Processes Comparison‐‐‐fully automated SMD vs … FMEA Confidential Docs not ... Solder paste b. Die attach method: Soldering c. Die placement diagram: See attached Not available

Cleaning Baking Strip plating T/F TMTTDieattachedclipbonderSoldering

Automolding

Cleaning BarrelplatingT/F TMTTPresolderingPresolderingassemblySoldering

Baking DeflashAutoloadingCompoundpreheatingMoldingDerunner

fullyautomatedSMD

manualSMD

ProcessesComparisonfullyautomatedSMDvsmanualSMDprocesses

AllinonedesignwithhighsolutionCCDinspection

Item fullyautomatedSMA SMA

Top

Side

Bottom

Appearance ComparisonfullyautomatedSMA&SMA

Uniformformingdesigned

fullyautomatedSMD manualSMD

Identifiedmarkingondevicebetween fullyautomatedSMD VSmanualSMD

Devicespecialsquarearounddatecode duringmarkingtoidentifiednewfullyautomatedSMD comparingwithbefore

Package fullyautomatedSMD(StaticFree) Original SMD(AntiESD)

Carry

Surface resistance106~108;Term of validity: permanent

Surface resistance: 106~1011Term of validity: 12 months

Reel

Surface resistance108 Surface resistance1011

Pizza Box

fullyautomatedSMDAPPLIEDSTATICFREEPACKINGINSTEADANTi_ESD

Prepared by TSC _YEWChecked by TSC _YEWApproved by TSC _YEWIssued date a2016. 11.15Reversion fo A

****** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ******

comparison report

TAIWAN SEMICONDUCTOR CO., LTD.231 20511 11F, No. 205 Sec. 3, Beishin RD.:886-2-8913-1588 Shindian Dist., New Taipei City, Taiwan, R.O.C. 231:886-2-8913-1788 Tel:886-2-8913-1588 Fax:886-2-8913-1788

HQ4PE03-A

Subject PCN NO: PCN17007

No Item

1 Processes

2Generalappearance

3 PackageOutline

1.manualSMAproductionline

FollowD/SSpec.

FollowD/SPODrefertotheattached

Refertheattached2.SMAAppearance

Comparison report

Consumer SMA Comparison Report

Before After

1.manualSMAproductionline2.fullyautomatedSMAproductionline

RemarkRefertheattached1.ProcessesComparison

FollowD/SPODrefertotheattached

FollowD/SSpec.


HQ4PE03-A

4 LeadFrame

5MoldingCompound

6 Marking

7 Packing


refertotheattached refertotheattached

Refertheattached7.Packing

Consumer(NonHF)Type:EME1100Supplier:AMaterial:Epoxy

Consumer(HF)Type:EMEE110Supplier:AMaterial:Epoxy

Consumer(NonHF)Type:EME66XXseriesSupplier:BMaterial:Epoxy

Consumer(HF)Type:EMEE500Supplier:AMaterial:Epoxy

refertotheattached refertotheattached Refertheattached6.Marking

Supplier:AMaterial:Copper

Supplier:BMaterial:Copper

HQ4PE03-A

Customer ALLCustomer Part NumberSS12~SS115Part Number SS12~SS115Ordering Code : SS1xHR2/ SS1xHR3Qualification : AEC-Q101 Qualified

Non AEC-Q101 QualifiedPurpose: New Part Approval

PCNAnnual validation

Application : AutomotiveOthers

PPAP Level : 3

Prepared by Benny YehApproved by Brian BieDate 29th Sep. 2016Doc No: HPP16092901A

PPAP(Production Part Approval Process)

****** TSC PPAP format based on ZVEI/ PPA VDA 2 / AIAG 4th edition. ******



Rev.A Creation

Change History of this PPAP documentation

Date2016/9/29

Item / Section Essential ChangesAll pages




TSC generic family P/N including as follows : Identifies P/N we used for this family qualification.

Family Defination is based on AEC-Q101 Rev.D

SS12 Green compound.SS13 Non-Green compound.SS14SS15SS16SS19SS110SS115


**** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ****


Item

Description YES N/A YES No Comment

1. Design Record

2. Authorized Engineering Change Documents (PCN)

3. Customer Engineering Approval

4. Design FMEA

Confidential Docs notIncluded.

5. Process Flow Diagrams

6. Process FMEAConfidential Docs notIncluded.

7. Control Plan

Confidential Docs notIncluded.

8. Measurement System Analysis Studies (GR&R)

9. Dimensional Results

10. /Material, Performance Test Results

11. Initial Process Study

12. Qualified Laboratory Documentation List the hyperlinks

13. Appearance Approval Report

14. Sample Production Parts

Via Marketing

15. Master Sample

16. Checking Aids

17 Customer-Specific Requirements

18 Part Submission Warrant (PSW)

IndexAvailable Included




Item Name Supplier Response1. User's Part Number: SS1X

2. Supplier Part Number/Generic Part Number: SS12~SS115

3. Device Description: 1A, 20V - 150V Surface Mount Schottky Barrier Rectifiers

4. Wafer/Die Fab Location & Process ID: Site1

a. Facility name/plant #: Hangzhou Lion Microelectronics Co.,Ltd

b. Country: China

5. Wafer/Die Fab Location & Process ID: Site2 N/A, Site1 only

a. Facility name/plant #:

b. Country:

6. Assembly Location & Process ID:

a. Facility name/plant #: Yangxin Everwell Electronic Co.,Ltd.

b. Country: China

7. Final Quality Control A (Test) Location:

a. Facility name/plant #: Yangxin Everwell Electronic Co.,Ltd.

