1. MICRON'S PRODUCT RANGE BY OM-NANO TECH. (WE ARE DIRECT WITH MICRON)

2. THE PRODUCT RANGE INCLUDES

DRAM CHIPS.

3. DRAM MODULES. 4. NAND FLASH. 5. NOR FLASH. 6. SOLID STATE STORAGE. 7. PHASE CHANGE MEMORY. 8. MULTI-MEDIA CHIPS. 9. DRAM 10. DRAM CHIPS

SD RAM.

11. DDR SDRAM. 12. DDR2 SDRAM (DDRII SDRAM). 13. DDR3 SDRAM (DDRIII SDRAM). 14. RLD RAM 15. MOBILE LPSDR. 16. MOBILE LPDDR. 17. MOBILE LPDDR2. 18. PS RAM. 19. CELLULAR RAM 20. SDRAM 21. Micron in SDRAM

Synchronous DRAM is a generic name for various kind of DRAM that are synchronized with the clock speed that the microprocessor is optimized for.

22. Micron is havingone of the broadest SDRAM offerings in the industry. Several densities; extended operating temperatures; and various clock rates, cycle times, and package types make it easy to get just what you needits a relatively simple, cost-effective, and easy-to-implement memory option for both new and existing designs. 23. Micron's SDRAM comes in different Packages,Density,Depth,Width type :- 24. Density :- 512Mb.256Mb,64Mb,128Mb. 25. Depth :- 128Mb,16Mb,2Mb,32Mb,4Mb and 8 Mb. 26. Width :- x4, x8 , x16 and x32. 27. Voltage :- 3.3V. 28. Package :- TSOP,VFBGA,FBGA. 29. Pin Configuration :- 54 Pin, 54 Ball,60 Ball,90 Ball,86 Pin. 30. PART NO. INFO. 31. DDR CHIPS 32. Micron in DDR CHIPS

Compared to single Data Rate ( SDR ) SDRAM,the DDR SDRAM interface makes higher transfer rates possible by more strict control of timing of electrical data and clock signals.

33. It is a revolutionary and pioneering technologyenabling applications to transfer data on both the rising and falling edges of a clock signaland vastly improving performance over SDRAM. And because DDR continues to be an ideal choice for many new designs, were committed to supporting it for the long term. 34. Micron's DDR SDRAM comes in different Packages,Density,Depth,Width type :- 35. Density :- 512Mb,1GB,256Mb. 36. Depth :-16Mb,32mb,64Mb,128Mb and 256Mb. 37. Width :- x4, x8 , x16. 38. Voltage :- 2.5V and 2.6V 39. Package :- TSOP,DIE,FBGA and wafer 40. Pin Configuration :- 60 Ball,66Ball,54Ball 41. PART NO. INFO. 42. DDR2 SDRAM 43. Micron in DDR2 SDRAM

The double pumping data bus in DDR SDRAM,it allows higher bus speed and requires low power byrunning the internal clock at half the speed of data bus.

44. A wide array of capabilities makes our DDR2 an excellent memory choice for the diverse needs of many applicationsfrom automotive and industrial to server, consumer, networking, and computing. 45. Micron's DDR2 SDRAM comes in different Packages,Density,Depth,Width type :- 46. Density :- 512Mb,1GB,256Mb,2GB,4GB. 47. Depth :-16Mb,32mb,64Mb,128Mb and 256Mb and 512Mb. 48. Width :- x4, x8 , x16. 49. Voltage :- 1.5V and 1.8V 50. Package :- FBGA and V-FBGA 51. Pin Configuration :- 84Pin and 84 Bal, 60Ball, 63 Ball. 52. PART NO.INFO. 53. DDR3 SDRAM 54. Micron in DDR3 SDRAM

DDR3-SDRAM for double data rate type three synchronous dynamic random access memory is a DRAM with higher bandwidth interface.

