MC78LC00 Series Voltage Regulator

Semiconductor Components Industries, LLC, 2009January, 2009 Rev. 10

1 Publication Order Number:MC78LC00/D

MC78LC00 Series

Micropower VoltageRegulator

The MC78LC00 series of fixed output low dropout linear regulatorsare designed for handheld communication equipment and portablebattery powered applications which require low quiescent current. TheMC78LC00 series features an ultralow quiescent current of 1.1 A.Each device contains a voltage reference unit, an error amplifier, aPMOS power transistor, and resistors for setting output voltage.

The MC78LC00 has been designed to be used with low cost ceramiccapacitors and requires a minimum output capacitor of 0.1 F. Thedevice is housed in the microminiature Thin SOT235 surface mountpackage and SOT89, 3 pin. Standard voltage versions are 1.5, 1.8,2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in100 mV steps.

Features

Low Quiescent Current of 1.1 A Typical

Excellent Line and Load Regulation

Maximum Operating Voltage of 12 V

Low Output Voltage Option

High Accuracy Output Voltage of 2.5%

Industrial Temperature Range of 40C to 85C

Two Surface Mount Packages (SOT89, 3 Pin, or SOT23, 5 Pin)

These are PbFree Devices

Typical Applications

Battery Powered Instruments

HandHeld Instruments

Camcorders and Cameras

Figure 1. Representative Block Diagram

2 3

1

This device contains 8 active transistors.

Vin

GND

VO

Vref

SOT89H SUFFIX

CASE 1213

1

TAB

(Tab is connected to Pin 2)

1

2

3

GND

Vin

Vout

Tab

(Top View)

See detailed ordering and shipping information in the packagedimensions section on page 10 of this data sheet.

ORDERING INFORMATION

TSOP5NTR SUFFIX

CASE 483

1

5

MARKING DIAGRAMS ANDPIN CONNECTIONS

1

3 N/C

GND

2Vin

Vout 4

N/C5

(Top View)

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XXX= Specific Device CodeA = Assembly LocationY = YearW = Work Week = PbFree Package

(Note: Microdot may be in either location)

XX

X A

YW

XX

AY

W

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PIN FUNCTION DESCRIPTION

Pin No.

Pin Name

Description

1

GND

Power supply ground

2

Vin

Positive power supply input voltage

3

Vout

Regulated Output

4

N/C

No Internal Connection

5

N/C

No Internal Connection

MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage

Vin

12

V

Output Voltage

Vout

0.3 to Vin +0.3

V

Power Dissipation and Thermal CharacteristicsCase 48301 (Thin SOT235) NTR SuffixPower Dissipation @ TA = 85CThermal Resistance, JunctiontoAmbientCase 1213 (SOT89) H SuffixPower Dissipation @ TA = 25CThermal Resistance, JunctiontoAmbient

PDRJA

PDRJA

140280

900111

mWC/W

mWC/W

Operating Junction Temperature

TJ

+125

C

Operating Ambient Temperature

TA

40 to +85

C

Storage Temperature

Tstg

55 to +150

C

Lead Soldering Temperature @ 260C

Tsolder

10

sec

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.

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ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 F, Cout = 1.0 F, TJ = 25C, unless otherwise noted.) (Note 5)NTR SUFFIX

Characteristic Symbol Min Typ Max Unit

Output Voltage (TA = 25C, Iout = 1.0 mA)1.5 V1.8 V2.5 V2.7 V2.8 V3.0 V3.3 V4.0 V5.0 V

Vout1.4551.7462.4252.6462.7442.943.2343.94.90

1.51.82.52.72.83.03.34.05.0

1.5451.8542.5752.7542.8563.063.3664.15.10

V

Output Voltage (TA = 40C to 85C)1.5 V1.8 V2.5 V2.7 V2.8 V3.0 V3.3 V4.0 V5.0 V

Vout1.4551.7462.4252.6192.7162.9103.2013.94.90

1.51.82.52.72.83.03.34.05.0

1.5451.8542.5752.7812.8843.093.3994.15.10

V

Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA) Regline 0.05 0.2 %/V

Load Regulation (Iout = 1.0 mA to 10 mA) Regload 40 60 mV

Output Current (Note 6)1.5 V, 1.8 V (Vin = 4.0 V)2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V)3.3 V (Vin = 6.0 V)4.0 V (Vin = 7.0 V)5.0 V (Vin = 8.0 V)

