MOLDFLOW analyses

Mold design and process optimization

l l lPEG GmbH Robert-Bosch-Str. 7 D-64293 Darmstadt Germany

Phone: +49 (0)6151 / 8504-0Fax: +49 (0)6151 / 8504-099

linfo@pe-group.de www.pe-group.de

Plastics Engineering Group

Moldflow applications:® ®l Autodesk Moldflow Insight (AMI) used

l Midplane, Fusion and 3D meshing technologyl Filling simulationl Runner design and runner balancing

- Sequential gating®- Dynamic Feed

l Cooling channel design and optimizationl Shrinkage and warpage prediction

- Including fiber orientation effectsl Special processes

- In-mold decoration (film, wood, metal)

- Overmolding of part inserts (hybrid)

- 2K injection molding

- Gas injection molding

- Injection compression molding (ICM)

- Reactive injection molding (RIM)

- Co-Injection®- Mucell process (microcellular foam)

Moldflow analyses offer you:l Increased part and mold qualityl Shorter cycle timesl Reduced efforts during molding trialsl Stable molding processesl Better understanding of the complex rheolo-

gical and thermal phenomena during molding

Runner system design / Pressure distribution

Co-injection / Distributionndof 2 component

Our offer contains:l Short response timesl Timely delivery of our servicesl Analysis fee communicated in advance

Cooling channel design

Leading by Simulation

Analysis goals & problemdefinitions

Part / cavity:l Gate placement, general ability to fill the part, position of weld lines and air traps,

pressure and clamp force requirements, shrinkage holes, thermal and mechanical

loading on the melt, cooling time, part deflection (shrinkage and warpage)l Process window and process capabilitiesl Part deflection: Tolerance compliance, part flatness, part roundness, position of holes,

screw bosses and other functional featuresl Part inserts taken into acountl Core deflectionl Identification of jetting phenomena

Plastics Engineering Group

Cooling channel layout:l Determination and optimization of the cycle timel Detecting thermal vulnerabilities like hot spots and other non-uniform cooling issuesl Cooling channel layout, channel dimensioning and process settings like flow rates

and temperaturesl Optimizing the cooling system with mold inserts (Ampcoloy, copper, BeCu, heatpipes, ...)l Part deflection due to thermal influences

Hot and cold runner systems:l Number and positions of the injection pointsl Runner balancing, minimizing the clamp force requirement, avoiding flashl Dimensioning of the gates for most effective packingl Hot runner layout and valve gate timing for sequential gating

®l Hot runner layout and pressure profils (Dynamic Feed )

for single cavity, multi cavity, family and stack molds...

Special processes:l In-mold decoration (IMD): Assessment of thermal and mechanical loading on the filml Part inserts: Thermal and mechanical effectsl Overmolding: Thermal effects of A-component on B-component,

vice versa shrinkage and warpage analysis of A- and

B-component coupledl Gas injection molding: Placement of gas needles and overflow cavities, gas channel

penetration, final polymer wall thickness, fingering processing

parameters like gas delay time, gas pressure profile, ...l ICM: Clarify advantages of ICM over conventional molding,

compression forces, thermal and mechanical loading of the melt,

processing: Volume to be filled, press-open distance,

closing profile, ...l Co-injection: Determining (thickness) distribution of skin and core

components penetration of core component®

l Mucell : Weight savings, sink marks, bubble distribution

Processing: Initial volume to be filled, gas concentration, ...

l l lPEG GmbH Robert-Bosch-Str. 7 D-64293 Darmstadt Germany

Phone: +49 (0)6151 / 8504-0Fax: +49 (0)6151 / 8504-099

linfo@pe-group.de www.pe-group.de

Leading by Simulation