55. DDR3 supports data rates of 1066 to 1600 MT/s, with clock frequencies of 533 to 800 MHz, respectivelyeffectively doubling the speed of DDR2. DDR3's standard 1.5V supply voltage cuts power consumption by up to 30% over DDR2. 56. Micron's DDR3 SDRAM comes in different Packages,Density,Depth,Width type :- 57. Density :- 1GB,2GB, and 4GB. 58. Depth :-64Mb,128Mb and 256Mb and 512Mb AND 1 GB 59. Width :- x4, x8 , x16. 60. Voltage :- 1.35V and 1.5V 61. Package :- FBGA. 62. Pin Configuration :-78 Ball, 82 Ball , 86 Pin, 96 Ball 63. PART NO. INFO. 64. RLDRAM 65. Micron in RLDRAM Memory

RLDRAM Memory is a Low-Latency,High bandwidth DRAM that is designed for demanding network task and L3 Cache as well as other applications that requires back to back READ/WRITE operations.

66. Our reduced-latency DRAM (RLDRAM- memory) is a high-performance, high-density memory solution that offers fast SRAM-like random access and outpaces even leading-edge DDR3 for sustained high bandwidth. 67. Micron's RLDRAM comes in different Packages,Density,Depth,Width type :- 68. Density :- 256Mb, 288Mb, 576Mb etc. 69. Depth :-16Mb,32Mb,4Mb,8 Mb and 64Mb. 70. Width :- X9 , X18 , X16 71. Voltage :- 1.8V 72. Package :- FBGA and BGA. 73. Pin Configuration :-144 Ball 74. PART NO. INFO. 75. LPDARM 76. Micron in LPDRAM CHIPS

LPDRAM has the low power consumption,High Performance and wide temperature ranges you need to give your customers great mobility and larger battery life.

77. Micron's Mobile LPDRAM is built to consume less power without sacrificing performance. It uses a JEDEC-standard 1.8V I/O power supply1.2V for LPDDR2which enables low standby current and low self refresh and extends battery life. 78. Micron's LPDRAM comes in different Packages,Density,Depth,Width type :- 79. Density :- 512Mb,256Mb,64Mb,128Mb,1GB,2GB,4GB. 80. Depth :- 128Mb,16Mb,32Mb,4Mb,64 Mb,8 Mb. 81. Width :-x16 ,x32, x64 82. Voltage :- 1.2V,1.8V,2.5V,3.3V ,1.8V. 83. Package :- VFBGA,POP 84. PART NO. INFO. 85. PSRAM ( PSEUDORAM ) 86. Micron in PSRAM CHIPS

PSRAM is a device that features an SDRAM like Architecture,Hidden Refresh Operation and SRAM Pin compatibility.

87. This hybrid memory delivers the best of SRAM and DRAM Features, Combining low power consumption and high speed Read and Write Functions. 88. Because CellularRAM memory also offers synchronous operations, fast access, and variable latency initial burst access, you get high throughput and excellent performance. It's an ideal solution for low-power, space-limited designs like MCPs, as well as mobile and industrial applications. 89. Micron's PSRAM comes in different Packages,Density,Depth,Width type :- 90. Density :- 4Mb,8Mb,16Mb,32Mb,64Mb,128Mb. 91. Depth :- 256k,512k,1Mb,2Mb,4Mb,8Mb. 92. Width :-x16 93. Voltage :- 1.7V - 3.6V 94. Package :- VFBGA. 95. Pin Count :- 48 Ball and 54Ball. 96. PART NO. INFO. 97. DRAM MODULES 98. DRAM MODULES

FBDIMM.

99. RDIMM. 100. VLPRDIMM 101. UDIMM. 102. SODIMM. 103. SOC DIMM. 104. SOR DIMM. 105. VLP SOR DIMM. 106. MINI RDIMM. 107. VLP MINI RDIMM. 108. FBDIMM 109. Micron in FBDIMM Module

FBDIMM is a memory technology which can be used to increase reliability and density of memory systems.

110. Fully Buffered DIMM Architecture introduces an Advanced Memory Buffer ( AMB ) between the memory controller and the memory module. 111. Micron's FBDIMM technology solves server challenges for youand for your customers. Micron's high-speed, high-density FBDIMMs can give you virtually unlimited scalability of density and high-bandwidth solutions, all with an extremely reliable channel protocol. 112. Micron's FBDIMM MODULE comes in different Packages,Density,Depth,Width type :- 113. Density :- 512MB,1GB,2GB,4GB,8GB 114. Depth :- 128Mb,256Mb,512Mb,64Mb. 115. Width :-x72 116. Voltage :- 1.5V 117. Pin Count :- 240 Pin. 118. PART NO. INFO . 119. RDIMM 120. Micron in RDIMM

Registered Memory modules have a register between the DRAM Modules and the system's memory controller. They place less electrical load on the memory controller and allow single systems to remain stable.