Iout3550508080

50808080100

mA

Dropout Voltage (Iout = 1.0 mA, Measured at Vout 3.0%)1.5 V1.6 V3.2 V3.3 V3.9 V4.0 V5.0 V

VinVout

35303030

70605338

mV

Quiescent Current (Iout = 1.0 mA to IO(nom.)) IQ 1.1 3.6 A

Output Voltage Temperature Coefficient Tc 100 ppm/C

Output Noise Voltage (f = 1.0 kHz to 100 kHz) Vn 89 Vrms

1. This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MILSTD883, Method 3015Machine Model Method 200 V

2. Latch up capability (85C) 100 mA3. Maximum package power dissipation limits must be observed.

PD TJ(max) TA

RJA4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.6. Output Current is measured when Vout = VO1 3% where VO1 = Vout at Iout = 0 mA.

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ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 F, Cout = 1.0 F, TJ = 25C, unless otherwise noted.) (Note 11)HT SUFFIX

Characteristic Symbol Min Typ Max Unit

Output Voltage30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 5.0 V)40HT1 Suffix (Vin = 6.0 V)50HT1 Suffix (Vin = 7.0 V)

2.9503.2183.9004.875

3.03.34.05.0

3.0753.3824.1005.125

V

Line RegulationVin = [VO + 1.0] V to 10 V, IO = 1.0 mA

Regline

0.05

0.2

%/V

Load Regulation (IO = 1.0 to 10 mA)30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 6.0 V)40HT1 Suffix (Vin = 7.0 V)50HT1 Suffix (Vin = 8.0 V)

Regload

40405060

60607090

mV

Output Current (Note 12)30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 6.0 V)40HT1 Suffix (Vin = 7.0 V)50HT1 Suffix (Vin = 8.0 V)

IO

35354555

50506580

mA

Dropout Voltage30HT1 Suffix (IO = 1.0 mA)33HT1 Suffix (IO = 1.0 mA)40HT1 Suffix (IO = 1.0 mA)50HT1 Suffix (IO = 1.0 mA)

Vin VO

40352525

60533838

mV

Quiescent Current30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 5.0 V)40HT1 Suffix (Vin = 6.0 V)50HT1 Suffix (Vin = 7.0 V)

ICC

1.11.11.21.3

3.33.33.63.9

A

Output Voltage Temperature Coefficient

TC

100

ppm/C

7. This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MILSTD883, Method 3015Machine Model Method 200 V

8. Latch up capability (85C) 100 mA9. Maximum package power dissipation limits must be observed.

PD TJ(max) TA

RJA10.Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.12.Output Current is measured when Vout = VO1 3% where VO1 = Vout at Iout = 0 mA.

DEFINITIONS

Load RegulationThe change in output voltage for a change in output current

at a constant temperature.

Dropout VoltageThe input/output differential at which the regulator output

no longer maintains regulation against further reductions ininput voltage. Measured when the output drops 3% below itsnominal. The junction temperature, load current, andminimum input supply requirements affect the dropout level.

Maximum Power DissipationThe maximum total dissipation for which the regulator will

operate within its specifications.

Quiescent CurrentThe quiescent current is the current which flows through the

ground when the LDO operates without a load on its output:internal IC operation, bias, etc. When the LDO becomesloaded, this term is called the Ground current. It is actually the

difference between the input current (measured through theLDO input pin) and the output current.

Line RegulationThe change in output voltage for a change in input voltage.

The measurement is made under conditions of low dissipationor by using pulse technique such that the average chiptemperature is not significantly affected.

Line Transient ResponseTypical over and undershoot response when input voltage is

excited with a given slope.

Maximum Package Power DissipationThe maximum power package dissipation is the power

dissipation level at which the junction temperature reaches itsmaximum operating value, i.e. 125C. Depending on theambient power dissipation and thus the maximum availableoutput current.

