Overview of PSMA

PresenterErnie Parker, Chairman

Power Sources Manufacturers Association

• Founded in 1984• One of the three co-sponsors of the IEEE Applied Power Electronics

Conference (APEC), the premier power electronics conference • Forum for discussing and progressing issues of common concern to

the power sources industry, for the benefit of manufacturers, suppliers and users alike

Educate the electronics industry, academia, as well as government and industry agencies through: Published reports Educational seminars Technical conferences and workshops Conference exhibits

Our Mission: To integrate the resources of the power sources industry globally to more effectively and profitably serve the needs

of the power sources users, providers, and PSMA members

PSMA Organization

POWER ELECTRONICS

PACKAGINGCOMMITTEE

SEMICONDUCTOR COMMITTEE

MARKETING COMMITTEE

ALTERNATIVE ENERGY

COMMITTEE

ENERGY EFFICIENCYCOMMITTEE

INDUSTRY-EDUCATIONCOMMITTEE

TECHNOLOGY ROADMAP

COMMITTEE

ADVISORY COUNCIL

PSMA’s work is done by industry leaders on a volunteer basis.

ENERGY HARVESTINGCOMMITTEE

MAGNETICSCOMMITTEE

CAPACITOR COMMITTEE

TRANSPORTATION POWER

ELECTRONICS COMMITTEE

SAFETY & COMPLIANCECOMMITTEE

Management CommitteeBOD- Board of Directors

A forum for discussing common concern to the power sources industry, for the benefit of manufacturers, suppliers and users alike

Major Projects

International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) – planned for June 2016

Power Supply in Package/Power Supply on Chip – completed 2 reports – held 4 Workshops – another planned in 2016

Engineering Efficient Buildings Workshop – Spring 2014 & 2015

Energy Efficiency Data Base – continuously updated

Nanotechnology Courses - PSMA Nano 100, PSMA Nano 200, and PSMA Nano 300 E-Learning Colloquium

Power Technology Roadmap 2015 – Workshop and Report

APEC Student Travel Support – now jointly sponsored by IAS and PELS

Publish Out of Print Magnetics Books

Recent PSMA Publications

PSMA Power Technology Roadmap (2013, 2015)

Technology Report - Current Developments in 3D Packaging with Focus on Embedded Substrate Technologies (2015)

Power Electronics and Electrical Challenges for Energy Efficient Buildings - A Report on the Energy Efficient Workshop (2014)

Technology Report - 3D Power Packaging (2014)

Are You Smart Enough for the Smart Grid? PSMA-EPRI Workshop Report (2013)

Soft Ferrites – Properties and Applications by E. C. Snelling – Reprint (2013)

Working With Others

CEC - California Energy Commission CPSS - China Power Supply Society ECIA – Electronic Components Industry Association Emerge Alliance Energy Star EPA - Environmental Protection Agency EPRI - Electric Power Research Institute EPSMA - European Power Supply Manufacturers

Association iNEMI - International Electronics Manufacturing Initiative NYSERDA - New York State Energy Research and

Development Authority PEIC – Power Electronics Industry Collaboration PICMG – PCI Industrial Computer Manufacturers

Group TTA – The Transformer Association

Some of the 42 Regular Member Companies (183 total members)

PSMA Power Technology Roadmap Committee Co-Chairs:

Aung Thet Tu

2015 Power Technology RoadmapTrends 2014 – 2019

Dhaval Dalal

Eric Persson

Conor Quinn

Co-chairs for 2013 and 2015 Technology Roadmaps

Co-chairs for 2017 Technology Roadmap in work

• Power Technology Roadmap► What/Why (Purpose)► When/How (Methodology)► Retrospective Analysis

• 2015 Results► Structure ► Product Technology Trends ► Components Trends► Application Trends and Emerging Technologies

Outline

PSMA Power Technology Roadmap

Capture Trends Driving New Technology in Power Conversion

• 1st Workshop Generated Roadmap in 1994► Workshop was led by Bob Freund, AT&T Bell Laboratories

• Subsequent Roadmap efforts have evolved by learning from doing and by improved participation