121. Micron's RDIMMs are built with what may be the industrys most reliable memory components. RDIMM features like registers, buffers, and ECC help ensure data integrity at both the device and the system level. 122. Micron's RDIMM MODULE comes in different Packages,Density,Depth,Width type :- 123. Density :- 64Mb, 256Mb,512MB,1GB,2GB,3GB 124. Depth :- 128Mb,256Mb,512Mb,64Mb and 32Mb. 125. Width :-x72 126. Voltage :- 1.8V 127. Pin Count :- 240 Pin. 128. PART NO. INFO. 129. VLPRDIMM 130. Micron in VLPRDIMM

Micron's VLPDIMM use up to 67% less board space than standard modules, making thedesign more compact, slashing thermal power consumption by improving airflow, and delivering the performance that basicallyneed's by the customer.

131. Microns high density, DDR , DDR2, and DDR3 VLP RDIMMs significantly boost overall telecom, networking, and computing blade server memory capacities while remaining compatible with existing RDIMM sockets. These VLP RDIMMs are available in 512MB-to-8GB densities. 132. Micron's VLPRDIMMMODULE comes in different Packages,Density,Depth,Width type :- 133. Density :- 512MB,1GB,2GB,4Gb and 8Gb. 134. Depth :- 128Mb,256Mb,512Mb,64Mb. 135. Width :-x72 136. Voltage :- 1.8V, 1.35V, 2.5V 137. Pin Count :- 184 Pin and240 Pin. 138. PART NO. INFO. 139. UDIMM 140. Micron in UDIMM

Unbuffered DIMMs are the ideal module for high-speed, low-cost computer systems. Our UDIMMs come in SDRAM, DDR, DDR2, and DDR3 solutions and offer data rates as high as 1333 MT/s, and provide parity and ECC capability. Theyre an industry standard in high-volume production, offering a great balance of price and performance.

141. Our DDR2-1066 and DDR3-1333 memory boasts some of the fastest data rates in the businesseasily meeting industry demand for increased speeds and improved bandwidth. And because of our manufacturing efficiencies, the DDR2 and DDR3 UDIMMs we build offer some of the most compelling value in the industry today. 142. Micron's UDIMM MODULE comes in different Packages,Density,Depth,Width type :- 143. Density :-32Mb,64Mb,128Mb, 512MB,1GB,2GB,4Gb. 144. Depth :- 4Mb,8Mb,32Mb,64Mb,128Mb,256Mb,512Mb. 145. Width :-x64 146. Voltage :- 1.5V,1.8V, 2.5V,2.6V,3.3V. 147. Pin Count :-100 Pin, 168Pin,184 Pin and240 Pin. 148. PART NO.INFO. 149. SODIMM 150. Micron in SODIMM

With densities of up to 4GB and data rates as high as 1333 MT/s, our small-outline DIMMs (SODIMMs) are an excellent choice for space-limited computing designs, including netbooks and mobile internet devices.

151. We work with motherboard manufacturers to validate our SODIMMs and support a wide array of mobile computing platforms. In particular, Intel has certified us to run qualification tests for Intel-based motherboards, ensuring that a Micron memory solution like our DDR3 SODIMMs will work with the motherboard you select. These tests match Intels Full & Basic Functional Test Procedures. 152. Micron's SODIMM MODULE comes in different Packages,Density,Depth,Width type :- 153. Density :- 64Mb,128Mb, 512MB,1GB,2GB,4Gb. 154. Depth :- 4Mb,8Mb,16mB,32Mb,64Mb,128Mb,256Mb,512Mb. 155. Width :-x64 156. Voltage :- 1.5V,1.8V, 2.5V,2.6V,3.3V. 157. Pin Count :- 144 Pin, 200Pin, 204Pin 158. PART NO. INFO. 159. SORDIMM 160. Micron in SORDIMM

Micron'ssmall-outline registered DIMMs (SORDIMMs) provide data reliability through reduced address, command, control, and clock signal loading; temperature monitoring--all in a narrow form factor.