b. Country: China

8. Wafer/Die:

a. Wafer size: 6"

b. Die family: Schottky

c. Die mask set revision & name: Not available

9. Wafer/Die Technology Description:

a. Wafer/Die process technology: Planar Epitaxy

b. Gate oxide thickness (MOSFETs only): Not available

c. Number of mask steps: 3

10. Die Dimensions:

a. Die Height: 35 mil

b. Die length: 35 mil

c. Die thickness (finished): 28010um

11. Die (frontside) Metallization:

a. Die metallization material(s): Ti-Ni-AG

b. Number of layers: 3 layers

c. Thickness : Typical 4.75um

d. % of alloys (if present): Not available

12. Die Passivation:

a. Number of passivation layers: 1 layer

b. Die passivation material(s): SiO2

c. Thickness(es) & tolerances: Typical 0.4um

****** TSC PPAP format based on ZVEI/ PPA VDA 2 / AIAG 4th edition. ****** *** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ***

1 Certification of design, construction and qualification


Item Name Supplier Response13. Die Overcoat Material (e.g., Polyimide): Not available

14. Die Prep Backside:

a. Die prep method: Not available

b. Die metallization: Ti-Ni-AG

c. Thickness(es) & tolerances: Typical 1.72um

15. Die Separation Method:

a. Kerf width (m): 20~25um

b. Kerf depth (if not 100% saw): 100% saw

c. Saw method: Single Dual

16. Die Attach:

a. Die attach material ID: Solder paste

b. Die attach method: Soldering

c. Die placement diagram: See attached Not available

17. Package:

a. Type of package (e.g., plastic, ceramic,unpackaged): Plastic

b. JEDEC designation (e.g., MS029, MS034,etc.): SMA

18. Mold Compound:

a. Mold compound supplier & ID: Sumitomo BAKELITE(SUZHOU) CO.,LTD

b. Mold compound type: EME-6650

c. Flammability rating: UL 94 V1 UL 94 V0

d. Fire Retardant type/composition: Brominated Epoxy Resin & Antimony Oxide

e. Tg (glass transition temperature)(C): Typ.150C

19. Wire Bond: Not available

a. Wire bond material:

b. Wire bond diameter (mils):

c. Type of wire bond at die:

d. Type of wire bond at leadframe:

20. Leadframe (if applicable):

a. Header material: Alloy Copper

b. Header diameter (mm): Not available

c. Header length (mm): Not available

d. Header plating composition: Not available

e. Header plating thickness (inch): Not available

f. Leadframe material: Alloy Copper

g. Leadframe bonding plating composition: Not available

h. Leadframe bonding plating thickness(inch): Not available

i. External lead plating composition: Matte tin

j. External lead plating thickness (um): 8~15um


*** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ********* TSC PPAP format based on ZVEI/ PPA VDA 2 / AIAG 4th edition. ******


Item Name Supplier Response21. Thermal Resistance:

a. JA C/W (typical): 88 C/W

b. JC C/W (typical): 28 C/W

22. Maximum Process Exposure Conditions: * Note: Temperatures are as measured on the center ofthe plastic package body top surface. a. MSL @ rated SnPb temperature: Level 1 at 85C/85%RH (SnPb)

b. MSL @ rated Pb-free temperature: Level 1 at 85C/85%RH (Pb-free)

Attachments: Requirements:1. Die Photo2. Package Outline Drawing3. Die Cross-Section Photo/Drawing4. Material Composition Declaration

1. A separate Certification of Design,Construction &Qualification must be submitted for each part number,wafer fab, and assembly location.2. Design, Construction & Qualification shall be signed bythe responsible individual at the supplier who can verifythe above information is accurate and complete. Typename and sign below.

Completed by: Benny Yeh Date: 2016/09/29 Certified by: Brian Bie Date: 2016/09/29

Title: HQ Engineer Title: HQ Engineer


*** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ********* TSC PPAP format based on ZVEI/ PPA VDA 2 / AIAG 4th edition. ******



Inner structure (X-Ray)



Die Photo

Die cross-section drawing


1.Embossed Carrier Specification

User Direction of Feed

Unit : mm

DIM P E F D D1 P0 P0*10 P2

4 1.75 5.5 1.55 1.5 4 40 20.1 0.1 0.05 0.05 +0.25; -0 0.1 0.2 0.05

DIM B0 K0 T

5.33 2.35 0.2450.1 0.1 0.015

NOTE

A0,B0,K0 are determined by component size. The clearance between the component and the cavity must be within 0.05mm(.002")min. to 0.65mm(.025")max. for 12mm tape, 0.05mm(.002")min to 0.90mm(.035")max. for 16mm tape. In addition, the components cannot rotate more than 20 within the determined cavity.



Spec.

W

12+0.3; -0.1

Spec.

A0

2.8

1 Certification of design, construction and qualificationPacking Information

0.1


2. Reel Specification





Min. Packing

Reel

3. LabelBar-Code Label on Reel Bar-Code Label on Carton

4. Order Information

PackageGreenCompoundCode

ReelSize/Material

Reel(pcs)

Carton(pcs)

Carton Size(mm)

13"Plastic 7,500 75,000 345x340x220

7"Plastic 1,800 36,000 370x195x210


Outside Carton

Pizza Box

AEC-Q101Qualified

PackingCode

****** TSC PPAP format based on ZVEI/ PPA VDA 2 / AIAG 4th edition. ****** ****** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ******

GM2

R3SMA H


CREAT BY ART

- Low power loss, high efficiency- Ideal for automated placement- Guardring for overvoltage protection- High surge current capability

