MC78LC00 Series Voltage Regulator

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Datasheets of the low power voltage regulators

Text of MC78LC00 Series Voltage Regulator

  • Semiconductor Components Industries, LLC, 2009January, 2009 Rev. 10

    1 Publication Order Number:MC78LC00/D

    MC78LC00 Series

    Micropower VoltageRegulator

    The MC78LC00 series of fixed output low dropout linear regulatorsare designed for handheld communication equipment and portablebattery powered applications which require low quiescent current. TheMC78LC00 series features an ultralow quiescent current of 1.1 A.Each device contains a voltage reference unit, an error amplifier, aPMOS power transistor, and resistors for setting output voltage.

    The MC78LC00 has been designed to be used with low cost ceramiccapacitors and requires a minimum output capacitor of 0.1 F. Thedevice is housed in the microminiature Thin SOT235 surface mountpackage and SOT89, 3 pin. Standard voltage versions are 1.5, 1.8,2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in100 mV steps.

    Features

    Low Quiescent Current of 1.1 A Typical

    Excellent Line and Load Regulation

    Maximum Operating Voltage of 12 V

    Low Output Voltage Option

    High Accuracy Output Voltage of 2.5%

    Industrial Temperature Range of 40C to 85C

    Two Surface Mount Packages (SOT89, 3 Pin, or SOT23, 5 Pin)

    These are PbFree Devices

    Typical Applications

    Battery Powered Instruments

    HandHeld Instruments

    Camcorders and Cameras

    Figure 1. Representative Block Diagram

    2 3

    1

    This device contains 8 active transistors.

    Vin

    GND

    VO

    Vref

    SOT89H SUFFIX

    CASE 1213

    1

    TAB

    (Tab is connected to Pin 2)

    1

    2

    3

    GND

    Vin

    Vout

    Tab

    (Top View)

    See detailed ordering and shipping information in the packagedimensions section on page 10 of this data sheet.

    ORDERING INFORMATION

    TSOP5NTR SUFFIX

    CASE 483

    1

    5

    MARKING DIAGRAMS ANDPIN CONNECTIONS

    1

    3 N/C

    GND

    2Vin

    Vout 4

    N/C5

    (Top View)

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    XXX= Specific Device CodeA = Assembly LocationY = YearW = Work Week = PbFree Package

    (Note: Microdot may be in either location)

    XX

    X A

    YW

    XX

    AY

    W

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    PIN FUNCTION DESCRIPTION

    Pin No.

    Pin Name

    Description

    1

    GND

    Power supply ground

    2

    Vin

    Positive power supply input voltage

    3

    Vout

    Regulated Output

    4

    N/C

    No Internal Connection

    5

    N/C

    No Internal Connection

    MAXIMUM RATINGS

    Rating Symbol Value Unit

    Input Voltage

    Vin

    12

    V

    Output Voltage

    Vout

    0.3 to Vin +0.3

    V

    Power Dissipation and Thermal CharacteristicsCase 48301 (Thin SOT235) NTR SuffixPower Dissipation @ TA = 85CThermal Resistance, JunctiontoAmbientCase 1213 (SOT89) H SuffixPower Dissipation @ TA = 25CThermal Resistance, JunctiontoAmbient

    PDRJA

    PDRJA

    140280

    900111

    mWC/W

    mWC/W

    Operating Junction Temperature

    TJ

    +125

    C

    Operating Ambient Temperature

    TA

    40 to +85

    C

    Storage Temperature

    Tstg

    55 to +150

    C

    Lead Soldering Temperature @ 260C

    Tsolder

    10

    sec

    Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.

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    ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 F, Cout = 1.0 F, TJ = 25C, unless otherwise noted.) (Note 5)NTR SUFFIX

    Characteristic Symbol Min Typ Max Unit

    Output Voltage (TA = 25C, Iout = 1.0 mA)1.5 V1.8 V2.5 V2.7 V2.8 V3.0 V3.3 V4.0 V5.0 V

    Vout1.4551.7462.4252.6462.7442.943.2343.94.90

    1.51.82.52.72.83.03.34.05.0

    1.5451.8542.5752.7542.8563.063.3664.15.10

    V

    Output Voltage (TA = 40C to 85C)1.5 V1.8 V2.5 V2.7 V2.8 V3.0 V3.3 V4.0 V5.0 V

    Vout1.4551.7462.4252.6192.7162.9103.2013.94.90

    1.51.82.52.72.83.03.34.05.0

    1.5451.8542.5752.7812.8843.093.3994.15.10

    V

    Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA) Regline 0.05 0.2 %/V

    Load Regulation (Iout = 1.0 mA to 10 mA) Regload 40 60 mV

    Output Current (Note 6)1.5 V, 1.8 V (Vin = 4.0 V)2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V)3.3 V (Vin = 6.0 V)4.0 V (Vin = 7.0 V)5.0 V (Vin = 8.0 V)