161. Micron have developed our SORDIMMs with the networking and communications industries in mind. They understand that these applications demand low latency, small memory footprints, pristine signal integrity, and stringent thermal specifications. And our SORDIMMs deliver--the right specifications and great reliability in a compact form factor. 162. Micron's SORDIMM MODULE comes in different Packages,Density,Depth,Width type :- 163. Density :- 512MB,1GB,2GB,4Gb. 164. Depth :-64Mb,128Mb,256Mb,512Mb. 165. Width :-x72 166. Voltage :- 1.8V 167. Pin Count :- 200Pin 168. PART NO. INFO. 169. MINI DIMM 170. Micron in MINI-DIMM

Micron's DDR2 and DDR3 Mini-DIMMs are available in a range of densities and configurations to suit a variety of designs. All of Micron's Mini-DIMMs come with ECC to ensure the data integrity that helps make them the foundation for reliable high performance in networking platforms.

171. With Micron'sMini-DIMMs, Customers get all the benefits of our DRAM design and manufacturing expertise plus the high-quality test methodologyenabling the clientsto design smaller form factor routers, switches, bridges, and hubs that can deliver peak performance. 172. Micron's MINI-DIMM MODULE comes in different Packages,Density,Depth,Width type :- 173. Density :- 512MB,1GB,2GB,4Gb. 174. Depth :-64Mb,128Mb,256Mb,512Mb. 175. Width :-x72 176. Voltage :- 1.8V 177. Pin Count :- 244Pin 178. PART NO. INFO. 179. VLP Mini - DIMM 180. Micron in VLP Mini-DIMM

Micron's high-density, very low profile (VLP) Mini-DIMMs significantly boost overall telecom, networking, and computing blade server memory capacities and are compatible with the ATCA standard.

181. At the heart of these modules is some of the worlds most advanced DRAM technologydesigned so that your router, hub, switch, or bridge can be faster, smaller, and much more reliable. In fact, the VLP Mini-DIMM is specifically made for networking. And Micron was the first memory maker to offer the VLP Mini-DIMMs that are now an industry standard. 182. Micron's MINI-DIMM MODULE comes in different Packages,Density,Depth,Width type :- 183. Density :- 512MB,1GB,2GB,4Gb. 184. Depth :-64Mb,128Mb,256Mb,512Mb. 185. Width :-x72 186. Voltage :- 1.8V 187. Pin Count :- 244Pin 188. PART NO. INFO. 189. NAND FLASH 190. NAND FLASH TYPES:-

HIGH SPEED NAND

191. SERIAL NAND 192. ENTERPRISE NAND 193. HIGH SPEED NAND 194. Micron in High Speed NAND

Micron'sHigh-Speed NAND delivers the fastest read and write throughputs ever for a NAND Flash deviceup to five times the performance of existing SLC NAND devices. And compatibility with the ONFI asynchronous/synchronous interface enables both backward-compatible and forward-looking designs.

195. With Micron'sHigh-Speed NAND Flash memory, Customersdesigns will achieve ultra-fast access times, transferring content between devices like computers, digital cameras, MP3 players, and cell phones much faster than standard SLC NAND. 196. Micron's High Speed NAND FLASH comes in different Packages,Density,,Width type :- 197. Density :- 8GB,16GB and 32GB. 198. Width :-x8 199. Voltage :- 3.3V 200. Package :- VFBGA 201. Pin Count :- 100 Pin 202. PART NO. INFO . 203. ENTERPRISE NAND 204. Micron in Enterprise NAND

Micron's Enterprise NAND is high-endurance NAND Flash optimized for intensive enterprise storage applications where endurance is the top priority. It far surpasses standard cycle rates and it does it with an industry-standard package, without requiring any design or process changes for existing products.

