TA JetApply the theory of electrostatic strength

measurement to detect the solder joint’s open / contacted BGA pins up to 100%.

What’s the difference between TA Jet & HP TestJet?

TA Jet HP TestJet

TheoryElectrostatic

measurement.Capacitor coupling.

Signal Processing. Through SW CARD Through MUX CARD.

No. of Test Terminals.

3 2

Sensing signal ratio of contacted/open. 20~30 times， High. 10~15times， Low.

Test Frequency.2K~10K automatic

adjustable.Only one frequency at

10KHz.

Cost USD3,000- USD10,000-

MUX Card cost. No USD100/ board.

Sensor pad price. USD 35/set USD35-85/set.

Know how(I)

MUX CARD

M

(Current Pre. AMP.)

SWITCH CARD

M

(Synchronous Detector AMP.)

HP TestJet

TA Jet

Know how(II)

HP TestJet

TA Jet εElectrostatic

strength. (V/m)

Measuring the capacitance between bonding line and HP sensor

pad. (fF)

Solder joints Contacted / Open sense level.

TA Jet testing ability is over 20 times of HP Test Jet.

SMD coverage rate.

FQFP, SOJ, SOP, PLCC

HP TestJet test results : good.

TAJet test results : excellent.

BGA coverage rate.

HP Test Jet.

TA Jet.

A

A

ε

ε Coverage rate up to

100%.

Unstable to test under 100fF level.

Normal IC

BGA

Intel 845(North Bridge) coverage rate.

HP TestJet about 10%

level.

Ad

d

ε

TA Jet coverage rate up to 100%.

r

SWITCH CARD

M DSP

Intel 845(North Bridge) Coverage Rate.

Intel 845(North Bridge) coverage rate.

TA Jet

SWITCH CARD

M DSP

V

F

Contacted

BGA845

NoiseOKopen

SMD

fs

SCSI / PCI SMD Connector.

HP TestJet

TA Jet

Benefits of TA Jet. • Up to 100% BGA pins of solder joint’s Contacted/

Open inspection.• Up to 100% Intel 845 BGA pins of solder joint’s

Contacted/Open inspection.• Up to 100% SCSI / PCI SMD connector solder joint’s

Contacted/Open inspection.• Make sure where the true BGA failures are.

Parallel pins.

If circuit impedance small than 10ohms, the stimulus signal can not apply to almost a short circuit.

Logically BGA parallel pins are same circuit, we can not discriminate if one of them is open circuit.

Circuit impedance.

BGA relative components.

If the BGA relative component in O/S, missing part, wrong part fail, it may affect the test value of BGA.

Limitations of BGA Open/contacted test.