    Iout3550508080

    50808080100

    mA

    Dropout Voltage (Iout = 1.0 mA, Measured at Vout 3.0%)1.5 V1.6 V3.2 V3.3 V3.9 V4.0 V5.0 V

    VinVout

    35303030

    70605338

    mV

    Quiescent Current (Iout = 1.0 mA to IO(nom.)) IQ 1.1 3.6 A

    Output Voltage Temperature Coefficient Tc 100 ppm/C

    Output Noise Voltage (f = 1.0 kHz to 100 kHz) Vn 89 Vrms

    1. This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MILSTD883, Method 3015Machine Model Method 200 V

    2. Latch up capability (85C) 100 mA3. Maximum package power dissipation limits must be observed.

    PD TJ(max) TA

    RJA4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.6. Output Current is measured when Vout = VO1 3% where VO1 = Vout at Iout = 0 mA.

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    ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 F, Cout = 1.0 F, TJ = 25C, unless otherwise noted.) (Note 11)HT SUFFIX

    Characteristic Symbol Min Typ Max Unit

    Output Voltage30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 5.0 V)40HT1 Suffix (Vin = 6.0 V)50HT1 Suffix (Vin = 7.0 V)

    2.9503.2183.9004.875

    3.03.34.05.0

    3.0753.3824.1005.125

    V

    Line RegulationVin = [VO + 1.0] V to 10 V, IO = 1.0 mA

    Regline

    0.05

    0.2

    %/V

    Load Regulation (IO = 1.0 to 10 mA)30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 6.0 V)40HT1 Suffix (Vin = 7.0 V)50HT1 Suffix (Vin = 8.0 V)

    Regload

    40405060

    60607090

    mV

    Output Current (Note 12)30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 6.0 V)40HT1 Suffix (Vin = 7.0 V)50HT1 Suffix (Vin = 8.0 V)

    IO

    35354555

    50506580

    mA

    Dropout Voltage30HT1 Suffix (IO = 1.0 mA)33HT1 Suffix (IO = 1.0 mA)40HT1 Suffix (IO = 1.0 mA)50HT1 Suffix (IO = 1.0 mA)

    Vin VO

    40352525

    60533838

    mV

    Quiescent Current30HT1 Suffix (Vin = 5.0 V)33HT1 Suffix (Vin = 5.0 V)40HT1 Suffix (Vin = 6.0 V)50HT1 Suffix (Vin = 7.0 V)

    ICC

    1.11.11.21.3

    3.33.33.63.9

    A

    Output Voltage Temperature Coefficient

    TC

    100

    ppm/C

    7. This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MILSTD883, Method 3015Machine Model Method 200 V

    8. Latch up capability (85C) 100 mA9. Maximum package power dissipation limits must be observed.

    PD TJ(max) TA

    RJA10.Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.12.Output Current is measured when Vout = VO1 3% where VO1 = Vout at Iout = 0 mA.

    DEFINITIONS

    Load RegulationThe change in output voltage for a change in output current

    at a constant temperature.

    Dropout VoltageThe input/output differential at which the regulator output

    no longer maintains regulation against further reductions ininput voltage. Measured when the output drops 3% below itsnominal. The junction temperature, load current, andminimum input supply requirements affect the dropout level.

    Maximum Power DissipationThe maximum total dissipation for which the regulator will

    operate within its specifications.

    Quiescent CurrentThe quiescent current is the current which flows through the

    ground when the LDO operates without a load on its output:internal IC operation, bias, etc. When the LDO becomesloaded, this term is called the Ground current. It is actually the

    difference between the input current (measured through theLDO input pin) and the output current.

    Line RegulationThe change in output voltage for a change in input voltage.

    The measurement is made under conditions of low dissipationor by using pulse technique such that the average chiptemperature is not significantly affected.

    Line Transient ResponseTypical over and undershoot response when input voltage is

    excited with a given slope.

    Maximum Package Power DissipationThe maximum power package dissipation is the power

    dissipation level at which the junction temperature reaches itsmaximum operating value, i.e. 125C. Depending on theambient power dissipation and thus the maximum availableoutput current.

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    Vin, Input Voltage (V)

    2.5

    3.2

    TA = 25C

    IO = 10 mA

    3

    2.8

    2.6

    2.4

    2.22.7 3.52.9 3.1 3.3

    VO

    , OU

    TP

    UT

    VO

    LTA

    GE

    (V

    )

    Figure 2. Output Voltage versus Input Voltage

    IO = 5 mA

    2.3

    2.5

    2.7

    2.9

    3.1

    IO = 1 mA

    NTR Series

    2.5

    3.2

    Figure 3. Output Voltage versus Input Voltage

    TA = 25C

    IO = 1.0 mA

    IO = 5.0 mA

    IO = 10 mA

    3.0

    2.8

    2.6

    2.4

    2.22.7 3.52.9 3.1 3.3

    MC78LC30HT1

    2.95

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