205. Enterprise NAND is a high-endurance NAND product family optimized for intensive enterprise applications. Breakthrough endurance, coupled with high capacity and high reliability (through low defect and high cycle rates), make Enterprise NAND an ideal storage solution for transaction-intensive data servers and enterprise SSDs 206. Micron's Enterprise NAND FLASH comes in different Packages,Density,,Width type :- 207. Density :- 64Mb,128Mb,256Mb.. 208. Width :-x8 209. Voltage :- 3.3V 210. Package :- VBGA,TBGA,FBGA 211. Pin Count :- 100 Ball. 212. PART NO. INFO. 213. SERIAL NAND 214. Micron in Serial NAND Flash

Micron's Serial NAND Flash is the lowest-cost, highest-density serial peripheral interface (SPI) solution. It can help improve performance, increase density, eliminate a controller or card slot, and simplify the clientsBOM.

215. With four times or more the density of SPI NOR, Serial NAND is a great alternative to NOR for many embedded designs. And since Serial NAND has the lowest cost-per-megabit of any serial Flash solution, its also a great way to lower your BOM cost. 216. Micron's SerialNAND FLASH comes in different Packages,Density,,Width type :- 217. Density :- 1GB 218. Width :-x1 219. Voltage :- 3.3V 220. Package :- VFBGA 221. Pin Count :- 63 Balls. 222. PART NO. INFO. 223. NOR FLASH 224. NOR FLASH TYPES :-

PARALLEL NOR FLASH

225. SERIAL NOR FLASH. 226. PARALLEL NOR FLASH 227. Micron in PARALLEL NOR

Micron's broad portfolio of parallel NOR products is designed to provide advanced memory solutions for a diverse array of leading-edge mobile designs. Empower your data-intensive applications with proven reliability and fast memory execution, while staying on target with design costs.

228. Todays applications demand an unprecedented combination of featureshigh performance, high density, high reliability, and low-power operation. Strike a balance among performance needs, design requirements, and cost by equipping your demanding platforms with our reliable, high-performance parallel NOR. 229. Micron's parallel NOR solutions are constructed to meet the design requirements of consumer and mobile products such as cell phones, smart phones, e-readers, GPS/navigation, and other portable, hand-held multitasking applications 230. Micron's PARALLEL NORcomes in different Packages,Density,Width type :- 231. Density :- 1Mb,2Mb,4Mb,8Mb,16Mb,32Mb,64Mb,128Mb,256Mb,512Mb. 232. Package :-TSOP,TBGA,FBGA,TFBGA. 233. Width :-X8 and X16. 234. Voltage :- 2.7V,3.6V,1.7V,2.0V 235. Pin Count :- 44Pin,48Pin,56Pin,64Ball etc. 236. PART NO. INFO. 237. SERIAL NOR FLASH 238. Micron in SERIAL NOR

With the most comprehensive portfolio of serial NOR Flash in the industry, Micron deliver a broad range of cost-effective devices that add value to both high- and low-end applications. Improve your design with the ideal blend of fast system speeds, low power consumption, and a small package footprint.

239. Our serial NOR solutions are purpose-built to meet the needs of consumer electronics, industrial, wired communications, and computing applications. Our industry-standard packaging, pinouts, command sets, and chipset compatibility are easy to design in, saving valuable development time while ensuring compatibility with existing and future designs. 240. Micron's Serial NOR Flash comes in different Packages,Density,Width type :- 241. Density :- 1Mb,2Mb,4Mb,8Mb,16Mb,32Mb,64Mb,128Mb,256Mb,512Mb. 242. Package :- U-PDNF-8, SO-8 , V-PDNF-8,SO-16 243. Width :-X1, x2 , X4. 244. Voltage :- 2.7V,3.6V,1.7V,2.0V 245. Pin Count :- 44Pin,48Pin,56Pin,64Ball etc 246. PART NO. INFO. 247. SOLID STAGE STORAGE 248. SSD TYPES :-

CLIENT SSD

249. ENTERPRISE SATA SSD 250. ENTERPRISE PCIe SSD. 251. EMBEDED SSD. 252. CLIENT SSD 253. Micron in CLIENT SSD'S

Micron's RealSSD drives bring groundbreaking performance and optimum portability to laptops and other computing applications.

