US Module ProductionJune 2, 2005

J. Incandela

For the US CMS Tracker Group

April 29, 2005 - J. Incandela 2

US Hybrids Inventory (approx)

  Hybrids as of 5/7/05

  FNAL IT UCSB IT

L12pu 23 - 117 -

L12pd 0 - 0 -

L12su 0 - 0 -

L12sd 0 - 0 -

L34pu 23 - 117 -

L56pu 190 - 69 -

         

R5p 5 -

R5s 2 -

R6 26 -

R7 54 -

Roughly enough to hold us until some time in the week of

June 13.

April 29, 2005 - J. Incandela 3

US Module Assembly

Weekly Cumulative  

A B F A B F % A or BL12pu 0 0 0 11 1 0 100.0%L12pd 0 0 0 0 0 0 0.00%L12su 0 0 0 0 0 0 0.00%L12sd 0 0 0 0 0 0 0.00%L34p 0 0 0 367 13 0 100.00%L56p 123 0 1 888 29 10 98.9%R5N 10 0 0 83 2 0 100.00%R5S 3 0 0 75 1 2 97.4%R6 0 0 0 90 9 0 100.00%R7 0 0 0 0 0 0 0.00%Total 136 0 1 1514 55 12 99.2%

April 29, 2005 - J. Incandela 4

US Hybrid Testing Totals

Weekly CumulativePass Fail Pass Fail % Pass

L12su 0 0 0 0 0.00%L12sd 0 0 0 0 0.00%L12pd 0 0 0 0 0.00%L34p+L12pu 0 0 660 20 97.06%L56p 49 1 1059 6 99.44%R2N 0 0 12 0 100.00%R2S 0 0 19 0 100.00%R5N 1 0 108 4 96.43%R5S 0 0 152 3 98.06%R6 11 1 115 4 96.64%R7 12 0 12 0 0.00%Total 73 2 2137 37 98.30%

April 29, 2005 - J. Incandela 5

US ARCS Testing Status

Weekly CumulativeA B F A B F % A or B

L12pu 0 0 0 12 0 0 100.00%L12pd 0 0 0 0 0 0 0.00%L12su 0 0 0 0 0 0 0.00%L12sd 0 0 0 0 0 0 0.00%L34p 0 0 0 354 2 4 98.89%L56p 127 0 0 888 2 5 99.44%R5N 0 0 0 64 1 1 98.48%R5S 3 0 0 42 0 0 100.00%R6 0 0 0 97 0 0 100.00%R7 0 0 0 0 0 0 0.00%Total 130 0 0 1457 5 10 99.32%

April 29, 2005 - J. Incandela 6

UCSB ARCS Testing Results

•822 Total Tested

•814 Grade A

•3 Grade B

•5 Grade F

•This week:

•19 of 60672 channels bad (0.031%)

•Total Production:

•286.5 of 567040 channels bad (0.051%)

•Will show this data for all US starting next week.

Total UCSB HPK Modules Tested

0100200300400500600700800900

1/3/

2005

1/17

/200

5

1/31

/200

5

2/14

/200

5

2/28

/200

5

3/14

/200

5

3/28

/200

5

4/11

/200

5

4/25

/200

5

5/9/

2005

5/23

/200

5

Grade A

Grade B

Grade F

Total

Weekly UCSB HPK Modules Tested

0102030405060708090

100

1/3

/20

05

1/1

7/2

00

5

1/3

1/2

00

5

2/1

4/2

00

5

2/2

8/2

00

5

3/1

4/2

00

5

3/2

8/2

00

5

4/1

1/2

00

5

4/2

5/2

00

5

5/9

/20

05

5/2

3/2

00

5

Grade A

Grade B

Grade F

Total

April 29, 2005 - J. Incandela 7

US LT Testing Status

Weekly CumulativePass Fail Pass Fail % Pass

L12pu 0 0 0 0 0.00%L12pd 0 0 12 0 100.00%L12su 0 0 0 0 0.00%L12sd 0 0 0 0 0.00%L34p 24 0 350 1 99.72%L56p 107 0 704 1 99.86%R5N 0 0 67 0 100.00%R5S 0 0 37 0 0.00%R6 3 0 99 0 100.00%R7 0 0 0 0 0.00%Total 134 0 1269 2 99.84%

April 29, 2005 - J. Incandela 8

Planning and rates

• All indications are that UCSB and FNAL can both now comfortably do 7 plates per 8 hour day and probably can do 8 per day at least 50% of the time.

• We are continuing to make improvements to achieve higher rates:• Streamlining some of the gantry operation (eliminating surveys on gantry

for all but one plate per day at FNAL)• Exchanging UCSB KS 8060 with an FNAL KS 8090 to reach higher

module wirebonding rates at UCSB• Both sites have been continuing to ramp up manpower

• Planning for TEC production (JI with Lenny Spiegel)• I have asked FNAL to consider making 5 TEC R7 plates for production

of 12-15 R7 modules per day starting November 2005. • Cost does not look terribly high – rough estimate is now around

130k$-200k$ for 4 months including equipment and all manpower but this needs to be refined.

• UCSB would assist with wirebond fixtures, shipping boxes, programs for testing etc.

• Will need to get such a plan formally approved and have SC support for use of US contingency

April 29, 2005 - J. Incandela 9

US Assembly Plates

Now in use In progress or to be proposed Totals

Plate Types UCSB FNAL UCSB FNAL Actual If add R7 at FNAL

TOB R-phi 7 6 2 15 15

TOB Stereo 3 4 7 7

TEC R5 R-phi 3 3 3

TEC R5 Stereo 3 3 3

TEC R6 5 5 5

TEC R7 3 5 3 8

Totals 24 10 7 36 41

April 29, 2005 - J. Incandela 10

Amtech Hybrids (D. Stuart)

• Status: • We received 5 electrical prototypes from Amtech, 3 TEC and 2 TOB. • Four of the five tested good. The fifth had a fatal bonding problem on one line. • Visual inspection of the hybrids indicates some quality issues that need to be

addressed: - • The inner row of redundant bonds on the back end of the APV chip have

been touched by the bonding wedge. This pushes them down and puts a nick in the wires. The wires pass pull tests, but this is a robustness concern. We are discussing optimal bonding parameters to avoid this.

• Inspection of the standard hybrids from HSA show that the same thing is happening to them.

• Some of the parts had stray solder splashes. This needs to be addressed with more cautious solder application and/or kapton masking.

• Schedule: • Three or four more weeks are needed for qualification:

• two weeks to finalize the new bonding parameters and one or two more weeks to assemble and inspect the remaining mechanical and electrical prototypes.

• Beginning ~July 1, we expect they can assemble 100 in the first week while D. Stuart is there for rapid inspection. If the inspection and testing of these are successful, the full rate of 200/week can begin the second week of July.