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Part No. with suffix "H" means AEC-Q101 qualifiedPacking code with suffix "G" means green compound (halogen-free)Terminal: Matte tin plated leads, solderable per JESD22-B102Meet JESD 201 class 2 whisker test

VRRM 20 30 40 50 60 90 100 150 VVRMS 14 21 28 35 42 63 70 105 VVDC 20 30 40 50 60 90 100 150 VIF(AV) A

dV/dt V/s

TJ CTSTG C

Document Number: DS_D1411020 Version: P15

TJ=100CTJ=125C

Moisture sensitivity level: level 1, per J-STD-020

Case: DO-214AC (SMA)

FEATURES

SS16

SS19

Polarity: Indicated by cathode bandWeight: 0.066 g (approximately)

PARAMETER SYMBOL

SS12 - SS115

1A, 20V - 150V Surface Mount Schottky Barrier Rectifiers

DO-214AC (SMA)

Taiwan Semiconductor

MECHANICAL DATA

- Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC

Maximum repetitive peak reverse voltageMaximum RMS voltageMaximum DC blocking voltageMaximum average forward rectified current

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25C unless otherwise noted)

1

SS13

SS14

SS12

SS115

mA

C/W

Voltage rate of change (Rated VR) 10000

-2-

IR

0.2

Note 1: Pulse test with PW=300s, 1% duty cycle

Typical thermal resistanceRJLRJA

Operating junction temperature range

2888

Storage temperature range - 55 to +150- 55 to +125 - 55 to +150

Peak forward surge current, 8.3 ms single half sine-wavesuperimposed on rated load

IFSM

6 50.1

-

Maximum instantaneous forward voltage (Note 1)@ 1 A, TJ=25C@ 1 A, TJ=100C

VF

Maximum reverse current @ rated VR

TJ=25C

UNITSS110

40

0.50.4

0.750.65

0.80.7

0.950.85

V

A

SS15

PART NO.

PART NO.

(TA=25C unless otherwise noted)


AEC-Q101 qualifiedGreen compoundSS16HR3G SS16 H R3 G

Note 1: "xx" defines voltage from 20V (SS12) to 150V (SS115)

EXAMPLEPREFERRED

PART NO.PART NO.SUFFIX

PACKING CODEPACKING CODE

SUFFIXDESCRIPTION

N/AE3 Clip SMA 1,800 / 7" Plastic reelE2 Clip SMA 7,500 / 13" Plastic reel

F2 Folded SMA 7,500 / 13" Paper reelF4 Folded SMA 7,500 / 13" Plastic reel

SMA 7,500 / 13" Paper reelM2 SMA 7,500 / 13" Plastic reelF3 Folded SMA 1,800 / 7" Plastic reel

PACKING CODESUFFIX

PACKAGE PACKING

SS1xx(Note 1)

H

R3

G

SMA 1,800 / 7" Plastic reelR2

SS12 - SS115Taiwan Semiconductor

RATINGS AND CHARACTERISTICS CURVES

ORDERING INFORMATIONPART NO.SUFFIX

PACKING CODE

0

0.2

0.4

0.6

0.8

1

1.2

50 60 70 80 90 100 110 120 130 140 150 160 170AV

ER

AG

E F

OR

WA

RD

CU

RR

EN

T(A

)

LEAD TEMPERATURE (C)

FIG.1 FORWARD CURRENT DERATING CUURVE

SS12-SS14SS15-SS115

RESISTIVE ORINDUCTIVE LOAD

0

10

20

30

40

1 10 100PE

AK

FO

RW

ARD

SU

RG

E C

UR

RE

NT

(A)

NUMBER OF CYCLES AT 60 Hz

FIG. 2 MAXIMUM NON-REPETITIVE FORWARDSURGE CURRENT

8.3ms Single Half Sine-Wave

0.001

0.01

0.1

1

10

100

0 20 40 60 80 100 120 140

INS

TAN

TAN

EO

US

RE

VE

RS

E C

UR

RE

NT

(mA

)

PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)

FIG. 4 TYPICAL REVERSE CHARACTERISTICS

TJ=25C

TJ=75C

TJ=125C

SS12-SS14SS15-SS115

0.01

0.1

1

10

100

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6

INS

TAN

TAN

EO

US

FO

RW

ARD

CU

RR

EN

T(A

)

FORWARD VOLTAGE (V)

FIG. 3 TYPICAL FORWARD CHARACTERISTICS

SS12-SS14

SS15-SS16

SS115

SS19-SS110

Min Max Min MaxA 1.27 1.58 0.050 0.062B 4.06 4.60 0.160 0.181C 2.29 2.83 0.090 0.111D 1.99 2.50 0.078 0.098E 0.90 1.41 0.035 0.056F 4.95 5.33 0.195 0.210G 0.10 0.20 0.004 0.008H 0.15 0.31 0.006 0.012

P/N = Specific Device CodeG = Green CompoundYW = Date CodeF = Factory Code


DO-214AC (SMA)


Unit (mm)1.68

PACKAGE OUTLINE DIMENSIONS

DIM.Unit (mm) Unit (inch)

SUGGESTED PAD LAYOUT

CD

AB 1.52

Unit (inch)0.066

Symbol

2.41

0.0600.155

MARKING DIAGRAM

E

3.93

5.450.0950.215

10

100

1000

0.1 1 10 100

CAP

ACIT

ANC

E (p

F)

REVERSE VOLTAGE (V)

FIG. 5 TYPICAL JUNCTION CAPACITANCE

f=1.0MHzVslg=50mVp-p

SS12-SS14SS15-SS16SS19-SS115

0.1

1

10

100

0.01 0.1 1 10 100

TRA

NS

IEN

T TH

ER

MA

L IM

PE

DA

NC

E (

C/W

)

T-PULSE DURATION(s)

FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE

CREAT BY ART

assumes no responsibility or liability for any errors or inaccuracies.

