Micromegas (Ingrid)+ TimePix 8-chip modules

[email protected] Astrophysics Detector Workshop – Nice – November 18th, 2008 1

Micromegas (Ingrid)+TimePix Micromegas (Ingrid)+TimePix 8-chip modules8-chip modules

LCTPC Collaboration Meeting - DESY

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D. Attié, Y. Bilevych, P. Colas, X. Coppolani, E. Delagnes, H. van der Graaf, M. Riallot, Jan Timmermans

[email protected] 2LCTPC Collaboration Meeting – DESY – September 21, 2009

•Module TimePix + Integrated Micromegas (Ingrid)

•Electronic tests

•Design of a new board

•Status of the Ingrid

•Prospects

OutlineOutlineOutlineOutline

TimePix/Ingrid PannelTimePix/Ingrid PannelTimePix/Ingrid PannelTimePix/Ingrid Pannel

Vue de dessusBottom side

•TimePix pannel with a 2x4 matrix of TimePix chips + InGrids for the TPC Large Prototype

•6-layers PCB

•Transfert card for VHDCI cable

23 cm


First testsFirst testsFirst testsFirst tests

•8 TimePix chips have been connected on the PCB

- issues for the wire bonding

two chips were broken by the bonding factory

•Electrical test- an error of routing was found and corrected using external wires

- power supply by MUROS only was insufficient (0.2 A per puce)

3 voltage to stabalize (LV) to 2.2V



Tests with 2 chipsTests with 2 chipsTests with 2 chipsTests with 2 chips

•The 8 chips were removed and replaced by only two

•New test at CERN (January 20th, 2009)- the hardware was validated- but, correction needed in the official software Pixelman

-0,2

0

0,2

0,4

0,6

0,8

1

1,2

-0,005 0,000 0,005 0,010 0,015 0,020 0,025 0,030 0,035 0,040

Time (s)

Vo

ut (

V)

Penable_in Pdata_in Penable_1-2 Pdata_1-2 Pdata_out Pfclk_out Penable_out

Design of the new boardDesign of the new boardDesign of the new boardDesign of the new board


Top view

Side view

Mezzanine

Connector

New card in progressNew card in progressNew card in progressNew card in progress


•A new card was designed taking into account what we learn with the previous

•New design : - the 2x4 matrix is place on top a mezzanine to make easier the wire bonding- power regulators was implemented

•Waiting for Ingrid

•Should be tested on the Large Prototype TPC by the end of this year or beginning of next year

NIKHEF: emphasis on IngridsNIKHEF: emphasis on IngridsNIKHEF: emphasis on IngridsNIKHEF: emphasis on Ingrids


• QUAD chips board tested OK in 2008

• Equiped with Ingrids in June ‘09

•Could become standalone “traveling” TA infrastructure

•within RELAXD project: 4x4 Medipix chips in compact mounting

•will evolve in 8x8 Timepix chips for EUDET


NIKHEF prospectsNIKHEF prospectsNIKHEF prospectsNIKHEF prospects

•within RELAXD project: 4x4 Medipix chips in compact mounting

•will evolve in 8x8 Timepix chips for EUDET

Ingrid production statusIngrid production statusIngrid production statusIngrid production status

Several single chip systems produced for:

•Test detector performance with different thickness of Si3N4 protection layers (in DESY T22 beam)

•Test efficiency and resolution in Gossip-like geometry (only 1.5 mm gas layers) in CERN testbeam

- Data analysis in progress- Sometimes still discharges that kill Timepix chips;

some indication it is on the ‘outside’ edges of Ingrid/Timepix


ConclusionsConclusionsConclusionsConclusions

•The electrical tests of the first board were helpful

•Waiting for Ingrids to equip the new board when it will be ready

•Next step: install and test it in the LP1 (2010)

•Studies in parallel with RELAXED project/Gossip at NIKHEF

8×8 matrix in LP1


The TimePix CollaborationThe TimePix CollaborationThe TimePix CollaborationThe TimePix Collaboration

•Saclay CEA/IRFU David AttiéPaul ColasMaxim Titov

Xavier CoppolaniEric DelagnesArnaud GiganonYannis GiomatarisMarc Riallot

•NIKHEF Arno AartsYevgen BilevychHarry van der Graaf

Martin FransenJan TimmermansJan Visschers

•Univ. Twente/Mesa+ Victor Blanco Carballo

Cora SalmJurriaan SchmitzSander Smits

•Univ. Freiburg Andrea BambergerUwe Renz

• Univ. Bonn Klaus DeschJochen KaminskiFrederik Klöckner

•CERN Erik HeijneXavier LlopartMedipix Consortium

TimePix + Standard Micromegas, 90Sr

In Ar/Iso-C4H10 5%


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Micromegas (Ingrid)+ TimePix 8-chip modules