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The RCU2 ALICE TPC readout electronics consolidation for Run 2 Johan Alme Bergen University College, Norway on behalf of the ALICE-TPC collaboration TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

The RCU2 ALICE TPC readout electronics consolidation for Run 2

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The RCU2 ALICE TPC readout electronics consolidation for Run 2. Johan Alme Bergen University College, Norway on behalf of the ALICE-TPC collaboration TWEPP 2013, Perugia , Italy 23rd – 27th September 2013. ALICE detector. TPC detector. Present ALICE TPC Readout Electronics. - PowerPoint PPT Presentation

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Page 1: The RCU2  ALICE TPC readout electronics consolidation for Run 2

The RCU2 ALICE TPC readout electronics consolidation for Run 2

Johan AlmeBergen University College, Norway

on behalf of the ALICE-TPC collaboration

TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 2: The RCU2  ALICE TPC readout electronics consolidation for Run 2

2

ALICE detector

TPC detector

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 3: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Present ALICE TPC Readout Electronics

• TPC is divided into 2 x 18 Sectors:– 216 Readout Control Units (RCUs)– 4356 Front End Cards (FECs)

• The RCU is a complex system:– RCU Motherboard– Detector Control System (DCS) Board

• Embedded Linux platform

– Source Interface Unit Card (SIU)– In total 3 PCBs with 4 FPGAs

• 2 branches per RCU of a multidrop parallel bus– 18 – 25 FECs per RCU

• depending on position

– Peak bandwidth 200 MB/sJohan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

SIU

DCS

RCU

TTC (optics)Monitor/Control (Ethernet)

DDL link (optics - 160 MB/s)

FECs

– B

ranc

h A

FECs

– B

ranc

h B

GTL

bus b

ranc

h A

GTL

bus b

ranc

h B

Page 4: The RCU2  ALICE TPC readout electronics consolidation for Run 2

4

ALICE Run 2 Scenario• Run 2 is the period between Long Shutdown 1 (LS1) and Long Shutdown 2 (LS2)

– Planned start of Run 2: January 2015 • Run 2 will have higher interaction rates and higher track densities• Expected values for Pb-Pb collisions:

– Peak luminocity: 1 – 4 x 1027 cm-2s-1

– 8 – 30 kHz interaction rate• Current ALICE design value: 8 kHz

– 40% more data for central events• Event sizes increase from 65 MB to 90MB

• Higher readout speed needed• Higher radiation load => more Single Event Upsets

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Low multiplicity event from Run 1 High multiplicity event is completely crowded Run 2 will have even higher multiplicity

Page 5: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Motivation for Upgrade (I)• Data Rate Limitations:

– Current bottleneck: Bandwidth of the data bus• ≤ 200 MB/s per branch • Large (fixed) overhead - addressing and header

– Bandwidth of optical detector data link (DDL)• 160 MB/s

• Stability Limitations (Run 1 experiences):– End-Of-Run situations caused by radiation

related errors in the TPC electronics have been seen

– DCS board failures frequent – few per fill• Not “mission critical”

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Two read-out modes: sparse and full read-out.Read-out time for full TPC is defined by the slowest read-out partition

Page 6: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Motivation for Upgrade (II)

• Main message:– The readout performance is limited by the parallel bus architecture

• This reduces the expected performance for Run 2

– Conclusion: We need a faster data readout than what the current solution provides!

– Both main FPGAs on the RCU has a relatively high SEU susceptibility and almost no design-level protection • Not enough resources in the FPGAs to implement it

– Conclusion: With even the higher luminosity in Run 2 we need an improved radiation tolerance for the readout chain!

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 7: The RCU2  ALICE TPC readout electronics consolidation for Run 2

7

RCU2The ALICE TPC Consolidation Effort

• Constraints:– Time-budget– Reuse all exisiting interfaces

• TTC fiber• DAQ fiber• Ethernet cable• Power cable• GTL bus

– No change to form-factor and cooling

– Improve radiation tolerance– Increase data rate to meet Run2

conditions

• Solution – RCU2:– One single radiation tolerant FLASH based SmartFusion2 FPGA– FPGA design composed of a few building blocks largely based on existing modules– Backplanes - Double the number of readout branches to 4 branches– Nice to have functionality: Radiation Monitor

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

RCU2

TTC (optics)Monitor/Control (Ethernet)

DDL2 link (optics – 5 Gb/s)

FECs

Bran

ch B

O

A_ou

ter

A_in

ner

B_in

ner

B_ou

ter

FECs

Bran

ch B

IFE

CsBr

anch

AO

FECs

Bran

ch A

I

Page 8: The RCU2  ALICE TPC readout electronics consolidation for Run 2

8

Branch Partitioning• There are 6 readout partitions per TPC sector:

– 6 different sizes of backplanes– Two wings per partition

• Each wing is electrically split into two branches each with new branch naming convention– A A_inner (AI) | A_outer (AO)– B B_inner (BI) | B_outer (BO)

• Depending on partition – various number of FECs per branch– RP0: 5 + 4 + 4 + 5– RP1: 6 + 6 + 6 + 7– RP2: 5 + 4 + 4 + 5– RP3-RP5: 5 + 5 + 5 + 5

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

RP0

RP1

RP2

RP3

RP4

RP5

Page 9: The RCU2  ALICE TPC readout electronics consolidation for Run 2

9

RCU2 Backplanes• Two options:

1. Adapter card solution2. All in One solution

• Pros and Cons are considered for both options

• Prototypes will be produced for both options and decision taken afterwards.