• Since 2009 roadmap has been updated every other year

• Purpose of Technology Roadmap is Communication

Report StructureCan best be summarized by

2015 Report Content

Application Trends►Automotive►Computing►Consumer► Industrial►Lighting►Medical►Military/Aerospace►Motor Control►Portable Charging►Renewables

Emerging Technologies►Power SoC►Server Power►3D Power

Packaging►Additive

Manufacturing►Magnetics►High Power

Wireless Transfer►Smart Grid►Energy Storage►Smart Building

2017 - 2019 Trend Tables►Ac-Dc front-end►Ac-Dc external► Isolated Dc-Dc►Non-Isolated Dc-Dc►Non-Isolated Dc-Dc

power supply in a package (PSiP)

Report Tables

Three Classes of MetricsFo

ur P

rodu

ct

Cat

egor

ies

Ac-

Dc

Fron

t End

Po

wer

Sup

plie

s

Ac-

Dc

Exte

rnal

Po

wer

Sup

plie

s

Isol

ated

Dc-

Dc

Con

vert

ers

Non

isol

ated

Dc-

Dc

Con

vert

ers

General Requirements

Design and Components

Packaging, Thermal Management

Ac-Dc Front End Efficiency

• Actual is above or at projected in both

• Gap between high-end and low-end smaller in 48V

• Consistency in projected numbers (2010/15)

• 12 V high-end projections catching up to 48 V

80828486889092949698

2003 2005 2007 2009 2011 2013 2015 2017 2019 2021

Effic

ienc

y (%

)

Year

Efficiency @ 48 V Output

Actual (Low-End) Projected (Low-End)

Actual (High-End) Projected (High-End)

84

86

88

90

92

94

96

98

2003 2005 2007 2009 2011 2013 2015 2017 2019 2021

Effic

ienc

y (%

)

Year

Efficiency @ 12 V Output

2015 Report Content: Webinars

• Power Architectures (4)– Datacenter HVDC (Stephen Oliver, Vicor)► Automotive Motor Drives (Babak Fahimi, UT Dallas)– 400 VDC Distribution (Brian Davies – Andean Power Products, David Greary- StarLine DC

Solutions, BJ Sonnenberg - Emerson)► Topology Trends (Steve Mappus, Fairchild)

• Technology and Market Forces (5)– Technology Convergence (Alix Paultre, PSD)► 3-D Packaging (Brian Narveson, PSMA)– Mission-Critical Power (Dusty Becker, Emerson)► Trends in CSC Automotive App’s (Pierric Gueguen, Yole)– Digital Power (Dave Freeman, TI)

• Components (4)– GaN New Life… (Alex Lidow, EPC)►SiC BJT (Ranbir Singh, GeneSiC)– GaN Power Supply Trends (Eric Persson, IR)►HV SiC FETs (Jeffrey Casady, Cree)

Technology Roadmap Highlights

• Ac-Dc Front End – PFC Stage: magnetic materials limiting fsw (typ. < 150 kHz)– Slower adoption of WBG devices due to low switching frequencies

• Ac-Dc External– Advances driven by demand for smaller size, higher eff. regulations

• Isolated Dc-Dc– Demand shift from Communications to Computing– Increasing use of 1/8 and 1/16 brick for 100 W power– Regulated or semi-regulated outputs dominate over unregulated

• Non-Isolated Dc-Dc– Outputs continue to drive into Sub 1-volt region– Digital control and / or interface increasing expected– Semiconductor companies taking lower end (PSiP/PSoC)

• WBG Semiconductors– Lower voltage GaN increasingly competitive; Si continues dominance

Technology Reports on 3D Power Packaging:

A Special Project of the PSMA Power Electronics Packaging Committee

Committee Co-Chairs: Ernie Parker & Brian Narveson

Phase 1 report: 3D Power Packaging, February 2014

Phase 2 report: Current Development in 3D Packaging With Focus on Embedded Substrate Technologies, March 2015

