Prof. Dr. Michael Möller

Electronics and Circuits

Chair of

Saarland University

Exploring Limits:

Development of Integrated

High−Performance Circuits

2

R

Saarland: "Others talk − We act"

Belgium

France

Mainz

Trier

Kaiserslautern

Saarbrücken

Industrial background: Cole & Steel (’70th)

R&D expenditure, patent applications,

Federal & European Research Cooperations

Today: Two−digit growth (FRG in whole only 1 digit) in:

170 Spin−offs since 1995

Luxembourg

(Sarrebruck)

Strasbourg

Since 1957 part of Germany

(Sarre)

One University − one allocation − one focus

Competence Cluster innovation strategy:

Saarland

1 million inhabitants (NRW 18, Bavaria 12)

1.3 % of total german population

Growth

Innovations

Networks

Manpower

Infrastructure

Clu

ster Products

Markets

416 inhabitants Km (NRW 525, Bavaria 180)

University

ResearchEducation

Economy

Startups Companies

Saar−land

Rhineland−Palatinate

Campus Saarbrücken

Universität des Saarlandes (UdS)Saarland University

Cooperative study

1948 founded

15.500 students

290 professors

800 other academics

900 non−academicstaff members

FranceLuxembourg

Natural Science and Technology at UdS

Faculties

Computer ScienceKorean Insitute of Science and Technology (KIST)

Max−Planck Institute for Software Systems

German Research Center for Artificial Intelligence

Associated Research Institutes

Max−Planck Institute for Computer Science (MPI)

Institute for New Materials (INM)

Fraunhofer Inst. f. Nondestructive Testing (IzfP)

Natural Science and Technology III

Natural Science and Technology II

Natural Science and Technology I

Mathematics

Physics

Mechatronics Engineering

Materials Science

Bioscience

Pharmacy

Chemistry

Natural Science and Technology II

Natural Science and Technology I

Mathematics

Physics

Bioscience

Pharmacy

Chemistry

Natural Science and Technology III

Mechatronics Engineering Dept.

Materials Science Dept.

Embedded Courses of Studies

Computer Science Dept.

Electronics Mechanics(Micro/Nano)

Information&System technology

Computer & Communications Technology

Mechatronics

Microsystem Technology

Micro− and Nanostructures

Faculties Departments Course of studies

Electronics Mechanics(Micro/Nano)

Information&System technology

Computer & Communications Technology

Mechatronics

Microsystem Technology

Micro− and Nanostructures

Obligatory lectures

Obligatory practicals

Optional lectures

Electronics & Circuits

Solid State Electronics (El. I)

Circuit Theory & Techniques (El. II)

RF Measurement Techniques*

Analog RF Circuit Design (El. IV)

Communication Electronics (El. III)

Course of studies

Lectures & Practicals in Electronics and Circuits

Chair of Electronics and Circuits

Analogue Circuit Design

RF Measurement Techniques

Communication Electronics

Optional practicals*

*: coming soon

Research Structure

Measurement Techniques

Assembly & Interfacing Techniques

Physical Modeling of Circuit Elements and Parasitics

Realization

Characterization

Research Focus:

Research Topics:

Circuit Concepts & Optimization, Design Methodology

Exploring Performance Limits of Integrated Analogue Circuits.

Circuit Design

Modeling

Research Area:

Development of Integrated Analogue High−Speed Circuits

Self−Contained Research Concept

Realization

Characterization

Modelling

Circuit Design

Circuit Design

Modelling Realization

Characterization

Research / working areas, topics & methods

Auto. mod. generation

Broadband modelsPhysical models

Signal quality & fidelity

VNA, diff. S−params.Spectrum analysis

BERT

Sampling scope, TDR

Building block mod’ing.

Similarity & mappingLayer peeling

Wiring parasiticsTML models

Signal propagationModel param. extract

topi

car

eaar

eam

etod

s

area

topi

c

area

topi

c

Analogue performanceTechnology evaluation

High−Speed & Low powerParasitic effects

Utilized Parasitics

Low−cost & High Perform.Organic substrates

CPW/Microstrip TML

Assembly Techniques

TML Interfaces

Design MethodologyCircuit OptimizationNew Circuit Concepts

Wire bonds, FCUnwant. & generated sig.

2000

1999

1998 50 Gb/s EAM driver MUX*

(KomNet)

1997(Photonik II)

1995

1991

2001

2002

** developed @ MICRAM Microelectronic GmbH*developed @ Ruhr University Bochum, Prof. Rein

Low power, SFI−5 compliant 43.5 Gb/s, 1:16/16:1 SerDes Module **

43.5 Gb/s SONET/SDH RZ/NRZ 16:1 MUX with 20/40 GHz Clock output **

43.5 Gb/s fully integrated SONET/SDH RZ/NRZ CDR & TIA & DEMUX **

The world’s first 60 Gb/s MUX/DEMUX cipset *

The world’s first 50 Gb/s MUX *

The world’s first 30 Gb/s MUX *

40 Gb/s fully integrated TIA & CDR&DEMUX*’ **

World’s first fully integrated 87 Gb/s CDR & DEMUX module **

Example: Development of Transmitter & Receiver

High−Speed Design Background and Evolution

(contains "digital" as well as analogue circuits)

MUX, CDR & DEMUX modules for experiments at > 100Gbit/s (MultiTeraNet) **

2004

2006

Research Activities

Ongoing

Planned

Circuit concepts for low power high−speed circuits in bipolar technology.

Figures of merit for technology selection by performance criteria.

Demonstrator circuits for future 100 Gbit/s Ethernet.

Circuit concepts for high−speed driver circuits exeeding VCEO limit.

Realtime circuit simulation by analogue parallel computing.

Automatic generation of physical models for 2n−ports from S−parameter measurements.

Automatic measurement of differential S−parameters with ordinary VNA.

Concepts and techniques for dual mode operation of linear differential circuits.

Measurement Capabilities

Measurement equipment partly located at and shared with industrial partners

All measurements can be carried out for single ended as well as differential devices.

On wafer measurements up to 100 Gb/s in clean room.

High−Speed Measurement

100 Gb/s BER testing.

100 GHz spectrum analysis.

110 GHz S− parameter measurements.

100 Gb/s pattern generation.

Test/Preselection

Functional & Parametric test on Wafer and Modules at small volumes.

50 (80) GHz Sampling scope

Even−, odd−, and conversion mode measurements (freq.&time domain).

RF−module technology

Soft Substrates for high−speed, high−density applications:

Thermal mounting for power densities up to 1 W/mm2.

Broadband substrate layout utilizing verified library elements.

Fine pitch Al, Au wire bonding.

Module and subassembly manufacturing.

PTFE/Polymer based,bandwidth greater 100 GHz,dielectric constants of 2.2 ... 10.8,arbitrarily shaped substrates,plated through holes,edge metallization,fine pitch resolution with 2 mil lines/spaces.

Technology located at MICRAM

Cooperation and Partners

Spectrum Analyzer 100 GHzVNA 110 GHz

Synthesizer, Sampling−Scope, (BERT, Wafer Prober)

Cleanroom (100/1000)

Turnkey product development

Semi−autom. Waferprober, @speed on wafer, temp −40...200°C RF module technology > 100 GHz, > 1W/mm^2

> 100 Gbit/s Measurement technology

Laserlithography (1um)Etch and Thin−film technologiesLaboratories for assembly and interfacing technologies

Physical equipment (e.g. atomic force microscope)