Information contained herein is intended to provide a product description only. No license, express or implied, toany intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions ofsale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.Customers using or selling these products for use in such applications do so at their own risk and agree to fullyindemnify TSC for any damages resulting from such improper use or sale.



Notice

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,

Item Material Name Tradedname Substance Name CAS No. Raw MaterialProportion Proportion ID Exemption

Si 7440-21-3 95.21%Ag 7440-22-4 3.72%Ni 7440-02-0 0.92%Ti 7440-32-6 0.15%Pb 7439-92-1 92.50%Sn 7440-31-5 5.00%Ag 7440-22-4 2.50%Cu 7440-50-8 99.90%Fe 7439-89-6 0.10%P 7723-14-0 0.03%Cu 7440-50-8 99.90%Suifur 7704-34-9 0.00%P 7723-14-0 0.00%Silica(Amorphous) A 60676-86-0 80.90%Silica(Amorphous) B 7631-86-9 3.00%Epoxy Resin 29690-82-2 7.00%Phenolic Resin 9003-35-4 3.00%Antimony trioxide 1309-64-4 3.00%Brominated epoxy Resin 40039-93-8 3.00%Carbon Black 1333-86-4 0.10%

5 TIN LAYER Tin Sn 7440-31-5 100.00% 0.33% RP-01Notes:RoHS It's apply to the exemption term

63.62% RM-05


Solder Paste 1.57%

Materials Composition Declaration

1 DICE


3 Lead Clip Copper 8.87%

H MOLDINGCOMPOUND

3 LEAD FRAME Copper

SKY DICE 1.38%

24.23% ASM

RD-02

ASM

RS-01 EX:7a

7(a). (, 85%)7(a). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)

4

2 SOLDER

Epoxy


Cover Sheet of FMEA with reference number, date and revision.Full FMEA is not included in the PPAP submission, FMEA is visible during visit TSC only.

(S) Class (O) Prevention Detection (D) (RPN) (S) (O) (D) (RPN)

BasicfunctionsRatedpowerrectifier

IoContinuousworkingunderratedIo

IoCannotcontinuousworkunderratedIo

Devicefailedatfield

8 IoSelectimproperdiesizeandcannotbearratedIo

2 SMDSMDBOM

QualificationreportOplife

3 48 None

Pad

LeadframePaddimensiontooSmallleadtothermaldissipationnotsuitable

3 DesignReview


3 72 None

Dimple

Dimpleofcliptoosmallleadtothermaldissipationnotsuitable

3 DesignReview


3 72 None

4 (Design Potential Failure Mode and Effect Analysis)

: SMDItem: Matrix SMD

: ///Process Responsibility:ENG/MFG/QRA/RM

FMEA : DFMEAYG11901-BFMEA Number: DFMEAYG11901-B

: BVersion: B

: SMDProduct Type: Matrix SMD series


: Core Team: Eric, Reyn, Lucy, Meifang, Vince, Jaming, Junfeng, May, Roben, Shirley, Yunxia, Yao

FMEA (): 2016.8.5FMEA Date(Revise): 2016.8.5

: Revise by: Vince

Design function requirements

Potential failure

mode

Recommended

actions(s)

Responsibilityand targetcompletion

date

Action results

Potentialeffect(s)of failure

/Potential

cause(s)mechanism(s) of failure

Current design controls

2014.6.2Key Date: 2014.6.2

FMEA(): 2014.6.2FMEA Date(Orig.): 2014.6.2

: Edit by: Vince

Actiontaken


Item: Matrix SMD Documents No: HFCMS001-AProduct Type: Matrix SMA/ Matrix SMB/ Matrix SMC SERIES

in-coming inspection Triming and Formming Process

Storage T/F inspection

(TMTT)Wafer dicing TMTT Process

TMTTDicing inspection TMTT inspection

Soldering Out-going inspection

Soldering inspection Packing process

Cleaning Packing inspection

Storage

Molding Q.A inspection

Delivery

Plating

Plating inspection


10 22

cleaning process inspection

11 23

12

24

Molding inspection

7 19

8 20

9 21

4 16

5 17

6 18

1 13

2 14

3 15

5 (Process flow chart)

Process

step

Process Step Process

step

Process Step


Cover Sheet of FMEA with reference number, date and revision.Full FMEA is not included in the PPAP submission, FMEA is visible during visit TSC only.

(S) Class (O) Prevention Detection (D) (RPN) (S) (O) (D) (RPN)

I001Die pre-damage

8 Probe pin wear out

2 Probe pin life control

Probing process preliminary,self check

4 64 None

8

Poor contact betweenprobe pin and waferlead to arcing duringtest due to probe pinheight and chuck tableheight not well adjust.

2 1. Calibrate chuck tableflatness monthly.2. Test Z axis accuracymonthly3. Probe pin height isforbidden to adjust by sticklabel.4. Adjust chuck height bygolden gage according tocheck box which find contactpoint of probe pin and chucktable , then rise chuck table0.10mm and confirm springforce less than 13g byprecision electronic balance.

1.

2.