254. Our C400 SSDs utilize the leading SATA 6 Gb/s interface and third-generation flash translation layer (controller NAND management algorithms). These highly sophisticated NAND management features enable our drives to deliver sequential read and write speeds of up to 500 MB/s and 260 MB/s, respectively. 255. Micron's CLIENT SSD comes in different Packages,Density,Voltagetype :- 256. Density :- 64GB,128GB,256GBand 512GB. 257. Voltage :- 3.3V AND 5V 258. Package :- 1.8 SSD AND 2.5 SSD 259. Operating Temp :- 0 to 70 degrees. 260. PART NO. INFO. 261. ENTERPRISE SATA SSD 262. Micron in ENTERPRISE SSD

Micron's enterprise-class SATA drives are optimized to deliver high performance, high endurance, and low power consumption for enterprise boot drive and data storage applications.

263. Micron's enterprise-class RealSSD drives leverage the SATA 6 Gb/s interface to provide outstanding performance for enterprise blade servers and system storage. 264. Micron's ENTERPRISE SSD comes in different Packages,Density,Voltagetype :- 265. Density :- 50GB,100GB,200GBand 400GB. 266. Voltage :-5V 267. Package :- 2.5 SSD 268. Operating Temp :- 0 to 70 degrees. 269. PART NO. INFO. 270. ENTERPRISE PCIe SSD 271. Micron in PCIe SSD

Micron's enterprise PCIe drive delivers market-leading READ speed, best-in-class reliability, and remarkable power efficiency for enterprise applications that demand frequent, intensive READ access.

272. Micron's low-latency, high-IOPs RealSSD drive is a real overachiever, providing the highest READ throughput in the industry, combined with extended endurance, exceptional reliability, and remarkable power efficiency. Its an ideal solution for optimizingapplications with heavy READ access, from Web accelerators to media streaming and video-on-demand servers, as well as data warehousing. 273. Micron's ENTERPRISE PCIe SSD comes in different Packages,Density,Voltagetype :- 274. Density :- 350GB AND 700GB. 275. Voltage :-12V 276. Package :- HHHL PCIe 277. Operating Temp :- 0 to 50 degrees. 278. PART NO.INFO. 279. EMBEDED SSD'S 280. Micron in EMBEDED SSD'S

Micron's eUSBs are complete solutions for embedded boot-up applications. Theyre smaller, more durable, and easier to design in than HDDs.

281. Rugged, reliable, cost-effective, and small, Micron's RealSSD devices are designed to give our customers a choice in embedded data storage. And these embedded USBs are a better choice than hard disk drives (HDDs)for many reasons. 282. Micron's eUSBs are a lot smaller, more durable, and easier to design in than HDDs. They combine flexibility, performance, and fast time-to-market, and they cost less than traditional HDDs. 283. Micron is known for advanced and innovative technology, and our eUSBs are a great example of a better, faster, and less expensive NAND solution that offers distinct competitive advantages for solid state designs 284. Micron's EMBEDED SSD comes in different Packages,Density,Voltagetype :- 285. Density :- 1GB,2GB,4GB,8GB,16GB. 286. Voltage :-5V and 3.3V 287. Package :- eUSB 288. Operating Temp :- 0 to 70 degrees and -40 to +85 degrees.. 289. PART NO. INFO. 290. MULTI CHIP PACKAGE 291. MULTIMEDIA CHIPS

MULTI MEDIA PACKAGES.

292. e-MMC. 293. MULTI MEDIA PACKAGES 294. Micron in Multimedia Packages

Whether youre trying to minimize power consumption, maximize board space, increase speed, or do everything at once, Microns MCPs can drive your design no matter the application. Our fully tested, stackable MCPs and PoPs are the small form factors your mobile designs need.

295. Form factor, speed, poweryour mobile customers want all three. With Micron's MCPs you can respond to customers' ever-increasing demands without compromising leading-edge performance. 296. Micron's MULTIMEDIA PACKAGEScomes in different Packages,Density,Voltagetype :- 297. Density :- 1GB,2GB,4GB,8GB,16GB. 298. Voltage :-5V and 3.3V 299. Package :- eUSB 300. Operating Temp :- 0 to 70 degrees and -40 to +85 degrees.. 301. PART NO. INFO. 302. eMMC 303. Micron in eMMC

Micron's eMMC embedded memory combines a high-capacity NAND Flash memory device with a high-speed, MultiMediaCard (MMC) controller in a single package. Find out how you can get the performance and reliability you need and still get to market quickly using this cost-effective embedded memory.