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Vin, Input Voltage (V)

2.5

3.2

TA = 25C

IO = 10 mA

3

2.8

2.6

2.4

2.22.7 3.52.9 3.1 3.3

VO

, OU

TP

UT

VO

LTA

GE

(V

)

Figure 2. Output Voltage versus Input Voltage

IO = 5 mA

2.3

2.5

2.7

2.9

3.1

IO = 1 mA

NTR Series

2.5

3.2

Figure 3. Output Voltage versus Input Voltage

TA = 25C

IO = 1.0 mA

IO = 5.0 mA

IO = 10 mA

3.0

2.8

2.6

2.4

2.22.7 3.52.9 3.1 3.3

MC78LC30HT1

2.95

2.85

3

2.8

2.9

2.6

3.05

IO, Output Current (mA)

VO

, OU

TP

UT

VO

LTA

GE

(V

)

Figure 4. Output Voltage versus Output Current

0 806040 10020 120

25C

80C

40C

2.75

2.7

2.65

NTR Series

0

3.2


Figure 5. Output Voltage versus Output Current

TA = 80C

TA = 30C

TA = 25C

3.1

3.0

2.9

2.8

2.7

020 40 60 80 100 120

MC78LC30HT1

0

2

1.8

1.6

1.4

403020

1.2

1

0.8

0.2

010 50


Figure 6. Dropout Voltage versus Output Current

Vin

V

O, D

RO

PO

UT

VO

LTA

GE

(V

)

MC78LC30NTRTA = 25C

0.6

0.4

0

2.0

Figure 7. Dropout Voltage versus Output Current

1.6

1.2

0.8

0.4

010 20 30 40 50

MC78LC30HT1TA = 25C

VO

, OU

TP

UT

VO

LTA

GE

(V

)V

O, O

UT

PU

T V

OLT

AG

E (

V)


Vin

V

O, D

RO

PO

UT

VO

LTA

GE

(V

)


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2.98

TA, Ambient Temperature (C)

VO

, OU

TP

UT

VO

LTA

GE

(V

)

Figure 8. Output Voltage versus Temperature

40 40 6020020 802.9

3.02

2.94

3.06

3.1

MC78LC30NTRVin = 4.0 VIO = 10 mA

40

3.10

Figure 9. Output Voltage versus Temperature

Vin = 5.0 VIO = 10 mA

3.06

3.02

2.98

2.94

2.9020 0 20 40 60 80

MC78LC30HT1

1.4

1.3

1.1

1.2

1

0.9

0.8


Figure 10. Quiescent Current versus Input Voltage

I Q, Q

UIE

SC

EN

T C

UR

RE

NT

(A

)

3 7654 8 9 12

MC78LC30NTRTA = 25CIO = 0 mA

10 11 3.0

Figure 11. Quiescent Current versus Input Voltage

TA = 25C1.4

1.3

1.2

1.1

1.0

0.9

0.84.0 5.0 6.0 7.0 8.0 9.0 10

MC78LC30HT1

0.75

0.5

1

1.25

1.5

1.75


I Q, Q

UIE

SC

EN

T C

UR

RE

NT

(A

)

20 6040200 80

Figure 12. Quiescent Current versus Temperature

MC78LC30NTRVin = 4.0 VIO = 0 mA

40

Figure 13. Quiescent Current versus Temperature

Vin = 5.0 V1.2

1.1

1.0

0.9

0.8

0.7

0.620 0 20 40 60 80

MC78LC30HT1


VO

, OU

TP

UT

VO

LTA

GE

(V

)


I Q, Q

UIE

SC

EN

T C

UR

RE

NT

(A

)


I Q, Q

UIE

SC

EN

T C

UR

RE

NT

(A

)

MC78LC00 Series

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0.0

0.7

5.0

0.6

4.01.0

Vin

V

out,

DR

OP

OU

T V

OLT

AG

E (

V)

0.5

Figure 14. Dropout Voltage versus Set Output Voltage

0.8

VO, Set Output Voltage (V)

2.0 3.0 6.00

0.4

0.3

0.2

0.1

NTR Series

0

0.8

Figure 15. Dropout Voltage versusSet Output Voltage

IO = 10 mA

IO = 1.0 mA

0.7

0.6

0.5

0.4

0.3

0.2

0.1

01.0 2.0 3.0 4.0 5.0 6.0

HT1 Series

4.0

200

5.0

100

300

300

6.0

Time (mS)