1. Operator check probe pinheight by golden gage beforeworking, inform engineer whenabnormal find and cannotadjust probe pin height.2. Probing process preliminary,self check

3 48 None

6 (Potential Failure Mode And Effects Analysis (Procss FMEA)

FMEA: PFMEAYG11901-BFMEA Number: PFMEAYG11901-BFMEA(): 2015.1.15FMEA Date(Orig.): 2015.1.15FMEA(): 2016.8.5FMEA Date(Revise): 2016.8.5

: Core Team: Reyn /Vince/Jaming / Yjf/ Yao / Shirley/Yunxia/May/Enfang/Roben

: BVersion: B

: Revise by: Reyn

: Matrix SMDItem: Matrix SMD: Matrix SMDProduct Type: Matrix SMD


Stationcode

IQC inspection

Test waferelectrical data

IR over/ short, failedat customer

Current design controls

: ///Design Responsibility:ENG/MFG/QRA/RM: 2015.1.15Key Date: 2015.1.15


Processfunction

requirements

Potential failure

mode

Potential effect(s)of

failure

/Potential

cause(s)mechanism(s)of failure

: Edit by: Vince

Recommended

actions(s)

Responsibilityand target

completion date

Action results

Actiontaken


Detailed Control Plan is not included in the PPAP submission, Control Plan is visible during visit TSC only.

( (

Prototype Pre-launch Production Date(Original) Date(Revise) Revision

: Documents No: CPYG11901-B 2016.8.5 B

/: /(Customer engineer approval date(If req'd)

Part number/Last change level: N.A

/ Part number/Description /(Customer quality approval date (If req'd)

Matrix SMA N.A

/(Supplier plant) /() Other approval date(if req'd)

N/A N/A

Size

Frequency

I001 IQC 50pcs ,

In-coming inspection Elec, Function(Wafer) Yield target limit Trial run IQC inspector Per shipmentVoltage Inspection test report Isolation, reject

IQC 1 ,

Appearance(wafer) Chipping, Scratch, Split, Peeling, Oxidize,Dirty Microscope IQC inspector 500pcsPer shipmentVoltage Inspection test report Isolation, reject

IQC ,

Lead frame Dimension Dimension measurement MeasurementMicroscope IQC inspector Per lot Inspection test report Isolation, reject

IQC ,

Lead frame Appearance Oxidize, composition Visual inspection IQC inspector Per lot Inspection test report Isolation, rejectClip IQC ,

Clip Dimension Dimension measurement MeasurementMicroscope IQC

Per lot Inspection test report Isolation, reject

Core Team member

. Venkey

Reyn, Vince, Jaming, Yao, May, Enfang, Vicky, Stark, Jane, Venkey

// Supplier approval date

7 (Control Plan)

/

Key contact person/Telephone

Venkey+86-543-8691091-3101) 2016.1.15

(Code) /Other approval date(if req'd)

Step

Process name

operation

/

/

Machine/De

vice/tools

(Characterictics)

Spec.Char.

(method)

Reaction plan

Product

Process

/

/

Productr/Process/Spec./Tolerence

Evaluation/Measure

Control method

****** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ************ TSC PPAP format based on ZVEI/ PPA VDA 2 / AIAG 4th edition. ******

5PCS

512PCS

5pcs


Calculation:

Abnormal Explanation:

1 100.0 100.1 99.9 100.1 100.0 100.0 100.0 99.9 100.1 100.0 100.1 100.0 100.0 100.0 100.0 100.1 100.0 100.0 100.1 99.9 100.0 100.0 100.1 100.0 100.1 100.1 100.0 100.0 100.0 100.0 n 1/d2 A2 D3 D4

2 100.0 100.0 100.1 100.0 100.0 100.1 100.0 100.1 100.0 100.1 100.0 100.1 100.0 100.0 99.9 100.1 100.0 100.0 100.1 100.1 100.1 99.9 99.9 99.9 100.1 99.9 100.1 100.0 100.0 100.1 2 0.886 1.880 0 3.267

3 100.1 100.0 100.0 100.0 100.0 100.0 100.1 100.0 100.0 99.9 99.9 100.1 100.1 99.9 100.1 100.0 100.0 100.1 100.0 100.0 100.1 100.1 100.0 100.0 100.0 100.1 100.1 99.9 99.9 99.9 3 0.590 1.023 0 2.575

300.1 300.1 300.0 300.1 300.0 300.1 300.1 300.0 300.1 300.0 300.0 300.2 300.1 299.9 300.0 300.2 300.0 300.1 300.2 300.0 300.2 300.0 300.0 299.9 300.2 300.1 300.2 299.9 299.9 300.0

100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.1 100.0 100.0 100.0 100.1 100.0 100.0 100.1 100.0 100.1 100.0 100.0 100.0 100.1 100.0 100.1 100.0 100.0 100.0

0.1 0.1 0.2 0.1 0.0 0.1 0.1 0.2 0.1 0.2 0.2 0.1 0.1 0.1 0.2 0.1 0.0 0.1 0.1 0.2 0.1 0.2 0.2 0.1 0.1 0.2 0.1 0.1 0.1 0.2

(Check by)S31783 VR 98V~102V 2016/5/3 May

LCL = X-A2R = 99.889

8 - (Measurement Systems Analysis-Stability)(Part Number) (Gage Name) (Gage No.) (Characteristics) (Specification) (Duration) (Operator)Standard Sample_10M TVS-600

X = 100.019R = 0.127

CL=X= 100.019 UCL = X+A2R = 100.148

= 0.0747

CL=R= 0.127 UCL = D4R = 0.326 LCL = D3R = 0


Note:

n

SUM

X

R


0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

99.8

99.9

100.0

100.1

100.2

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

(Part Name) Resistance_1/2A (Reference Value) 1.9989 V(Gage Name)TVS-600 (Characteristics) VF

(Gage No.) S31133 (Date) 2016/3/29(Appraiser) Roben

(Trials)

(Measurement)

(Bias) (Date sheet)