Areas of Study

Embedding of components within PCBs and inorganic substrates

High Temperature Die Attach

Thermal Management

Packaging Technologies

Interposers

Embedded Passives: Resistors, Capacitors, & Magnetics

Additive Manufacturing and Laser Fabrication

Overview of PSMA Special Project on 3D Packaging for Power

• PSMA contracted Tyndall National Institute to conduct a study of trends in 3D packaging for power in phase 1

• The technology report from this study covered 3D trends spanning:– Chip scale packages using stacking, transposers, integration, etc.– PCB mountable module type packages– High Power Modules > 1 kW

• Embedding components in substrates was a common theme across power levels and became the focus for phase 2 of the special project

• Ltec Corporation commissioned for Phase 2 Technology Report:– Research of published material from industry, government and academia– Interviews with Industry and Academic Experts– Attending trade shows and seminars

This presentation focuses on the current state of the art and emerging trends for embedding components in PCBs and organic

substrates for power electronics

What is 3D Power Packaging

• Power supply products derived from the use of the z axis• Incorporation of a variety of technologies to reduce footprint• Solutions that increase power density (W/cm3)• Manufacturing solutions that can print or construct interconnects or

circuit layers

Embedding Actives or Passives in Substrate

Shinko Electric’s MCEP® PackageSource: Shinko Electric

What is Embedded Substrate Technology

• A 3D Embedded Power Module is a “systems that use a combination of at least one controller/driver IC, at least one active component in the power train, and associated interconnect means, embedded in a single package.”

• Component embedding is “the inclusion of at least one active or passive electrical component within the top and bottom conductive layers of a substrate.”

• A substrate is defined for this study as “a planar structure having multiple conductive and insulating layers.”

Emerging Technologies: Components

• Wide band gap semiconductors:– SiC and GaN enabling higher frequency, higher

temperature operation smaller power electronics, higher efficiency, lower weight

• Embedded Components

23Source: PSMA Technology Report, Current Developments in 3D Packaging Technologies with Focus on Embedded

Substrate Technologies, March 2015

Embedded Capacitors Embedded Magnetics

Embedded Resistors

Bel Fuse Internal embedded multiple

transformer construction

Emerging Technologies: High Density / High Temperature Packaging

Cooling: Increased use of heat pipes; phase change or liquid cooling to select high power components and residual air elsewhere

24

Water board (Schweizer)

3D Packaging:Leveraging the advances from microelectronics to

power packaging

AT&S Embedded Component Packaging (ECPTM) Process Flow

3D printed housings in plastic or metal are

possible today –carbon fiber coming

Printable electronic circuits

Source: NC State Univ. – PREES Lab

Embedded Active Components

• Significant progress was made through two EU Framework Programmes, “HIDING DIES” [FP6] and “HERMES” [FP7]

– HIDING DIES developed the technology for embedding components– HERMES focused on commercialization of the technology

• TI’s MicroSIP is the 1st commercial dc-dc producedwith HERMES ‘face down approach’

– ROHM/TDK created a 2nd source using SESUB process

Cross section of "SEmiconductor embedded in SUBstrate" (SESUB)1,2

Embedded Components

Formed Passives Inserted Passives Active Devices

Component Types and Processes

Example of an embedded assembly Source: IPC International Technology Roadmap

3D Packaging Study Summary

• The digital world is going 3D to increase capability in the same footprint

• Digital 3D will greatly increase the need for power but not increase the available space to implement it

• Embedded Substrate technology is a viable path to increase power density

• Multiple substrate and semiconductor technologies are available at many power levels

• Both formed and inserted components are available from multiple suppliers

• Multiple power manufactures are shipping product utilizing embedded technology

• Less than 5% of the material in the report has been presented. Contact PSMA to find out how to get a copy.

PSMA Summary

• With its activities, PSMA– Anticipate and influence shifts in

• user requirements, • component technologies, and • design and manufacturing techniques

– Assist our industry and society globally in its pursuit of energy conservation and better utilization.

Our Mission: To integrate the resources of the power sources industry globally to more effectively and profitably serve the needs

of the power sources users, providers, and PSMA members

Thank You