304. Micron's eMMC embedded memory essentially transforms a program/erase/read device like NAND Flash into a simple write/read memory. 305. Micron's eMMC MCP comes in different Packages,Density,,Width type :- 306. Density :- 1GB,2GB,4GB,8GB,16GB,32GB. 307. Width :-x8 308. Voltage :- 3.3V 309. Package :- LFBGA,FBGA 310. Pin Count :- 169 Ball, 153Ball, 100Ball etc. 311. PART NO. INFO. 312. PHASE CHANGE MEMORY 313. TYPES OF P.C.M.

Serial PCM

314. Parallel PCM. 315. Micron in Serial PCM

Micron's phase change memory (PCM) combines the best traits of traditional memory technologies into a single, nonvolatile device with a straightforward serial interface. Ideal for high-density SPI architectures, P5Q products simplify design, improve system performance, and extend the capabilities of a wide variety of applications.

316. The Serial PCM is purpose-built to meet the memory requirements of embedded systems, delivering multiple I/O capability and compatibility via familiar SPI NOR interfaces. 317. Micron's Serial PCM comes in different Packages,Density,Depth,Width type :- 318. Density :- 512MB,1GB,2GB,4Gb. 319. Depth :-64Mb,128Mb,256Mb,512Mb. 320. Width :-x72 321. Voltage :- 1.8V 322. Pin Count :- 200Pin 323. PART NO INFO 324. Micron in Parallel PCM

Micron's Parallel phase change memory (PCM) combines the best traits of traditional memory technologies into a single, nonvolatile device with a performance-boosting parallel interface. Ideal for high-end high performance embedded applications, second-generation P8P products increase performance, improve endurance, and simplify software management.

325. Now in its second generation, this device is designed specifically for performance-intensive embedded applications, combining the benefits of phase change memory with the compatibility of a NOR-like parallel interface. 326. Micron's Parallel PCMcomes in different Packages,Density,Depth,Width type :- 327. Density :- 512MB,1GB,2GB,4Gb. 328. Depth :-64Mb,128Mb,256Mb,512Mb. 329. Width :-x72 330. Voltage :- 1.8V 331. Pin Count :- 200Pin 332. PART NO. INFO. 333. A BRIEF ABOUT OM NANO

We are leading manufacturer and supplier of Computer Memory (DRAM / SDRAM) Modules having ISO 9001:2008 Certified Facility in India (Noida near Delhi). We are part of well-known "Om" group having Global Headquarters in Singapore with offices in USA, Singapore, Taiwan, China and India. We also have associates in Australia, UK, Switzerland, Korea, Malaysia, Indonesia and South Africa. Besides these countries the group also have customers in Brazil, Canada, Spain, Italy, Greece, Dubai, Saudi Arabia, Russia, Egypt, New Zealand, Nepal, Thailand etc.

334. Our product range includes::- 335. (1) Computer Memory Modules: (a) SDR -128MB, 256MB and 512MB, (b) DDR - 256MB, 512MB and 1GB.(c) DDR-II - 512MB, 1GB and 2GB.(d) DDR-III - 1GB and 2GB. 336. (2) Flash USB Pen Drive - 256MB, 512MB, 1GB, 2GB, 4GB, 8GB and 16GB. 337. (3) Memory Cards - Micro SD Cards, Camera Cards and Flash Cards. 338. (4) Industrial ICs/Chips: (a) SDRAM - 2x16, 4x16, 16 X 16, 8 X 32, 16 X 32, 64 X 8, (64mb, 128mb, 256mb, 512mb) 339. FOR MORE INFORMATION

For more information about Micron:-

340. Please Visit :- 341. http:// www.micron.com 342. For more information about Om-Nano Tech :- 343. Please Visit :- 344. http://www.om-nanotech.com 345. CREDITS

Conceptualization and Matter by :-

346. Manish Tiwari. 347. OM-NANO TECH PVT. LTD. 348. 09999514354. 349. Email ID :-[email_address] 350. Background Design and Development by : - 351. Dheeraj Agrawal 352. OM-NANOTECH PVT. LTD. 353. 09999351037. 354. Email ID :-[email_address]