1. 2.000 -0.001

2. 1.999 0.0003. 1.999 0.000 (From Table)

4. 1.999 0.000

5. 2.000 -0.0016. 2.000 -0.001 (Statistics)

7. 1.999 0.000

8. 1.998 0.001

9. 2.000 -0.001

10. 1.999 0.000

11. 2.000 -0.00112. 1.998 0.001

13. 1.999 0.000

14. 1.997 0.002

15. 1.999 0.000

0 ( -0.000288 ~ 0.0006215 )

8 - (Measurement Systems Analysis-Bias)

(m) = 15 g = 1 = 0.050

d2 = 3.472 d2*= 3.5500 df(v) = 15

(Average) (Bias) r1.9991 0.000166667 0.001b t0.0002 0.7638

****** TSC PPAP format base on ZVEI/ PPA VDA 2 / AIAG 4th edition. ******


t-tv,1- /2= 2.1314

95%(H) 0.000621595%(L) -0.000288


(Unit)mm

Measured Bias Measured Bias Measured Bias Measured Bias Measured Bias1 1.00 0.000 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.0002 1.00 0.000 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.0003 1.00 0.000 2.00 0.000 3.00 0.000 4.01 0.010 5.00 0.000

T 4 1.00 0.000 2.01 0.010 3.00 0.000 4.00 0.000 5.00 0.000R 5 0.99 -0.010 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.000I 6 1.00 0.000 2.00 0.000 3.00 0.000 4.01 0.010 5.00 0.000A 7 1.00 0.000 2.01 0.010 3.00 0.000 4.00 0.000 5.00 0.000L 8 1.00 0.000 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.000S 9 1.00 0.000 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.000

10 1.00 0.000 2.01 0.010 3.00 0.000 4.00 0.000 5.00 0.00011 0.98 -0.020 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.00012 1.00 0.000 2.00 0.000 3.00 0.000 4.00 0.000 5.00 0.000

11.97 -0.030 24.03 0.030 36.00 0.000 48.02 0.020 60.00 0.0000.998 -0.0025 2.003 0.002 3.000 0.0000 4.002 0.0017 5.000 0.000

X = m= 12 y= Y2= 0.0010Y = g= 5 X=

XY = b=y-x=1/gm = 2.0198X2 = yi

2-byi-xiyiYX

gm -0.00250 0.00250 0.00000 0.00167 0.00000(X)2 0.0048 0.0027 0.0014 0.0036 0.0065gm -0.0058 -0.0029 -0.0007 -0.0021 -0.0042

= 95%

1.OK"= 0"

8 -(Measurement Systems Analysis-Linearity)

(Gage Name)(Calipers)

(Part Name)(Gage Block)

(Gage No.)S23215

(Performed by)Roben

(Characteristics)Dimension

(Date)2016/4/21

Part Reference Value

1 2 3 4 51.000 2.000 3.000 4.000 5.000

SUM Average

Reference Value 1.000 2.000 3.000 4.000 5.000 Bias Average -0.003 0.002 0.000 0.002 0.000

180.00 0.0003330.0200 30.1100 -0.000917

0.01667 tgm-2,1-/2=660.0

S=( )1/2= 0.00409

XY-( ) gm-2

= 0.0004167 Bias Average=

X2-H=L=

Analyze



y = 0.0004 x - 0.0009 R = 0.1179

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03

0.0 1.0 2.0 3.0 4.0 5.0

y = -0.0002 x + 0.0008 R = 0.1147

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03

1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0

y = -0.0001 x + 0.0002 R2 = 0.0071

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03

0.0 1.0 2.0 3.0 4.0 5.0 6.0

()--- a*

=0


1 2 3 4 5 6 7 8 9 101 38.62 38.73 39.05 38.60 37.93 38.36 38.63 39.06 38.59 38.072 38.60 38.72 39.05 38.63 37.95 38.36 38.64 39.08 38.56 38.093 38.63 38.70 39.03 38.63 37.94 38.34 38.65 39.09 38.59 38.08

(Average) 38.62 38.72 39.04 38.62 37.94 38.35 38.64 39.08 38.58 38.08 Xa= 38.57

(Range) 0.03 0.03 0.02 0.03 0.02 0.02 0.02 0.03 0.03 0.02 Ra= 0.02

1 38.61 38.72 39.07 38.62 37.92 38.34 38.64 39.07 38.58 38.082 38.65 38.73 39.06 38.64 37.94 38.35 38.65 39.07 38.59 38.093 38.63 38.74 39.05 38.63 37.95 38.34 38.63 39.09 38.57 38.07

(Average) 38.63 38.73 39.06 38.63 37.94 38.34 38.64 39.08 38.58 38.08 Xa= 38.57

(Range) 0.04 0.02 0.02 0.02 0.03 0.01 0.02 0.02 0.02 0.02 Ra= 0.02

1 38.62 38.73 39.04 38.63 37.93 38.35 38.63 39.06 38.58 38.07 2 38.60 38.73 39.05 38.61 37.93 38.37 38.65 39.09 38.59 38.08 3 38.60 38.70 39.05 38.63 37.95 38.35 38.63 39.07 38.58 38.05

(Average) 38.61 38.72 39.05 38.62 37.94 38.36 38.64 39.07 38.58 38.07 Xa= 38.57

(Range) 0.02 0.03 0.01 0.02 0.02 0.02 0.02 0.03 0.01 0.03 Ra= 0.02

X= 38.57Rp= 1.14R= 0.02XDIFF= 0.01UCLR= 0.06

8 - (Measurement Systems Analysis-Gauge R&R)

/Appraiser/Trial#

(Part) (Average)

A

38.5638.5738.57

38.6 37.9

B

38.5738.5838.57

C

38.5638.5738.56

38.4 38.6 39.1 38.6 38.1

(Ra+Rb+Rc)/(# of appraisers)

(Part Average)38.6 38.7 39.1

XMAX-XMINR*D4

Appraiser K2

Trial D4 K1

2 0.7071 2 3.27 0.88623 0.5231 3 2.58 0.5908

2D4 = 3.273D4 = 2.587D3 = 0UCLRRR

D4=2.37 for 2 trials and 2.58 for 3 trials;D3=0 for up to 7 trials, UCLR represents the limit of individual R's. Cricle those that are beyond this limit.Identify the cause and correct. Repeat thest readings using the same appraiser and unit as originally.