Figure 16. Line Transient

Inpu

t Vol

tage

(V

)

0 2.0 2.51.51.00.5

Vin = 4.5 V to 5.5 VVout = 3.0 V

100

200

0

Out

put V

olta

geD

evia

tion

(mV

) RL = 3 kCout = 0.1 F

NTR Series

INP

UT

VO

LTA

GE

/OU

TP

UT

VO

LTA

GE

(V

)

0

8.0

t, Time (ms)

CO = 0.1 FIO = 1.0 mA

Figure 17. Line Transient Response

Input Voltage

Output Voltage

7.5

7.0

6.5

6.0

5.5

5.0

4.5

4.02.0 4.0 6.0

HT1 Series

0 2.01.51.00.5 2.5


Figure 18. Output Voltage versus Input Voltage Figure 19. Ground Current versus Input Voltage

Vou

t, O

UT

PU

T V

OLT

AG

E (

V)

3.5

3.0

2.5

2.0

0.5

0

1.5

1.0

TA = 25C

IO = 50 A

100 A

200 A

0 2.01.51.00.5 2.5


I g G

RO

UN

D C

UR

RE

NT

(A

) TA = 25CIO = 0 mA

50 A100 A

200 A

1.5

1.0

0.8

0.2

0

0.6

0.4

50 A

200 A

NTR Series NTR Series

Vin

V

out,

DR

OP

OU

T V

OLT

AG

E (

V)

VO, Set Output Voltage (V)

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APPLICATIONS INFORMATION

A typical application circuit for the MC78LC00 series isshown in Figure 20.

Input Decoupling (C1)A 0.1 F capacitor either ceramic or tantalum is

recommended and should be connected close to theMC78LC00 package. Higher values and lower ESR willimprove the overall line transient response.

Output Decoupling (C2)The MC78LC00 is a stable component and does not

require any specific Equivalent Series Resistance (ESR) ora minimum output current. Capacitors exhibiting ESRsranging from a few m up to 3.0 can thus safely be used.The minimum decoupling value is 0.1 F and can beaugmented to fulfill stringent load transient requirements.The regulator accepts ceramic chip capacitors as well astantalum devices. Larger values improve noise rejection andload regulation transient response.

HintsPlease be sure the Vin and GND lines are sufficiently

wide. When the impedance of these lines is high, there is achance to pick up noise or cause the regulator tomalfunction.

Set external components, especially the output capacitor,as close as possible to the circuit, and make leads as short aspossible.

ThermalAs power across the MC78LC00 increases, it might

become necessary to provide some thermal relief. Themaximum power dissipation supported by the device isdependent upon board design and layout. Mounting padconfiguration on the PCB, the board material, and also theambient temperature effect the rate of temperature rise forthe part. This is stating that when the MC78LC00 has goodthermal conductivity through the PCB, the junctiontemperature will be relatively low with high powerdissipation applications.

The maximum dissipation the package can handle isgiven by:

PD TJ(max) TA

RJAIf junction temperature is not allowed above the

maximum 125C, then the MC78LC00NTR can dissipateup to 357 mW @ 25C.

The power dissipated by the MC78LC00NTR can becalculated from the following equation:

Ptot Vin * Ignd (Iout) [Vin Vout] * Ioutor

VinMAX Ptot Vout * Iout

Ignd Iout

If an 80 mA output current is needed then the groundcurrent from the data sheet is 1.1 A. For anMC78LC30NTR (3.0 V), the maximum input voltage willthen be 7.4 V.

