R Production 512 KB/128 KB 120 5.3 x 5.3 0.60

K22 – 100 MHz, USB MK22FN128CAK10R Sampling 128 KB/24 KB 49 2.9 x 3.1 0.60

K22 – 120 MHz, USB MK22FN128CAH12R Production 128 KB/48 KB 64 3.4 x 3.3 0.60

K22 – 120 MHz, USB MK22FN256CAH12R Production 256 KB/48 KB 64 3.4 x 3.3 0.60

K22 – 120 MHz, USB MK22FN256CAP12R Production 256 KB/128 KB 80 4.1 x 3.6 0.60

K22 – 120 MHz, USB MK22FN512CAP12R Production 512 KB/128 KB 80 4.1 x 3.6 0.60

K22 – 120 MHz, USB MK22FN512CBP12R Production 512 KB/128 KB 80 4.1 x 3.6 0.34

K20 – 100 MHz, USB MK20DN512ZCAB10R Production 512 KB/128 KB 120 5.3 x 5.3 0.60

K24 – 120 MHz, USB MK24FN1M0CAJ12R Production 1 MB/256 KB 142 4.8 x 5.6 0.60

K26 – 180 MHz, HS USB MK26FN2M0CAC18R Production 2 MB/256 KB 169 5.6 x 5.5 0.60

K60 – 100 MHz, Ethernet, USB MK60DN512ZCAB10R Production 512 KB/128 KB 120 5.3 x 5.3 0.60

K61 – 120 MHz, Security, Ethernet, USB MK61FN1M0CAA12R Production 1 MB/128 KB 143 6.4 x 5.6 0.60

K64 – 120 MHz, Ethernet, USB MK64FN1M0CAJ12R Production 1 MB/256 KB 142 4.8 x 5.6 0.60

K65 – 180 MHz, Security, Ethernet, HS USB MK65FX1M0CAC18R Production 1.25 MB/256 KB 169 5.6 x 5.5 0.60

K65 – 180 MHz, Security, Ethernet, HS USB MK65FN2M0CAC18R Production 2 MB/256 KB 169 5.6 x 5.5 0.60

Note: Information in the above table is for reference only. Please refer to applicable technical documentation for official product features and dimensions. For more information about products currently being sampled, reference our Package Your Way program for Kinetis MCUs at www.nxp.com/KPYW.

* WLCSP pitch is 0.35mm, versus the standard WLCSP pitch of 0.40mm