R= 0.0227 XDIFF= 0.0057 Rp= 1.138

-EV) Repeatability-Equipment Variation(EV)EV = R*K1 K1 %EV = 100[EV/TV]

= 0.0134 0.8862 = 3.74 %0.5908

-(AV) Reproducibility-Appraiser Variation(AV)AV = [(XDIFF*K2)2-(EV2/(nr))]1/2 %AV = 100[AV/TV]

= 0.00168 2 3 = 0.47 %n = Parts 0.7071 0.5231(GRR) Repeatability & Reproducibility(R&R) %GRR = 100[GRR/TV] GRR = [(EV2+AV2)]1/2 = 0.0135 = 3.77 %(PV) Part Variation(PV)

PV = Rp*K3 Parts K3 %PV = 100[PV/TV]= 0.3579 2 0.7071 = 99.93 %

3 0.52314 0.4467

(TV) Total Variation(TV) 5 0.40306 0.3742

TV = [GRR2+PV2]1/2 7 0.3534 ndc = 1.41(PV/GRR)= [GRR2+PV2]1/2 8 0.3375 = 37.40= 0.3582 9 0.3249

10 0.31465.15(99.0%

All calculation are based upon predicting 5.15sigma(99.0% of the area under the normal distribution curve)

K15.15/d2d2(m)(g)15

K1 is 5.15/d2, where d2 is dependent on the number of troals(m) and the number of parts times the number od appraisers(g) which is assumed to be greater than 15.

AV-0

AV-If a negative value is calculated under the square root sign, the appraiser variation(AV) defaults to zero

K25.15d2d2(m)(g)g1

K2 is 5.15/d2, where is d2 is depend on the number of apprasiers(m) and (g) is 1, since there is only one range calculation

K35.15d2d2(m)(g)g1

K3 is 5.15/d2, where is d2 is depend on the number of apprasiers(m) and (g) is 1, since there is only one range calculation

d2

d2 is obtained from data sheet

8 - (Measurement Systems Analysis-Gauge R&R)

TVS39A Sample Diode Tester 2016/4/23(Part No. and Name) (Gage Name) (Date) VR S31783 Roben(Characteristics) (Gage No) (Performed by)

37.1V~41.0V : TVS-600(Specification) Gage Type

Appraisers

K2



Measurement Unit Analysis %(TV) Total Variation

Trials23

r = Tria


Max. Avg. Min. 3sigma CpkA 1.27 1.58 mm 1.406 1.400 1.392 0.004 1.80 OKB 4.06 4.60 mm 4.121 4.115 4.107 0.004 1.83 OKC 2.29 2.83 mm 2.558 2.544 2.540 0.004 1.70 OKD 1.99 2.50 mm 2.120 2.110 2.100 0.008 1.81 OKE 0.90 1.41 mm 1.183 1.150 1.117 0.017 1.74 OKF 4.95 5.33 mm 5.066 5.052 5.048 0.004 1.70 OKG - 0.20 mm 0.021 0.013 0.009 0.003 1.74 OK

9 Production Part Approval - Dimensional ResultsSupplier name Taiwan Semiconductor Co.,Ltd.

Sample size(pcs) 30 Units weight(g) 0.06

Package M-SMA Measure Machine 3D Family (MCS02)

Item Spec LSL Spec USL UnitsMeasurement Results

Results



Prepared by ZhangYanyan Approved by Cui HeJun

Title IPQC Inspector Title Leader of QA


Max. Avg. Min. 3sigma Cpk

VF - 0.8 V 0.742 0.737 0.734 0.001 10.36 OK

VR 100 - V 118.2 116.0 113.5 0.729 2.75 OK

IR - 100 uA 0.585 0.357 0.270 0.036 15.17 OK

Supplier P/N

Sample size(pcs) 50

SS110 DS-610

Spec LSL Spec USL UnitsTest Results

Results

OQC Supervisor

Supplier code N/A

Item

10 Records of Material/Performance Test Results

Supplier name Taiwan Semiconductor Co.,Ltd. Part Name 1A, 20V - 150V Surface MountSchottky Barrier Rectifiers

Title Leader of QA

Measure Machine

***** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ****


Prepared by Xueping Approved by Cui HeJun

Title


Taiwan Semiconductor Co.,Ltd.