VoutC2

+

C1

+

Battery orUnregulated

Voltage

Figure 20. Basic Application Circuit for NTR Suffixes

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Figure 21. Current Boost Circuit

2 3VO

GND

Vin

GND

10.1 F0.1 F

MC78LC00

MJD32C

100

0.033 F

Figure 22. Adjustable VO

VOVin

ICC

C2

C1

MC78LC00

R1

GND

R2

2 3

1

Figure 23. Current Boost Circuit withOvercurrent Limit Circuit

VO

GND

Vin

GND

0.1 F0.1 F

MC78LC00

MJD32CQ1

R1

R2

Q2

MMBT2907ALT1

0.033 F

2 3

1

IO(short circuit) VBE2

R2

VBE1 VBE2R1

VO VO(Reg)1 R2

R1

ICC R2

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ORDERING INFORMATION

DeviceNominal

Output Voltage Marking Package Shipping

MC78LC15NTR 1.5 LAG Thin SOT235

3000 Units/7 Tape & Reel

MC78LC15NTRG 1.5LAG

Thin SOT235(PbFree)

MC78LC18NTR 1.8 LAH Thin SOT235

MC78LC18NTRG 1.8LAH

Thin SOT235(PbFree)

MC78LC25NTR 2.5 LAI Thin SOT235

MC78LC25NTRG 2.5LAI

Thin SOT235(PbFree)

MC78LC27NTR 2.7 LAJ Thin SOT235

MC78LC27NTRG 2.7LAJ

Thin SOT235(PbFree)

MC78LC28NTR 2.8 LAK Thin SOT235

MC78LC28NTRG 2.8LAK

Thin SOT235(PbFree)

MC78LC30NTR 3.0 LAL Thin SOT235

MC78LC30NTRG 3.0LAL

Thin SOT235(PbFree)

MC78LC33NTR 3.3 LAM Thin SOT235

MC78LC33NTRG 3.3LAM

Thin SOT235(PbFree)

MC78LC40NTR 4.0 LEC Thin SOT235

MC78LC40NTRG 4.0LEC

Thin SOT235(PbFree)

MC78LC50NTR 5.0 LAN Thin SOT235

MC78LC50NTRG 5.0LAN

Thin SOT235(PbFree)

MC78LC30HT1G 3.00C

SOT89(PbFree)

1000 Units Tape & Reel

MC78LC33HT1G 3.33C

SOT89(PbFree)

MC78LC40HT1G 4.00D

SOT89(PbFree)

MC78LC50HT1G 5.0 0ESOT89

(PbFree)

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.

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PACKAGE DIMENSIONS

TSOP5 (SOT235)NTR SUFFIXCASE 48302

ISSUE H

NOTES:1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.2. CONTROLLING DIMENSION: MILLIMETERS.3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEADTHICKNESS IS THE MINIMUM THICKNESSOF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDEMOLD FLASH, PROTRUSIONS, OR GATEBURRS.

5. OPTIONAL CONSTRUCTION: ANADDITIONAL TRIMMED LEAD IS ALLOWEDIN THIS LOCATION. TRIMMED LEAD NOT TOEXTEND MORE THAN 0.2 FROM BODY.

DIM MIN MAXMILLIMETERS

A 3.00 BSCB 1.50 BSCC 0.90 1.10D 0.25 0.50G 0.95 BSCH 0.01 0.10J 0.10 0.26K 0.20 0.60L 1.25 1.55M 0 10 S 2.50 3.00

1 2 3

5 4S

AG

L

B

D

H

CJ

0.70.028

1.00.039

mminches

SCALE 10:1

0.950.037

2.40.094

1.90.074

*For additional information on our PbFree strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.20

5X

C A BT0.102X

2X T0.20

NOTE 5

T

SEATINGPLANE0.05

K

M

DETAIL Z

DETAIL Z

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PACKAGE DIMENSIONS

K

L

G

H

M0.10 T SB SA

M0.10 T SB SA

D

E 2 PL

CJ

A

B

F

T SEATINGPLANE

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETERS3. 1213-01 OBSOLETE, NEW STANDARD 1213-02.

DIMA

MIN MAX MIN MAXINCHES

4.40 4.60 0.173 0.181

MILLIMETERS

B 2.40 2.60 0.094 0.102C 1.40 1.60 0.055 0.063D 0.37 0.57 0.015 0.022E 0.32 0.52 0.013 0.020F 1.50 1.83 0.059 0.072G 1.50 BSC 0.059 BSCH 3.00 BSC 0.118 BSCJ 0.30 0.50 0.012 0.020K 0.80 --- 0.031 ---L --- 4.25 --- 0.167

SOT89H SUFFIX

CASE 121302ISSUE C

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MC78LC00/D

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MC78LC00 Series Voltage Regulator