• Location of connectors between RCU2 and branches are fixed:– Backward compatible with current

backplanes

Adapter card solution

All in One solution

Present backplanes

Electrical split of backplanes

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 10: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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RCU2 Hardware

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 11: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Microsemi Smartfusion2• The Smartfusion2 M2S050-

FG896 provides:– Radiation Tolerant Flash Cells– SECDED encoded DDR RAM

interface– Microcontroller Subsystem

with ARM Cortex M3 and useful peripherals• Platform for Embedded Linux

– 5 Gb/s operation in custom working mode on one lane of the SERDESIF for DDL2*

– Enough resources to have TMR on vital parts of the logic

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

* Not available before end of 2013

Page 12: The RCU2  ALICE TPC readout electronics consolidation for Run 2

12

RCU2 Hardware• Pictures shows first draft of RCU2 layout

• Important points:– Backward compatible regarding

placement of connectors– Reuse of cooling plates

• Constraints placement regarding heat dissipation and connector locations

• Power estimates– Typical values (current consumption):

• Ext 4V3: ~1.2A• Ext 3V3: ~4.3A

– The GTL bus drivers are by far the most power-hungry components on the board

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

RCU2 back

RCU2 front

Page 13: The RCU2  ALICE TPC readout electronics consolidation for Run 2

13

RadMon – Radiation Monitor• On the present RCU there is an additional FPGA

that counts and corrects SEUs in the configuration memory in the main FPGA– This acts as a radiation monitor!

• This is an interesting feature to keep for the RCU2:– Additional SRAM memory and Microsemi proASIC3

250 added to the RCU2• Not enough user-IOs on the smartFusion2 for this feature

– Low risk – design already done and proven*– Cypress SRAM – same as used for the latest LHC

RadMon devices• Extensively characterized in various beams (n, p, mixed) and

compared/benchmarked to FLUKA MC simulations

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

* Arild Velure ”Anvendelse av FPGA som preprosessor i en SRAM-basert nøytrondetektor”, Master Thesis 2011

Page 14: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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TTC interface• TTC = Timing, Trigger and Control

– System responsible for distribution of system clock and triggers• One of the challenges of the upgrade is that the TTCrx ASIC is out of stock

– This is the Trigger/Clock receiver chip for the Front end Electronics– No proven radiation tolerant TTCrx replacement exist!

• Solution:– HFBR 2316T Optical Receiver (suggested by TTC group)– MAX3748 Post limiting amplifier– Clock Data Recovery internally in FPGA

• Challenge: The clock signal must be recovered with high accuracy!

• This has been tested and verified in the lab with real-life setup – Radiation tolerance not yet proven

• Involves simple components with no configuration registers – Success very likely!

• Makes reuse of existing FPGA modules very easy

HFBR2316T

Post Limiting

Amplifier

Digital LVDSAnalog single ended CDR

Optical TTC signalClk 40MHz

Channel AChannel B

Smartfusion2

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 15: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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RCU2 FPGA design• The ARM Cortex M3 hosts an

Embedded Linux platform– New drivers are needed– Most software can be reused

• The FPGA PLD design is heavily based on the present RCU design with a few new features

• New readout scheme:– Ordering of channels by pads &

rows– Higher clock speed – Pause and recover

implementation– Discard of Junk data

• Important: Improve radiation tolerance

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Clock/Data Recovery Module

TTCClk 40Mhz

TTC Ch A

TTC Ch B

Trigger InterfaceModule

Altro Interface Module

FCBus

If

Branch A_inner

Altro Interface Module

FCBus If

Branch A_inner

Altro Interface Module

FCBus If

Branch B_inner

Altro Interface Module

Branch B_outer

DDL2 Interface (SERDES)

APB bus decoder

Arbiter

Result Unit

Instruction Sequencer

Data Assembler

Event Manager

CDH

DDL2

dat

a

ALTRO Raw data

ARM Cortex M3 CPU(Linux)

SoCPLD

PLD programminginterface

Hardcore interfacesSPI FLASH, DDR2/3 Mem

RadMON

Microsemi Flashpro

FPGA

TTC

DAQ

DCS

4 branches – 18-25 FECs

Smartfusion2

Triggers

Triggers CDH

TTC

Ch A

TTC

Ch B

RCU Bus

ChunkFIFO

4 x databusFC

Bus If BO

SPIcore

ADCsTemperature,

voltage, current monitoring

I2Ccore

ALTRO busFrontend Control Bus

HardwareID EEPROM

JTAG programming IF

Ethernet

FICIF core

FICIF core

System Controller

APB

CLK 160 MHz

JTAG IF

CLKManager125MHz

125MHz

Ported from RCU#1

New Module

Partly New Module

APB

Page 16: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Readout Scheme and Data Ordering (I)• One row of sensor pads are spread over

all 4 branches• Data pre-prossesing demands that data is

shiped ordered by padrow– Needed to find charge clusters along tracks

in the HLT/DAQ system• A chunk of data is defined:

– Number of channels belonging to same padrow and branch ordered by pad location

– The order of the channels within a chunk is configurable to match pad location

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Padrow N

Pad 0

Pad N

Row N without branches

Row N with 4 branches

Pad 0

Branch A_outer Branch A_inner Branch B_inner Branch B_outer

Pad N

Chunk A_outer Chunk A_inner Chunk B_inner Chunk B_outer

Padrow N

Page 17: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Readout Scheme and Data Ordering (II)

• Given average event size estimations for 0-10% central events (Run 2):– Max average size of one chunk is ~35 kBit

• Readout partition 1– Highest channel density – Largest data volume

– Bandwidth per branch: ~1.0 Gbit/s– Min. Readout speed per FIFO: 32 bit @ 125

MHz– Bandwidth RCU2 DDL2 interface: 4.0 Gbit/s

• Given internal memory resources:– Branch FIFO capacity: 4.7 average max size

chunks

• Simulations are planned to get exact figures

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Chunk 0_AO Chunk 0_AI Chunk 0_BI Chunk 0_BO

Chunk 1_AO Chunk 1_AI Chunk 1_BI Chunk 1_BO

FIFOAO

FIFOAI

FIFOBI

FIFOBO

Data Assembler+ Formatter

Branch AO Module Branch AI Module Branch BI Module Branch BO Module

Chunk N_AO Chunk N_AI Chunk N_BI Chunk N_BO

Readout List

Memory

Hit List Memory

ALTR

O IF

Mod

uleReadout

List Memory

Hit List Memory

ALTR

O IF

Mod

uleReadout

List Memory

Hit List Memory

ALTR

O IF

Mod

uleReadout

List Memory

Hit List Memory

ALTR

O IF

Mod

ule

DDL2interface

Chunk 0_AO

Chunk 0_AI

Chunk 0_BI

Chunk 0_BO

Chunk 1_AO

Chunk 1_AI

Round Robin Readout

Page 18: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Irradiation Campaigns• Component testing will be done at Oslo Cyclotron (in-house)

– ~30 MeV protons– 1 slot in October & 3 slots in November– We can not test all components individually (No time!)– A list have been made with components we find it critical to test

as early as possible• This is essentially ”new” components that we don’t have experience with,

or• Components in critical parts of the design (i.e. TTC chain)

– Testing of the smartFusion2• Effects of Single Event Transients can be a problem at higher clock

speeds*

• RCU2 system test in Uppsala or PSI early next year– 180 MeV Protons & Neutrons possible– Beamtime will be requested when we are certain to reach the

milestone

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

* https://indico.cern.ch/getFile.py/access?resId=0&materialId=slides&confId=152527

Page 19: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Summary & Outlook• The proposed upgrade would enable ALICE to collect a

significant larger amount of events in the central barrel at a moderate cost– Estimated cost: ~455 kCHF

• The read-out time for TPC events is estimated to be improved by a factor of up to 2.6– TPC will conform to the running scenario envisaged for Run 2

of ALICE– SystemC simulations are planned to confirm this figure

• Radiation tolerance will be improved

• Biggest challenge for the project is the tight time-budget constraint– At time of writing we are approximately on schedule

Timeline RCU2

Jan. 2013 LS1 starts

Apr. 2013 ALICE TPC LS1 consolidation effort decided

Oct. 2013

Apr. 2014

RCU2 HW prototype final review: start of production

Mass production start

Sep. 2014 Commisioning start

Jan. 2015 RUN2 start

Nov. 2013 Irradition campaigns - componentsBackplane prototype finished

Jan. 2014 RCU2 prototype functional testFPGA design first version ready

Feb. 2014 Irradition campaigns – system test

May 2014 Embedded software prototype finshed

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013

Page 20: The RCU2  ALICE TPC readout electronics consolidation for Run 2

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Thanks for Listening• RCU2 people (in no particular order):

Johan Alme ([email protected]) – Bergen University College, NorwayLars Bratrud, Jørgen Lien, Rune Langøy – Vestfold University College, NorwayKetil Røed, Chengxin Zhao – University of Oslo, NorwayKjetil Ullaland, Dieter Röhrich, Shiming Yang, Arild Velure, Inge Nikolai Torsvik,

Christian Torgersen – University of Bergen, NorwayAttiq Ur Rehman – COMSATS, Islamabad, PakistanTivadar Kiss, Ernö David – Cerntech, Budapest, HungaryChristian Lippman– GSI Darmstadt, GermanyAnders Oskarsson, Peter Christiansen, Lennart Osterman – University of Lund,

SwededHarald Appelshäuser, Torsten Alt , Attilio Tarantola – Goethe University

Frankfurt, GermanyFillipo Costa – CERN, Switzerland Taku Gunji – University of Tokyo, Japan

Johan Alme - TWEPP 2013, Perugia, Italy 23rd – 27th September 2013