Supplier Manufacturing Site ShanDong, China

SS12~SS115

Item Test Test Conditions

1 Test Electrical characterization @25

2 External Visual Per AEC-Q101

3 Parameter Verification Electrical characterization @25

4 Pre-conditioning Per AEC-Q101

5 Temp. Cycling 150(+15,-0)/15mins, -55(-10,+0)/15mins / 1000 cycles

6 Autoclave (A.C) Ta=121215Psig(1.057kgf/cm2),RH=100%/96hrs

7 H3TRB Ta:852 R.H:855%&VR=80V/1000hrs

8 IOL TEST On/2mins, Off/2mins,15000cycles

9 H.T.R.B. 100% Rated VR (Ta=125) /1000hrs

10 ESD HBM:8KV(C=100pf R:1500)/6Pulses

11 Fwd Surge test Peak forward surge current 8.3ms halfsine-wave(30A)/1 Pulses

12 High Temp. Storage Life Ta=150 /1000hrs

13 Resist.to Solder Heat Ta=2605/10 secs

14 Solderability Ta=245 5/5sec

15 Thermal Resistance Mounted on Copper plate of 0.2" * 0.2"Copper plate heat sink

16 DPA Per AEC-Q101

Comment

Roben Approved by

Rel Lab Supervisor


Prepared by


Title Title QA Manager

Reason for Qual. Qualification plan According to

10 Production Part Approval - Material, Performance Test ResultsDiscrete Semiconductor Component Qualification Plan

Supplier Name General Specification TSC Data sheet

AEC-Q101 Rev.D

Venkat Kumar

Supplier Internal P/N Family Type M-SMA SKY

# Lots

3

3

3

3

3

3

3

3

3

3

3

3

3

3

S.S

552

552

552

308

77

3

3

10

10

2

77

77

77

77

30

10

Remarks

OK

OK

OK

OK

OK

77

30

OK

OK

OK

OK

OK

OK

OK

OK

OK

OK

OK


Part No.: SS110 DATE : 2016.4.30

STATION SAMPLE SIZE DEFECTS(%) MAX MIN AVG STD Cpk Spec./Tolerence

IQC InspectionElec, Function 200pcs 0 118.00 113.70 115.99 0.73 2.73 VB>110V@IR=1mA

200pcs 0 0.51 0.27 0.35 0.04 15.02 IR

1. TS16949 Certification

2. OHSAS18001 Certification

3. ISO14001 Certification

4. SONY Green Partner

5. ISO9001 Certification

6. UL certification

12 Qualified Laboratory Documentation

TSC Certification data list on the link below:

http://www.taiwansemi.com/en/quality/certification/ts16949-certification

http://www.taiwansemi.com/en/quality/certification/ohsas18001-certification

http://www.taiwansemi.com/en/quality/certification/iso14001-certification

http://www.taiwansemi.com/en/quality/certification/sony-green-partner

http://www.taiwansemi.com/en/quality/certification/iso9001-certification

http://www.taiwansemi.com/en/quality/certification/ul-certification




NA



13 Appearance Approval Report


NA



14 Sample Production Parts


NA



15 Master Sample


NA



16 Checking Aids


No specific customer requirements!



17 Customer-Specific Requirements


Part Name

Shown on Drawing Number.

Engineering Drawing Change Level Dated

Additional Engineering Changes Dated

Safety and/or Government Regulation Purchase Order No. Weight (g) 0.06

Checking Aid Number Engineering Change Level Dated N/A

SUPPLIER MANUFACTURING INFORMATION CUSTOMER SUBMITTAL INFORMATION

Supplier Name Customer Name/Division

Street Address Buyer/Buyer Code

China ApplicationCity Region Postal Code Country

MATERIALS REPORTINGHas customer-required Substances of Concern information been reported

Submitted by IMDS or other customer formate: Nickel(7440-02-0)

Are plastic parts identified with appropriate ISO marking codes?

REASON FOR SUBMISSION

Initial submission Change to Optional Construction or Material

Engineering Change(s) Sub-Supplier or Material Source Change

Tooling: Transfer, Replacement, Refurbishment, or additional Change in Part Processing

Correction of Discrepancy Parts produced at Additional Location

Tooling Inactive > than 1 year Other - please specify

REQUESTED SUBMISSION LEVEL (Check one)Level 1 - Warrant only (and for designated appearance items, an Appearance Approval Report) submitted to customer.Level 2 - Warrant with product samples and limited supporting data submitted to customer.Level 3 - Warrant with product samples and complete supporting data submitted to customer.Level 4 - Warrant and other requirements as defined by customer.Level 5 - Warrant with product samples and complete supporting data reviewed at supplier's manufacturing location.

SUBMISSION RESULTS

The results for dimensional measurements material and functional tests appearance criteria statistical process packageThese results meet all drawing and specification requirements: Yes No (If "NO" - Explanation Required)Mold / Cavity / Production Process

DECLARATION

I affirm that the samples represented by this warrant are representative of our parts, which made by a process that meets all Production PartApproval Process Manual 4th Edition Requirements. I further affirm that these samples were produced at the production rate of 11000pcs / 1 hours.I also certify that documented evidence of such compliance is on file and availiable for review.I have noted any deviations from this declaration below.EXPLANATION/COMMENTS: N/A

Is each Customer Tool properly tagged and numbered?

Organization Authorzed Signature Date

Print Name Phone No. FAX No. 886-2-8913-1788

Title HQ QRA Engineer E-mail [email protected]

Part Warrant Disposition:

Customer Signatur DatePrint Name


Customer Tracking Number(optional)


29th-Sep.-'16

Brian_Bie 886-2-89131588

FOR CUSTOMER USE ONLY (IF APPLICABLE)

Yangxin Everwell Electronic Co., LtdSite Code

He Liu Zhen

Yangxin Shandong 251807

N/A N/A

N/A N/A

N/A

N/A N/A

18 Part Submission Warrant (PSW)

1A, 20V - 150V Surface Mount Schottky Barrier Rectifiers Part Number SS12~SS115

N/A Org. Part Number N/A

Yes No

Approved Rejected Other

YesYes No

NoYes N/A


Yes No

Yes No N/A