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Applied Materials Confidential
STATUS AND
PERSPECTIVES OF
METALLIZATION
TECHNOLOGIES FOR HVM Marco Galiazzo
Process Eng Manager
| Applied Materials External Use
Agenda
c-Si Technology Roadmap
BCS Metallization Roadmap
Advanced Line Configuration
► Bi-PERC+SE
► DP/Knotless
► Shingling
Conclusion
| Applied Materials External Use
Metallization technology key to control
performances
c-Si Technology Roadmap
p-multi BSF up to 20.5% CE
p-mono BSF Up to 21.5% CE
Esa
tto
AO
I, F
LD
P, m
etr
olo
gy,
In
du
str
y 4
.0
p-multi PERC up to 21.5% CE
p-mono PERC up to 22.5% CE
Esa
tto
SE
m,
Se
lective
BS
F
LE
D F
lash
er
n-PERT/PERL up to 23% CE
Cu
sto
m E
sa
tto
Cu
sto
m a
uto
ma
tio
n
Heterojunction up to 24.5% CE
IBC up to 25% CE P
rint
Dry
an
d c
ure
Fu
ll cu
sto
m
so
lutio
ns
Un
iqu
e e
nab
lin
g B
accin
i te
ch
no
log
ies
Tool extendibility requirements
3
| Applied Materials External Use
FLDP Metallization Roadmap
4
FLDP at least -5um over SP in mass production, Aspect Ratio >0.5
FLDP
Mesh 325/16
360/16
380/14
440/13 11um wire
25 um opening
8 um opening
Screen images courtesy of Murakami
Ref: itrpv.net/Reports/Downloads
| Applied Materials External Use 5
FLDP Mass Production Data - Jinergy
Processing conditions
Cell type Cz-Si PERC
Screen opening 22 + 22 um
Mesh type 380-14
Finger width 35-38 um
Paste type A + A
Printing speed 300 mm/s
Flooding speed 800 mm/s
Electroluminescence <5 interruptions
FLDP providing <40 um finger width in mass production, no EL defects
Data used with customer permission
| Applied Materials External Use
Advanced Metallization Line Configuration
6
Back Ag Back Al Front 1st Front 2nd
Edge
±25 µm Pattern ±12.5 µm
Pattern ±12.5 µm
Pattern ±12.5 µm
Shingling
Bi-PERC SE FLDP/DuP
Metal
Process
Alignm.
4 items configuration commonly adopted, requirement for high precision for all steps
1 2 3 4
| Applied Materials External Use
Power Up +10% power from same module size
Fully compatible with all cell technologies
Energy yield Lower operating temperature means better performance ratio
Work with bifacial modules
Reliability No residual stress between metal and Si
Better aesthetics Premium for residential applications
7
Shingled Modules – Value Drivers Full area utilization
No ohmic losses Improved reliability
Shading Ohmic losses Gaps
Cracks Fatigue
Wöhrle, N. et al., Photovoltaics International 36, 2017
| Applied Materials External Use
Alignment for Shingling - Print
8
Shingling needs precise edge alignment for both front and rear metallization along print direction!
Y
X
±25 µ
m
±25 µ
m
±7.5
md
eg
OK NOK
ECA
Shingling cell layout
1 2 3
Offset measurement printing vs edge
| Applied Materials External Use 9
Alignment for Bifacial PERC – Print
laser
pri
nt
40 µm 240 µm
Bi-PERC requires pattern alignment on laser lines, reducing cell cost and increasing module yield
Align on laser lines
±12.5
µm
±5 m
deg
2
Y
X
Offset measurement Al print vs laser
Bi-PERC advantages:
• 60-70% bifaciality
• Low Al consumption
(<0.5g/cell)
Disadvantages:
• Decrease front
efficiency
Dullweber et al, 31st European Photovoltaic Solar Energy Conference, Hamburg, 2015
| Applied Materials External Use
Alignment for Selective Emitter - Print
10
Used with Customer permission Edge align Pattern align
% of cells with CE <21% 9.36% 0.08%
% of cells with CE <20.8% 1.59% 0 %
% of cells with CE <20.5% 0.28% 0 %
3
Pattern alignment allowing 0.1% CE gain over edge, no low efficiency cells tail
| Applied Materials External Use
FLDP for Shingling – Print
11
31.2 mm
Shingling 1/5 cell bb
bb
4 busbars cell
19.5 mm
bb
bb
High A/R fingers achieved in FLDP needed for shingling layout to reduce resistive losses
Lot Width
[µm]
Height
[µm]
A/R Weight
[mg]
FLDP
25um
36 21 0.58 131
SP 35um 45 18 0.4 120
+0.17% eff
SP EL
4 interrupts
FLDP EL
0 interrupts
4
| Applied Materials External Use
Knotless Dual Printing - Print
12
SP
Screens
DuP
Knotless
FLDP
Screens
Finger profile Average Excellent Good
Min linewidth 45 µm 40 µm 35 µm
Efficiency gain Ref. +0.15% +0.2%
Screen lifetime 40k 30k (100k BB) 50k
Screen price Low High (low BB) High (2x)
Paste cons. Mid Low (on BB) Mid
Applicable to SE Yes No Yes
EL Yield Low Mid High
CoO Mid Low Low
Knotless is a promising approach (in DuP) some concerns exist on EL and image deformation
4
Knotless finger morphology ‘No wire’ knotless
Knotless screen: 100um deformation
FLDP screen: stable image
| Applied Materials External Use 13
Advanced Line Results
Test results
• 60 cells equivalent modules
• Reference PERC 290W
• Average power for shingling 314W, max 323W
Advanced Line can deliver 325W shingled modules, TC800 reliability ok
initial
TC400
TC800
| Applied Materials External Use
Conclusion
Cell technology is constantly evolving: PERC, bi-PERC, SE+DP, knotless being
introduced to increase efficiency
FLDP targeting <35um lines in mass production next year
Module technology is (finally) evolving, bringing in new requirements
Metallization process is becoming more critical for all technologies
► Precise edge alignment front/rear
► Pattern alignment for bi-PERC and SE (fiducial, laser lines)
► FLDP for high A/R in shingling
Screen printing is still mainstream process...and has a long and bright future!
14
Thank you!